JP2015501594A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2015501594A5 JP2015501594A5 JP2014537801A JP2014537801A JP2015501594A5 JP 2015501594 A5 JP2015501594 A5 JP 2015501594A5 JP 2014537801 A JP2014537801 A JP 2014537801A JP 2014537801 A JP2014537801 A JP 2014537801A JP 2015501594 A5 JP2015501594 A5 JP 2015501594A5
- Authority
- JP
- Japan
- Prior art keywords
- membrane
- cell
- substrate
- hole
- stress layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012528 membrane Substances 0.000 claims 26
- 239000000758 substrate Substances 0.000 claims 10
- 238000005452 bending Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 claims 1
- VNTLIPZTSJSULJ-UHFFFAOYSA-N chromium molybdenum Chemical compound [Cr].[Mo] VNTLIPZTSJSULJ-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910001092 metal group alloy Inorganic materials 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161552482P | 2011-10-28 | 2011-10-28 | |
| US61/552,482 | 2011-10-28 | ||
| PCT/IB2012/055919 WO2013061298A2 (en) | 2011-10-28 | 2012-10-26 | Pre-collapsed capacitive micro-machined transducer cell with stress layer |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015501594A JP2015501594A (ja) | 2015-01-15 |
| JP2015501594A5 true JP2015501594A5 (https=) | 2015-11-26 |
| JP6210992B2 JP6210992B2 (ja) | 2017-10-11 |
Family
ID=47505271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014537801A Active JP6210992B2 (ja) | 2011-10-28 | 2012-10-26 | 応力層を持つ事前圧壊容量マイクロマシン・トランスデューサセル |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9534949B2 (https=) |
| EP (1) | EP2771132B1 (https=) |
| JP (1) | JP6210992B2 (https=) |
| CN (1) | CN103917304B (https=) |
| BR (1) | BR112014009659A2 (https=) |
| MX (1) | MX347686B (https=) |
| RU (1) | RU2603518C2 (https=) |
| WO (1) | WO2013061298A2 (https=) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6069798B2 (ja) | 2011-12-20 | 2017-02-01 | コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． | 超音波トランスデューサデバイス及びこれを製造する方法 |
| US9624091B2 (en) | 2013-05-31 | 2017-04-18 | Robert Bosch Gmbh | Trapped membrane |
| DE102013223695B4 (de) * | 2013-11-20 | 2016-09-22 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum herstellen eines kapazitiven ultraschallwandlers und anordnung einer mehrzahl von kapazitiven ultraschallwandlern |
| EP3110628B1 (en) * | 2014-02-28 | 2019-07-03 | The Regents of the University of California | Variable thickness diaphragm for a wideband robust piezoelectric micromachined ultrasonic transducer (pmut) |
| WO2016083273A1 (en) * | 2014-11-25 | 2016-06-02 | Koninklijke Philips N.V. | Ultrasound system and method |
| CN105792084B (zh) * | 2016-04-26 | 2020-02-21 | 瑞声声学科技(深圳)有限公司 | Mems麦克风及其制造方法 |
| CN110325293B (zh) * | 2016-12-22 | 2021-06-22 | 皇家飞利浦有限公司 | 电容式射频微机电开关的系统和操作方法 |
| RU2672099C2 (ru) * | 2016-12-23 | 2018-11-12 | Евгений Анатольевич Обжиров | Электрическая машина емкостная (эме) с ячейками внутреннего сжатия |
| CN110662949B (zh) * | 2017-06-21 | 2021-06-18 | 松下知识产权经营株式会社 | 物理量传感器 |
| DE102019203829B4 (de) * | 2019-03-20 | 2020-12-31 | Vitesco Technologies GmbH | Verfahren zum Herstellen einer Fluidsensorvorrichtung und Fluidsensorvorrichtung |
| US11904357B2 (en) * | 2020-05-22 | 2024-02-20 | GE Precision Healthcare LLC | Micromachined ultrasonic transducers with non-coplanar actuation and displacement |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5619476A (en) * | 1994-10-21 | 1997-04-08 | The Board Of Trustees Of The Leland Stanford Jr. Univ. | Electrostatic ultrasonic transducer |
| EP1028466B1 (en) | 1999-02-09 | 2006-08-02 | STMicroelectronics S.r.l. | Method for manufacturing integrated devices including electromechanical microstructures, without residual stress |
| US20030022412A1 (en) | 2001-07-25 | 2003-01-30 | Motorola, Inc. | Monolithic semiconductor-piezoelectric device structures and electroacoustic charge transport devices |
| US7489593B2 (en) | 2004-11-30 | 2009-02-10 | Vermon | Electrostatic membranes for sensors, ultrasonic transducers incorporating such membranes, and manufacturing methods therefor |
| US10092270B2 (en) * | 2007-09-17 | 2018-10-09 | Koninklijke Philips Electronics N.V. | Pre-collapsed CMUT with mechanical collapse retention |
| CN101969856B (zh) * | 2007-09-17 | 2013-06-05 | 皇家飞利浦电子股份有限公司 | 预塌陷的电容微机械超声传感器的制造及其应用 |
| WO2009041675A1 (en) * | 2007-09-25 | 2009-04-02 | Canon Kabushiki Kaisha | Electrostatic transducer and manufacturing method therefor |
| US7745248B2 (en) | 2007-10-18 | 2010-06-29 | The Board Of Trustees Of The Leland Stanford Junior University | Fabrication of capacitive micromachined ultrasonic transducers by local oxidation |
| CN101896288B (zh) * | 2007-12-14 | 2013-03-27 | 皇家飞利浦电子股份有限公司 | 包括经成型衬底的可以塌陷模式工作的cmut |
| EP2145696A1 (en) * | 2008-07-15 | 2010-01-20 | UAB Minatech | Capacitive micromachined ultrasonic transducer and its fabrication method |
| JP2010061976A (ja) * | 2008-09-03 | 2010-03-18 | Toshiba Corp | スイッチ及びｅｓｄ保護素子 |
| WO2010032156A2 (en) * | 2008-09-16 | 2010-03-25 | Koninklijke Philips Electronics N.V. | Capacitive micromachined ultrasound transducer |
| US8402831B2 (en) * | 2009-03-05 | 2013-03-26 | The Board Of Trustees Of The Leland Standford Junior University | Monolithic integrated CMUTs fabricated by low-temperature wafer bonding |
| MX343897B (es) * | 2011-10-28 | 2016-11-28 | Koninklijke Philips Nv | Celda de transductor micro-mecanizado capacitivo pre-colapsado con enchufe. |
| CN103958079B (zh) * | 2011-11-17 | 2016-08-24 | 皇家飞利浦有限公司 | 具有环形塌陷区域的预塌陷电容式微机械换能器元件 |
| JP6069798B2 (ja) * | 2011-12-20 | 2017-02-01 | コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． | 超音波トランスデューサデバイス及びこれを製造する方法 |
-
2012
- 2012-10-26 EP EP12810422.1A patent/EP2771132B1/en active Active
- 2012-10-26 JP JP2014537801A patent/JP6210992B2/ja active Active
- 2012-10-26 US US14/349,077 patent/US9534949B2/en active Active
- 2012-10-26 CN CN201280053001.1A patent/CN103917304B/zh active Active
- 2012-10-26 WO PCT/IB2012/055919 patent/WO2013061298A2/en not_active Ceased
- 2012-10-26 RU RU2014121392/28A patent/RU2603518C2/ru not_active IP Right Cessation
- 2012-10-26 BR BR112014009659A patent/BR112014009659A2/pt not_active Application Discontinuation
- 2012-10-26 MX MX2014004910A patent/MX347686B/es active IP Right Grant
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2015501594A5 (https=) | ||
| USD1035231S1 (en) | Shoe | |
| JP2015504620A5 (https=) | ||
| USD771066S1 (en) | Display device with graphical user interface for a recent transactions flyout | |
| USD737929S1 (en) | Handshower | |
| USD637298S1 (en) | Packaging for pads for an automated external defibrillator | |
| WO2011160985A3 (en) | Micro-electro-mechanical system | |
| RU2014121392A (ru) | Предварительно сжатая ячейка емкостного микрообработанного преобразователя с напряженным слоем | |
| WO2012021821A3 (en) | Cutting elements including nanoparticles in at least one portion thereof, earth-boring tools including such cutting elements, and related methods | |
| EP2881182A3 (en) | Capacitive micromachined ultrasonic transducer and method of fabricating the same | |
| JP2017534370A5 (https=) | ||
| WO2009142982A3 (en) | Metal gate structure and method of manufacturing same | |
| WO2008155783A1 (en) | Method for production of safety /rupture discs having pre -calculated breaking threshold | |
| EP2731133A3 (en) | Interconnection structure and fabrication thereof | |
| WO2013061204A3 (en) | Pre-collapsed capacitive micro-machined transducer cell with plug | |
| WO2012100361A3 (en) | Method for manufacturing a sensor chip comprising a device for testing it | |
| WO2010080820A3 (en) | Microphone and orientation sensor assembly | |
| GB2505825A (en) | Micro-electro-mechanical system (MEMS) and related actuator bumps, methods of manufacture and design structures | |
| EP2498075A3 (en) | Semiconductor device, strain gauge, pressure sensor, and method of forming semiconductor device | |
| JP2012096316A5 (https=) | ||
| WO2009037884A1 (ja) | スパークプラグ | |
| JP2021515887A5 (https=) | ||
| WO2012020930A3 (ko) | 정전용량형 압력센서 및 그의 제조방법 | |
| EP2476644A3 (en) | Method of making a MEMS device | |
| WO2013095692A3 (en) | Electrical fuse and method of making the same |