JP2015501594A5 - - Google Patents

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Publication number
JP2015501594A5
JP2015501594A5 JP2014537801A JP2014537801A JP2015501594A5 JP 2015501594 A5 JP2015501594 A5 JP 2015501594A5 JP 2014537801 A JP2014537801 A JP 2014537801A JP 2014537801 A JP2014537801 A JP 2014537801A JP 2015501594 A5 JP2015501594 A5 JP 2015501594A5
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JP
Japan
Prior art keywords
membrane
cell
substrate
hole
stress layer
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Application number
JP2014537801A
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English (en)
Japanese (ja)
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JP6210992B2 (ja
JP2015501594A (ja
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Priority claimed from PCT/IB2012/055919 external-priority patent/WO2013061298A2/en
Publication of JP2015501594A publication Critical patent/JP2015501594A/ja
Publication of JP2015501594A5 publication Critical patent/JP2015501594A5/ja
Application granted granted Critical
Publication of JP6210992B2 publication Critical patent/JP6210992B2/ja
Active legal-status Critical Current
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JP2014537801A 2011-10-28 2012-10-26 応力層を持つ事前圧壊容量マイクロマシン・トランスデューサセル Active JP6210992B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161552482P 2011-10-28 2011-10-28
US61/552,482 2011-10-28
PCT/IB2012/055919 WO2013061298A2 (en) 2011-10-28 2012-10-26 Pre-collapsed capacitive micro-machined transducer cell with stress layer

Publications (3)

Publication Number Publication Date
JP2015501594A JP2015501594A (ja) 2015-01-15
JP2015501594A5 true JP2015501594A5 (https=) 2015-11-26
JP6210992B2 JP6210992B2 (ja) 2017-10-11

Family

ID=47505271

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014537801A Active JP6210992B2 (ja) 2011-10-28 2012-10-26 応力層を持つ事前圧壊容量マイクロマシン・トランスデューサセル

Country Status (8)

Country Link
US (1) US9534949B2 (https=)
EP (1) EP2771132B1 (https=)
JP (1) JP6210992B2 (https=)
CN (1) CN103917304B (https=)
BR (1) BR112014009659A2 (https=)
MX (1) MX347686B (https=)
RU (1) RU2603518C2 (https=)
WO (1) WO2013061298A2 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IN2014CN04975A (https=) 2011-12-20 2015-09-18 Koninkl Philips Nv
CN105263851B (zh) 2013-05-31 2017-10-13 罗伯特·博世有限公司 被限位的膜
DE102013223695B4 (de) * 2013-11-20 2016-09-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum herstellen eines kapazitiven ultraschallwandlers und anordnung einer mehrzahl von kapazitiven ultraschallwandlern
EP3110628B1 (en) 2014-02-28 2019-07-03 The Regents of the University of California Variable thickness diaphragm for a wideband robust piezoelectric micromachined ultrasonic transducer (pmut)
WO2016083273A1 (en) * 2014-11-25 2016-06-02 Koninklijke Philips N.V. Ultrasound system and method
CN105792084B (zh) * 2016-04-26 2020-02-21 瑞声声学科技(深圳)有限公司 Mems麦克风及其制造方法
CN110325293B (zh) * 2016-12-22 2021-06-22 皇家飞利浦有限公司 电容式射频微机电开关的系统和操作方法
RU2672099C2 (ru) * 2016-12-23 2018-11-12 Евгений Анатольевич Обжиров Электрическая машина емкостная (эме) с ячейками внутреннего сжатия
JP6970935B2 (ja) * 2017-06-21 2021-11-24 パナソニックIpマネジメント株式会社 物理量センサ
DE102019203829B4 (de) * 2019-03-20 2020-12-31 Vitesco Technologies GmbH Verfahren zum Herstellen einer Fluidsensorvorrichtung und Fluidsensorvorrichtung
US11904357B2 (en) * 2020-05-22 2024-02-20 GE Precision Healthcare LLC Micromachined ultrasonic transducers with non-coplanar actuation and displacement

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5619476A (en) * 1994-10-21 1997-04-08 The Board Of Trustees Of The Leland Stanford Jr. Univ. Electrostatic ultrasonic transducer
DE69932587D1 (de) 1999-02-09 2006-09-14 St Microelectronics Srl Verfahren zur Herstellung von integrierten Bauelementen mit elektromechanischen Mikrostrukturen, ohne Restspannung
US20030022412A1 (en) 2001-07-25 2003-01-30 Motorola, Inc. Monolithic semiconductor-piezoelectric device structures and electroacoustic charge transport devices
US7489593B2 (en) 2004-11-30 2009-02-10 Vermon Electrostatic membranes for sensors, ultrasonic transducers incorporating such membranes, and manufacturing methods therefor
US8327521B2 (en) * 2007-09-17 2012-12-11 Koninklijke Philips Electronics N.V. Method for production and using a capacitive micro-machined ultrasonic transducer
US10092270B2 (en) 2007-09-17 2018-10-09 Koninklijke Philips Electronics N.V. Pre-collapsed CMUT with mechanical collapse retention
WO2009041675A1 (en) * 2007-09-25 2009-04-02 Canon Kabushiki Kaisha Electrostatic transducer and manufacturing method therefor
US7745248B2 (en) 2007-10-18 2010-06-29 The Board Of Trustees Of The Leland Stanford Junior University Fabrication of capacitive micromachined ultrasonic transducers by local oxidation
US8787116B2 (en) * 2007-12-14 2014-07-22 Koninklijke Philips N.V. Collapsed mode operable cMUT including contoured substrate
EP2145696A1 (en) * 2008-07-15 2010-01-20 UAB Minatech Capacitive micromachined ultrasonic transducer and its fabrication method
JP2010061976A (ja) * 2008-09-03 2010-03-18 Toshiba Corp スイッチ及びesd保護素子
US9132693B2 (en) * 2008-09-16 2015-09-15 Koninklijke Philps N.V. Capacitive micromachine ultrasound transducer
US8402831B2 (en) * 2009-03-05 2013-03-26 The Board Of Trustees Of The Leland Standford Junior University Monolithic integrated CMUTs fabricated by low-temperature wafer bonding
BR112014009698A2 (pt) * 2011-10-28 2017-05-09 Koninklijke Philips Nv célula transdutora micromanufaturada capacitiva que sofreu colapso previamente e método de fabricação da mesma
IN2014CN03656A (https=) * 2011-11-17 2015-10-16 Koninkl Philips Nv
IN2014CN04975A (https=) * 2011-12-20 2015-09-18 Koninkl Philips Nv

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