KR101004929B1 - Light emitting diode package and Light emitting diode package module having the same - Google Patents

Abstract

A light emitting diode package and a light emitting diode package module having the same are disclosed. A ceramic substrate having a cavity formed on one surface, a light emitting diode (LED) accommodated in the cavity, a ceramic substrate formed on the ceramic substrate and electrically connected to the light emitting diode, but having one end exposed to the outside. A light emitting diode package (LED package) is provided that includes a pair of electrode patterns extending along the side of the substrate. According to the present invention, the heat dissipation efficiency of the light emitting diode package can be improved, and the electrical connection reliability between the electrode pattern of the light emitting diode package and the pad of the metal substrate on which the light emitting diode package is mounted can be improved. In addition, electrical connection between the electrode pattern and the pad of the metal substrate may be implemented without being limited by the thickness of the light emitting diode package.

Light emitting diodes, packages, metal substrates, light sources

Description

Light emitting diode package and light emitting diode package module having same The light emitting diode package and light emitting diode package module having the same

The present invention relates to a light emitting diode package and a light emitting diode package module having the same.

A light emitting diode (LED) refers to a semiconductor device capable of realizing various colors of light by configuring a light emitting source through a change of a compound semiconductor material.

As light sources using light emitting diodes come out one after another, small packages, which were initially used for mobile devices, are now being used in large TVs, billboards, lights, and headlamps for automobiles.

As high power and high power light emitting diodes are developed for general lighting and automotive headlamps, packages for mounting light emitting diodes require characteristics such as high heat resistance, excellent thermal conductivity, and high reflection efficiency. Ceramics have emerged as suitable materials.

Such a ceramic-based light emitting diode package is assembled with a metal substrate having an electrical pattern to transfer heat to the external heat sink, and the metal substrate is coupled to the external heat sink by a fastening means such as a screw, and a thermal therebetween. It will be charged with grease (thermal grease).

In this case, the performance of the light emitting diode is greatly influenced by the heat transfer characteristics to the metal substrate, and heat transfer characteristics are very important because the light output increases when heat transfer is good and the lower temperature is maintained even when the same amount of current flows.

However, according to the related art, an electrode is disposed below and an insulation layer is essentially required between the light emitting diode package and the metal substrate, or a wire is required for the connection of the light emitting diode package and the circuit on the metal substrate so that connection reliability between them is improved. There was a problem of being lowered.

The present invention provides a light emitting diode package having improved heat dissipation efficiency and improved connection reliability with a pad of a metal substrate, and a light emitting diode package module having the same.

According to an aspect of the present invention, a ceramic substrate (cavity) is formed on one surface (ceramic substrate), a light emitting diode (LED, accommodated in the cavity), formed on the ceramic substrate and electrically connected to the light emitting diode A light emitting diode package (LED package) including a pair of electrode patterns extending along a side of a ceramic substrate so that one end thereof is exposed to the outside is provided.

At this time, one end of the pair of electrode patterns may extend in the other surface side direction of the ceramic substrate.

In addition, one end of the pair of electrode patterns may extend to the end of the side of the ceramic substrate.

In addition, according to another aspect of the present invention, a metal substrate coupled to the external heat sink, a light emitting diode package mounted on one side of the metal substrate, formed on one surface of the metal substrate to be adjacent to the side of the light emitting diode package And a pair of pads electrically connected to the light emitting diode package, and an insulating layer interposed between the metal substrate and the pair of pads, wherein the light emitting diode package has a cavity formed on one surface thereof and the other surface of the light emitting diode package. A ceramic substrate stacked on one surface of the metal substrate to face the substrate, a light emitting diode received in the cavity, and formed on the ceramic substrate to be electrically connected to the light emitting diode, and extend along a side of the ceramic substrate so that one end is exposed to the outside. And a pair of electrode patterns electrically connected to the pair of pads by solder, respectively. The light emitting diode package module (LED package module) is provided.

At this time, one end of the pair of electrode patterns may extend in the other surface side direction of the ceramic substrate.

In addition, one end of the pair of electrode patterns may extend to the end of the side of the ceramic substrate.

The pair of pads and one pair of electrode patterns are disposed perpendicular to each other, and the pair of electrode patterns is formed by a solder formed between the pair of one ends of the electrode patterns and the pair of pads. Each of the pads may be electrically connected.

On the other hand, it may further include an adhesive layer interposed between the ceramic substrate and the metal substrate.

In addition, the adhesive layer may be made of a conductive material.

In this case, the adhesive layer may include a plating layer formed on the other surface of the ceramic substrate and one surface of the metal substrate, and a solder layer interposed between the plating layers.

The adhesive layer may be made of a buffer material.

According to an embodiment of the present invention, the heat dissipation efficiency of the LED package can be improved, and the electrical connection reliability between the electrode pattern of the LED package and the pad of the metal substrate on which the LED package is mounted can be improved. In addition, electrical connection between the electrode pattern and the pad of the metal substrate may be implemented without being limited by the thickness of the light emitting diode package.

An embodiment of a light emitting diode package and a light emitting diode package module having the same according to the present invention will be described in detail with reference to the accompanying drawings. In the following description with reference to the accompanying drawings, the same or corresponding components are provided with the same reference numerals. And duplicate description thereof will be omitted.

In addition, formation and lamination are not only meant to be in direct physical contact between each component, but also encompass the case where other components are interposed between each component and components are in contact with each other. Use it as a concept.

1 is a cross-sectional view showing an embodiment of a light emitting diode package 100 according to an aspect of the present invention.

According to the present embodiment, as shown in FIG. 1, a ceramic substrate 110 having a cavity 112 formed on one surface thereof, and a light emitting diode (LED) accommodated in the cavity 112 are provided. And a pair of electrode patterns 130 formed on the ceramic substrate 110 and electrically connected to the light emitting diodes 120 and extending along the side of the ceramic substrate 110 so that one end thereof is exposed to the outside. A light emitting diode package (LED package) 100 is presented.

According to the present exemplary embodiment, the pair of electrode patterns 130 extend along the side surface of the ceramic substrate 110 to be exposed to the outside, thereby being combined with an external radiator to dissipate heat of the light emitting diode 120. 2, the insulating layer for preventing short circuit of the electrode pattern 130 may be omitted between the metal substrate 240 and the ceramic substrate 110. As a result, the thermal conductivity of the light emitting diode package 100 may be improved.

That is, conventionally, since the electrode pattern is formed on the lower side of the ceramic substrate, that is, the metal substrate side, and an insulation layer for preventing a short circuit of the electrode pattern by the metal substrate is essentially required, the ceramic layer is formed by this insulation layer. Although the problem of lowering the thermal conductivity from the substrate to the metal substrate has arisen, in the present embodiment, by extending the electrode pattern 130 to the side of the ceramic substrate 110, such a problem can be prevented and the heat dissipation efficiency can be improved. It is.

In addition, since the electrode pattern 130 is formed on the side of the ceramic substrate 110, the electrode pattern 130 is electrically connected to the pad (260 of FIG. 2) formed on the metal substrate (240 of FIG. 2) using solder. Therefore, the electrical connection reliability between the electrode pattern 130 and the pad 260 of FIG. 2 can be improved as compared with the case of connecting them by conventional wire bonding or the like.

Meanwhile, as the thickness of the ceramic substrate 110 is increased, heat generated from the light emitting diodes 120 may be more effectively removed. In this case, the electrode pattern 130 may be formed on the side of the ceramic substrate 110. However, the electrode pattern 130 and the pad (260 of FIG. 2) may be easily connected by using solder.

Hereinafter, each configuration will be described in more detail with reference to FIG. 1.

The ceramic substrate 110 may be formed of, for example, high temperature co-fired ceramic (HTCC), and may be formed by stacking a plurality of unit substrates. In addition, a cavity 112 in which the light emitting diodes 120 are accommodated and mounted is formed on one surface of the ceramic substrate 110.

The light emitting diode 120 is accommodated in the above-mentioned cavity 112 and mounted. Here, the light emitting diode 120 is a semiconductor device capable of realizing various colors of light by forming a light emitting source by changing a compound semiconductor material such as GaAs, AlGaAs, GaN, InGaInP, etc. An electrode is formed to be electrically connected to the pair of electrode patterns 130 including the anode pattern and the cathode pattern, respectively.

As shown in FIG. 1, the electrode pattern 130 is formed on the ceramic substrate 110 and electrically connected to the light emitting diodes 120, and extends along the side of the ceramic substrate 110 so that one end thereof is exposed to the outside. do.

That is, the pair of electrode patterns 130 is composed of an anode pattern and a cathode pattern respectively formed on the ceramic substrate 110. As illustrated in FIG. 1, an anode pattern of the electrode patterns 130 is electrically connected to an anode formed on a bottom surface of the light emitting diode 120, and a cathode pattern of the electrode patterns 130 is a light emitting diode ( The cathode of 120 is electrically connected through a wire 190.

In addition, as illustrated in FIG. 1, one end of the electrode pattern 130 extends along the side surface of the ceramic substrate 110 to be exposed to the outside. That is, one end of the electrode pattern 130 formed in the ceramic substrate 110 and electrically connected to the light emitting diode 120 is formed on the side of the ceramic substrate 110 to be exposed to the outside.

As such, the electrode pattern 130 is formed to extend toward the side of the ceramic substrate 110, so that the ceramic substrate 110 has a wider contact area with the metal substrate 240 (see FIG. 2) for heat radiation. In addition, the insulating layer for preventing the short circuit of the electrode pattern 130 (265 of FIG. 2) may be omitted between the metal substrate (240 of FIG. 2) and the ceramic substrate 110. Therefore, the thermal conductivity from the ceramic substrate 110 to the metal substrate 240 (in FIG. 2) may be further improved, and as a result, the heat dissipation efficiency of the light emitting diode package 100 may be improved.

In addition, since the electrode pattern 130 and the pad (260 in FIG. 2) formed on the metal substrate 240 (in FIG. 2) can be electrically connected using solder, the electrode pattern 130 and the pad (260 in FIG. 2) can be electrically connected. ) Can improve electrical connection reliability, and even if the thickness of the ceramic substrate 110 is increased, the electrode pattern 130 and the pad (260 of FIG. 2) can still be effectively connected using solder. .

In this case, one end of the pair of electrode patterns 130 extends in the other surface side direction of the ceramic substrate 110 as shown in FIG. 1. That is, as one end of the electrode pattern 130 exposed to the outside extends from one surface side of the ceramic substrate 110 to the other surface side, one end of the electrode pattern 130 and the pad of the metal substrate 240 (see FIG. 2). The distance to 260 of FIG. 2 is close.

Therefore, when the ceramic substrate 110 is laminated on the metal substrate 240 (see FIG. 2) such that the other surface of the ceramic substrate 110 faces the metal substrate 240 (see FIG. 2), the electrode pattern 130 and the pad (FIG. 260 may be more easily electrically connected using solder, and the connection reliability of the electrode pattern 130 and the pad 260 of FIG. 2 may be improved.

In this case, as shown in FIG. 1, the pair of electrode patterns 130 are formed to extend to the end portions of the side surfaces of the ceramic substrate 110, thereby forming the electrode patterns 130 and the pads (260 of FIG. 2). Ease of electrical connection and connection reliability can be further improved.

Meanwhile, after the light emitting diode 120 is mounted in the cavity 112 of the ceramic substrate 110, the light emitting diode 120 may be molded using the phosphor 195.

Next, the light emitting diode package module 200 according to another aspect of the present invention will be described with reference to FIGS. 2 to 5.

2 is a cross-sectional view showing an embodiment of a light emitting diode package module 200 according to another aspect of the present invention. 3 to 5 are cross-sectional views showing a modified embodiment of the LED package module 200 according to another aspect of the present invention.

According to the present embodiment, as shown in FIG. 2, the metal substrate 240 coupled to the external radiator, the light emitting diode package 280 mounted on one surface of the metal substrate 240, and the light emitting diode package 280. A pair of pads 260 formed on one surface of the metal substrate 240 to be adjacent to side surfaces of the metal substrate 240, and electrically connected to the light emitting diode package 280, and the metal substrate 240 and a pair of pads 260. Including an insulating layer 265 is interposed between, the light emitting diode package 280, the cavity 212 is formed on one surface, the other surface on the one surface of the metal substrate 240 to face the metal substrate 240 The ceramic substrate 210 stacked on the ceramic substrate 210, the light emitting diodes 220 accommodated in the cavity 212, and the ceramic substrate 210 are electrically connected to the light emitting diodes 220 and have one end exposed to the outside. Extend along the side of 210, a pair of tiles by solder 240 260 and electrically to the LED package module comprising a pair of electrode patterns 230 are connected (LED package module, 200) is presented.

According to the present exemplary embodiment, the pair of electrode patterns 230 extend along the side surface of the ceramic substrate 210 to be exposed to the outside, so that the pair of electrode patterns 230 may be combined with an external radiator to emit heat of the light emitting diode 220. Since the insulating layer for preventing short circuit of the electrode pattern 230 can be omitted between the metal substrate 240 and the ceramic substrate 210, the thermal conductivity from the ceramic substrate 210 to the metal substrate 240 can be improved. As a result, heat dissipation efficiency of the light emitting diode package 280 may be improved.

In addition, since the electrode pattern 230 is formed on the side of the ceramic substrate 210, the electrode pattern 230 and the pad 260 formed on the metal substrate 240 may be electrically connected using the solder 245. The electrical connection reliability between the electrode pattern 230 and the pad 260 may be improved.

Meanwhile, as shown in FIG. 3, even when the thickness of the ceramic substrate 210 is increased in order to more effectively remove heat generated from the light emitting diodes 220, the electrode pattern 230 is formed on the side surface of the ceramic substrate 210. In this case, the electrode pattern 230 and the pad 260 may be electrically connected to each other by using the solder 245.

Hereinafter, each configuration will be described in more detail with reference to FIGS. 2 to 5.

In the present embodiment, the configuration and function of the light emitting diode package 280, the ceramic substrate 210, the cavity 212, the light emitting diode 220, the electrode pattern 230, the wire 290, and the phosphor 295 are described above. It is the same as or similar to one embodiment, and as described above in the above-described embodiment, the metal substrate 240, the insulating layer 265, the pad 260, the solder resist 270, and the adhesive layer will be described below. The 250, the plating layer 252, and the solder layer 254 will be described.

In the metal substrate 240, a light emitting diode package 280 is mounted on one surface thereof, and an external heat sink is coupled to the other surface, thereby transferring heat generated from the light emitting diode 220 to the external heat sink.

The pair of pads 260 are formed on one surface of the metal substrate 240 to be adjacent to the side surface of the light emitting diode package 280 and electrically connected to the light emitting diode package 280.

That is, the pair of pads 260 may be formed in a region around a region where the ceramic substrate 210 is stacked on one surface of the metal substrate 240, and may be formed adjacent to the side surface of the ceramic substrate 210. As such, a pair of pads 260 are formed in the peripheral region of the region where the ceramic substrate 210 is stacked on one surface of the metal substrate 240, thereby forming an electrode pattern extending to the side of the ceramic substrate 210. The distance to the 230 is nearer, and thus can be easily connected by the solder 245.

At this time, the insulating layer 265 is interposed between the metal substrate 240 and the pair of pads 260 to prevent a short circuit of the pair of pads 260, and thus, the pair of pads ( A pair of electrode patterns 230 electrically connected to each other by the 260 and the solder 245 may also prevent electrical short circuits.

In addition, a solder resist 270 is formed on the pair of pads 260, and an opening for soldering with the electrode pattern 230 is formed.

Meanwhile, as illustrated in FIG. 2, one pair of pads 260 and one pair of electrode patterns 230 are disposed perpendicular to each other, and the pair of electrode patterns 230 is a pair of electrode patterns. 230 is electrically connected to the pair of pads 260 by the solder 245 formed between one end and the pair of pads 260.

That is, the pair of pads 260 are formed on the insulating layer 265 on one surface of the metal substrate 240, and the pair of electrode patterns 230 are formed on the side of the ceramic substrate 210 to form the pads 260. Since the electrode pattern 230 is perpendicular to each other and partitions a predetermined space, the pad 260 is more easily injected by injecting the solder 245 into the space obstructed by the pad 260 and the electrode pattern 230. ) And the electrical connection between the electrode pattern 230 and the electrical connection reliability can be improved.

In addition, the light emitting diode package 280 may be mounted on the metal substrate 240 by interposing the adhesive layer 250 between the ceramic substrate 210 and the metal substrate 240, and the adhesive layer 250 may be soldered. In the case of a conductive material such as a paste or a plating layer, thermal conductivity between the ceramic substrate 210 and the metal substrate 240 may be further improved.

That is, as shown in FIG. 3, the adhesive layer 250 is interposed between the plating layer 252 and the plating layer 252, which are formed on the other surface of the ceramic substrate 210 and one surface of the metal substrate 240, respectively. It may be made of a solder layer 254 to be bonded to each other. After the plating layer 252 is formed on the other surface of the ceramic substrate 210 and one surface of the metal substrate 240, respectively, the solder layer is applied to form a solder layer 254 to bond the plating layer 252.

As such, since the adhesive layer 250 is formed of the conductive layer plating layer 252 and the solder layer 254, the heat of the light emitting diode 220 transferred to the ceramic substrate 210 is more effectively transmitted to the metal substrate 240. Can be.

In addition, as shown in FIG. 4, the adhesive layer 250 may be made of silicone or the like, and may be made of a paste of a buffer material having elasticity. In this case, when a vibration occurs between the ceramic substrate 210 and the metal substrate 240 by using the LED package module 200 is used in a head lamp of an automobile, the adhesive layer 250 has a buffering action to the light emitting diode 220 ) And the ceramic substrate 210 can be prevented from being damaged.

On the other hand, the insulating layer 265 described above, as shown in Figure 5, may be formed on the entire surface of the metal substrate 240, this case is of course included in the scope of the present invention. In this case, a plating layer of a conductive material may be used as the adhesive layer 250.

As mentioned above, although an embodiment of the present invention has been described, those of ordinary skill in the art may add, change, delete or add components within the scope not departing from the spirit of the present invention described in the claims. The present invention may be modified and changed in various ways, etc., which will also be included within the scope of the present invention.

1 is a cross-sectional view showing an embodiment of a light emitting diode package according to an aspect of the present invention.

Figure 2 is a cross-sectional view showing an embodiment of a light emitting diode package module according to another aspect of the present invention.

3 to 5 are cross-sectional views showing a modified embodiment of a light emitting diode package module according to another aspect of the present invention.

<Explanation of symbols for the main parts of the drawings>

100: light emitting diode package (LED package)

110: ceramic substrate

112: cavity

120: light emitting diode (LED)

130: electrode pattern

190: wire

195 phosphor

Claims (12)

A ceramic substrate having a cavity formed on one surface thereof; A light emitting diode (LED) accommodated in the cavity; A pair of electrode patterns formed on the ceramic substrate and electrically connected to the light emitting diodes, the pair of electrode patterns extending along side surfaces of the ceramic substrate so that one end thereof is exposed to the outside; One end of the pair of electrode patterns extends to the side of the ceramic substrate and is not formed on the bottom surface of the ceramic substrate. delete delete A metal substrate coupled to the external heat sink; A light emitting diode package mounted on one surface of the metal substrate; A pair of pads formed on one surface of the metal substrate to be adjacent to side surfaces of the light emitting diode package and electrically connected to the light emitting diode package; And Including an insulating layer interposed between the metal substrate and the pair of pads, The light emitting diode package, A cavity formed on one surface thereof, the ceramic substrate stacked on one surface of the metal substrate such that the other surface thereof faces the metal substrate; A light emitting diode accommodated in the cavity; And A pair formed on the ceramic substrate and electrically connected to the light emitting diodes, each end of which extends along a side of the ceramic substrate to be exposed to the outside, and is electrically connected to the pair of pads by solder, respectively; A light emitting diode package module comprising an electrode pattern of the LED package module. The method of claim 4, wherein One end of the pair of electrode patterns, the light emitting diode package module, characterized in that extending in the direction of the other surface side of the ceramic substrate. The method of claim 5, One end of the pair of electrode patterns, the light emitting diode package module, characterized in that extending to the end of the side of the ceramic substrate. The method of claim 4, wherein The pair of pads and one end of the pair of electrode patterns are disposed perpendicular to each other, And the pair of electrode patterns are electrically connected to the pair of pads by solder formed between one end of the pair of electrode patterns and the pair of pads, respectively. The method of claim 4, wherein The light emitting diode package module further comprising an adhesive layer interposed between the ceramic substrate and the metal substrate. The method of claim 8, The adhesive layer is a light emitting diode package module, characterized in that made of a conductive material. 10. The method of claim 9, The adhesive layer, A plating layer formed on the other surface of the ceramic substrate and one surface of the metal substrate, respectively; And A light emitting diode package module comprising a solder layer interposed between the plating layers. The method of claim 8, The adhesive layer is a light emitting diode package module, characterized in that made of a buffer material. A ceramic substrate having a cavity formed on one surface thereof; A light emitting diode (LED) accommodated in the cavity; A pair of electrode patterns formed on the ceramic substrate and electrically connected to the light emitting diodes, the pair of electrode patterns extending along side surfaces of the ceramic substrate so that one end thereof is exposed to the outside; And A solder formed to contact a portion of the pair of electrode patterns formed on a side of the ceramic substrate; Including, Light emitting diode package module characterized in that the current is applied through the solder.

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