CN103917304B - 具有应力层的预塌陷电容式微加工换能器单元 - Google Patents

具有应力层的预塌陷电容式微加工换能器单元 Download PDF

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Publication number
CN103917304B
CN103917304B CN201280053001.1A CN201280053001A CN103917304B CN 103917304 B CN103917304 B CN 103917304B CN 201280053001 A CN201280053001 A CN 201280053001A CN 103917304 B CN103917304 B CN 103917304B
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China
Prior art keywords
film
membrane
unit
substrate
stressor layers
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CN201280053001.1A
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English (en)
Chinese (zh)
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CN103917304A (zh
Inventor
P·迪克森
R·德克尔
V·A·亨内肯
A·莱韦斯泰因
B·马赛利斯
J·D·弗雷泽
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Koninklijke Philips NV
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Koninklijke Philips Electronics NV
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H9/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means
    • G01H9/008—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means by using ultrasonic waves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Measuring Fluid Pressure (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
CN201280053001.1A 2011-10-28 2012-10-26 具有应力层的预塌陷电容式微加工换能器单元 Active CN103917304B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161552482P 2011-10-28 2011-10-28
US61/552,482 2011-10-28
PCT/IB2012/055919 WO2013061298A2 (en) 2011-10-28 2012-10-26 Pre-collapsed capacitive micro-machined transducer cell with stress layer

Publications (2)

Publication Number Publication Date
CN103917304A CN103917304A (zh) 2014-07-09
CN103917304B true CN103917304B (zh) 2016-08-17

Family

ID=47505271

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280053001.1A Active CN103917304B (zh) 2011-10-28 2012-10-26 具有应力层的预塌陷电容式微加工换能器单元

Country Status (8)

Country Link
US (1) US9534949B2 (https=)
EP (1) EP2771132B1 (https=)
JP (1) JP6210992B2 (https=)
CN (1) CN103917304B (https=)
BR (1) BR112014009659A2 (https=)
MX (1) MX347686B (https=)
RU (1) RU2603518C2 (https=)
WO (1) WO2013061298A2 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IN2014CN04975A (https=) 2011-12-20 2015-09-18 Koninkl Philips Nv
CN105263851B (zh) 2013-05-31 2017-10-13 罗伯特·博世有限公司 被限位的膜
DE102013223695B4 (de) * 2013-11-20 2016-09-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum herstellen eines kapazitiven ultraschallwandlers und anordnung einer mehrzahl von kapazitiven ultraschallwandlern
EP3110628B1 (en) 2014-02-28 2019-07-03 The Regents of the University of California Variable thickness diaphragm for a wideband robust piezoelectric micromachined ultrasonic transducer (pmut)
WO2016083273A1 (en) * 2014-11-25 2016-06-02 Koninklijke Philips N.V. Ultrasound system and method
CN105792084B (zh) * 2016-04-26 2020-02-21 瑞声声学科技(深圳)有限公司 Mems麦克风及其制造方法
CN110325293B (zh) * 2016-12-22 2021-06-22 皇家飞利浦有限公司 电容式射频微机电开关的系统和操作方法
RU2672099C2 (ru) * 2016-12-23 2018-11-12 Евгений Анатольевич Обжиров Электрическая машина емкостная (эме) с ячейками внутреннего сжатия
JP6970935B2 (ja) * 2017-06-21 2021-11-24 パナソニックＩｐマネジメント株式会社 物理量センサ
DE102019203829B4 (de) * 2019-03-20 2020-12-31 Vitesco Technologies GmbH Verfahren zum Herstellen einer Fluidsensorvorrichtung und Fluidsensorvorrichtung
US11904357B2 (en) * 2020-05-22 2024-02-20 GE Precision Healthcare LLC Micromachined ultrasonic transducers with non-coplanar actuation and displacement

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009041675A1 (en) * 2007-09-25 2009-04-02 Canon Kabushiki Kaisha Electrostatic transducer and manufacturing method therefor
EP2145696A1 (en) * 2008-07-15 2010-01-20 UAB Minatech Capacitive micromachined ultrasonic transducer and its fabrication method
CN101896288A (zh) * 2007-12-14 2010-11-24 皇家飞利浦电子股份有限公司 包括经成型衬底的可以塌陷模式工作的cmut
CN101969856A (zh) * 2007-09-17 2011-02-09 皇家飞利浦电子股份有限公司 预塌陷的电容微机械超声传感器的制造及其应用

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5619476A (en) * 1994-10-21 1997-04-08 The Board Of Trustees Of The Leland Stanford Jr. Univ. Electrostatic ultrasonic transducer
DE69932587D1 (de) 1999-02-09 2006-09-14 St Microelectronics Srl Verfahren zur Herstellung von integrierten Bauelementen mit elektromechanischen Mikrostrukturen, ohne Restspannung
US20030022412A1 (en) 2001-07-25 2003-01-30 Motorola, Inc. Monolithic semiconductor-piezoelectric device structures and electroacoustic charge transport devices
US7489593B2 (en) 2004-11-30 2009-02-10 Vermon Electrostatic membranes for sensors, ultrasonic transducers incorporating such membranes, and manufacturing methods therefor
US10092270B2 (en) 2007-09-17 2018-10-09 Koninklijke Philips Electronics N.V. Pre-collapsed CMUT with mechanical collapse retention
US7745248B2 (en) 2007-10-18 2010-06-29 The Board Of Trustees Of The Leland Stanford Junior University Fabrication of capacitive micromachined ultrasonic transducers by local oxidation
JP2010061976A (ja) * 2008-09-03 2010-03-18 Toshiba Corp スイッチ及びｅｓｄ保護素子
US9132693B2 (en) * 2008-09-16 2015-09-15 Koninklijke Philps N.V. Capacitive micromachine ultrasound transducer
US8402831B2 (en) * 2009-03-05 2013-03-26 The Board Of Trustees Of The Leland Standford Junior University Monolithic integrated CMUTs fabricated by low-temperature wafer bonding
BR112014009698A2 (pt) * 2011-10-28 2017-05-09 Koninklijke Philips Nv célula transdutora micromanufaturada capacitiva que sofreu colapso previamente e método de fabricação da mesma
IN2014CN03656A (https=) * 2011-11-17 2015-10-16 Koninkl Philips Nv
IN2014CN04975A (https=) * 2011-12-20 2015-09-18 Koninkl Philips Nv

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101969856A (zh) * 2007-09-17 2011-02-09 皇家飞利浦电子股份有限公司 预塌陷的电容微机械超声传感器的制造及其应用
WO2009041675A1 (en) * 2007-09-25 2009-04-02 Canon Kabushiki Kaisha Electrostatic transducer and manufacturing method therefor
CN101896288A (zh) * 2007-12-14 2010-11-24 皇家飞利浦电子股份有限公司 包括经成型衬底的可以塌陷模式工作的cmut
EP2145696A1 (en) * 2008-07-15 2010-01-20 UAB Minatech Capacitive micromachined ultrasonic transducer and its fabrication method

Also Published As

Publication number Publication date
RU2014121392A (ru) 2015-12-10
US9534949B2 (en) 2017-01-03
MX347686B (es) 2017-05-09
CN103917304A (zh) 2014-07-09
RU2603518C2 (ru) 2016-11-27
BR112014009659A2 (pt) 2017-05-09
MX2014004910A (es) 2014-05-28
EP2771132A2 (en) 2014-09-03
US20140251014A1 (en) 2014-09-11
WO2013061298A2 (en) 2013-05-02
EP2771132B1 (en) 2018-08-29
JP6210992B2 (ja) 2017-10-11
WO2013061298A3 (en) 2013-09-19
JP2015501594A (ja) 2015-01-15

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