JP2015503841A5 - - Google Patents

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Publication number
JP2015503841A5
JP2015503841A5 JP2014548941A JP2014548941A JP2015503841A5 JP 2015503841 A5 JP2015503841 A5 JP 2015503841A5 JP 2014548941 A JP2014548941 A JP 2014548941A JP 2014548941 A JP2014548941 A JP 2014548941A JP 2015503841 A5 JP2015503841 A5 JP 2015503841A5
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JP
Japan
Prior art keywords
substrate
hydrogen
filaments
chamber
gas
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JP2014548941A
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English (en)
Japanese (ja)
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JP2015503841A (ja
JP6181075B2 (ja
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Priority claimed from US13/723,409 external-priority patent/US20130160794A1/en
Publication of JP2015503841A publication Critical patent/JP2015503841A/ja
Publication of JP2015503841A5 publication Critical patent/JP2015503841A5/ja
Application granted granted Critical
Publication of JP6181075B2 publication Critical patent/JP6181075B2/ja
Expired - Fee Related legal-status Critical Current
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JP2014548941A 2011-12-23 2012-12-21 原子水素を用いて基板表面を洗浄するための方法及び装置 Expired - Fee Related JP6181075B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161579830P 2011-12-23 2011-12-23
US61/579,830 2011-12-23
US13/723,409 2012-12-21
US13/723,409 US20130160794A1 (en) 2011-12-23 2012-12-21 Methods and apparatus for cleaning substrate surfaces with atomic hydrogen
PCT/US2012/071202 WO2013096748A1 (en) 2011-12-23 2012-12-21 Methods and apparatus for cleaning substrate surfaces with atomic hydrogen

Publications (3)

Publication Number Publication Date
JP2015503841A JP2015503841A (ja) 2015-02-02
JP2015503841A5 true JP2015503841A5 (https=) 2016-02-12
JP6181075B2 JP6181075B2 (ja) 2017-08-16

Family

ID=48653348

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014548941A Expired - Fee Related JP6181075B2 (ja) 2011-12-23 2012-12-21 原子水素を用いて基板表面を洗浄するための方法及び装置

Country Status (6)

Country Link
US (2) US20130160794A1 (https=)
JP (1) JP6181075B2 (https=)
KR (1) KR20140107580A (https=)
CN (1) CN104025264B (https=)
SG (2) SG10201605000PA (https=)
WO (1) WO2013096748A1 (https=)

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US20120312326A1 (en) * 2011-06-10 2012-12-13 Applied Materials, Inc. Methods for cleaning a surface of a substrate using a hot wire chemical vapor deposition (hwcvd) chamber
US9416450B2 (en) * 2012-10-24 2016-08-16 Applied Materials, Inc. Showerhead designs of a hot wire chemical vapor deposition (HWCVD) chamber
WO2014149962A1 (en) 2013-03-14 2014-09-25 Applied Materials, Inc. Apparatus for coupling a hot wire source to a process chamber
JP6379184B2 (ja) 2013-09-25 2018-08-22 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 基板をボンディングする装置および方法
CN106688080A (zh) * 2014-09-08 2017-05-17 三菱电机株式会社 半导体退火装置
JP6690915B2 (ja) 2014-10-06 2020-04-28 ティーイーエル マニュファクチュアリング アンド エンジニアリング オブ アメリカ，インコーポレイテッド 極低温流体混合物で基板を処理するシステムおよび方法
US10625280B2 (en) 2014-10-06 2020-04-21 Tel Fsi, Inc. Apparatus for spraying cryogenic fluids
US10014191B2 (en) 2014-10-06 2018-07-03 Tel Fsi, Inc. Systems and methods for treating substrates with cryogenic fluid mixtures
US20160138161A1 (en) * 2014-11-19 2016-05-19 Applied Materials, Inc. Radical assisted cure of dielectric films
CN104865700B (zh) * 2015-04-29 2017-07-14 中国科学院长春光学精密机械与物理研究所 光学元件表面碳污染的ArH清洗方法
US9673042B2 (en) 2015-09-01 2017-06-06 Applied Materials, Inc. Methods and apparatus for in-situ cleaning of copper surfaces and deposition and removal of self-assembled monolayers
CN107026100A (zh) * 2016-02-01 2017-08-08 中芯国际集成电路制造(上海)有限公司 半导体制造设备以及制造方法
US10116255B2 (en) 2016-06-22 2018-10-30 Solar Maid Of Northern Arizona Llc Cleaning system for solar panels
US10513778B2 (en) 2017-09-22 2019-12-24 Applied Materials, Inc. Native or uncontrolled oxide reduction by HWCVD H* using specific metal chamber liner
US11469097B2 (en) 2018-04-09 2022-10-11 Applied Materials, Inc. Carbon hard masks for patterning applications and methods related thereto
US11430661B2 (en) * 2018-12-28 2022-08-30 Applied Materials, Inc. Methods and apparatus for enhancing selectivity of titanium and titanium silicides during chemical vapor deposition
CN114220721B (zh) * 2021-12-14 2025-02-11 深圳市荣者光电科技发展有限公司 一种GaAs光电阴极原子级洁净度的获得方法

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