JP2021515887A5 - - Google Patents

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Publication number
JP2021515887A5
JP2021515887A5 JP2020544889A JP2020544889A JP2021515887A5 JP 2021515887 A5 JP2021515887 A5 JP 2021515887A5 JP 2020544889 A JP2020544889 A JP 2020544889A JP 2020544889 A JP2020544889 A JP 2020544889A JP 2021515887 A5 JP2021515887 A5 JP 2021515887A5
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JP
Japan
Prior art keywords
film
substrate
steps include
sensor
rim
Prior art date
Application number
JP2020544889A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021515887A (ja
JPWO2019166263A5 (https=
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Publication date
Priority claimed from EP18159049.8A external-priority patent/EP3533386A1/en
Application filed filed Critical
Publication of JP2021515887A publication Critical patent/JP2021515887A/ja
Publication of JPWO2019166263A5 publication Critical patent/JPWO2019166263A5/ja
Publication of JP2021515887A5 publication Critical patent/JP2021515887A5/ja
Pending legal-status Critical Current

Links

JP2020544889A 2018-02-28 2019-02-19 容量性圧力センサを用いる圧力検出 Pending JP2021515887A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP18159049.8A EP3533386A1 (en) 2018-02-28 2018-02-28 Pressure sensing with capacitive pressure sensor
EP18159049.8 2018-02-28
PCT/EP2019/054009 WO2019166263A1 (en) 2018-02-28 2019-02-19 Pressure sensing with capacitive pressure sensor

Publications (3)

Publication Number Publication Date
JP2021515887A JP2021515887A (ja) 2021-06-24
JPWO2019166263A5 JPWO2019166263A5 (https=) 2022-02-22
JP2021515887A5 true JP2021515887A5 (https=) 2022-02-22

Family

ID=61569050

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020544889A Pending JP2021515887A (ja) 2018-02-28 2019-02-19 容量性圧力センサを用いる圧力検出

Country Status (5)

Country Link
US (1) US20200397321A1 (https=)
EP (2) EP3533386A1 (https=)
JP (1) JP2021515887A (https=)
CN (1) CN111787850A (https=)
WO (1) WO2019166263A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7383869B2 (ja) * 2020-02-13 2023-11-21 シャープ株式会社 タッチパネル及び表示装置
US20240255362A1 (en) * 2021-05-27 2024-08-01 The University Of Chicago Strain-insensitive soft pressure sensor and method of measuring pressure
CN114323403A (zh) * 2021-12-14 2022-04-12 上海交通大学 实现在体压力传感器长期性能稳定的方法
CN114910196A (zh) * 2022-04-22 2022-08-16 西安交通大学 微米尺度的平面电容式压力传感器制备方法
CN117782377A (zh) * 2022-09-22 2024-03-29 北京京东方技术开发有限公司 压力传感器及其制作方法、电子设备
CN118414534A (zh) 2022-11-15 2024-07-30 京东方科技集团股份有限公司 压力传感器及其制备方法、电子装置
CN116086656A (zh) * 2022-12-08 2023-05-09 北京大学 电容式压力传感器
US20240350016A1 (en) * 2023-04-18 2024-10-24 Bard Access Systems, Inc. System and Method for Placement of a Central Catheter Tip
WO2025158310A1 (en) * 2024-01-24 2025-07-31 Medtronic, Inc. Pressure sensor assembly and implantable medical device including same

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3114570B2 (ja) * 1995-05-26 2000-12-04 オムロン株式会社 静電容量型圧力センサ
JP2001099734A (ja) * 1999-09-30 2001-04-13 Hitachi Ltd 半導体容量式圧力センサ
JP2002250665A (ja) * 2001-02-23 2002-09-06 Omron Corp 静電容量式センサ及びその製造方法
JP2002267560A (ja) * 2001-03-13 2002-09-18 Anelva Corp 圧力センサの製造方法
US20050121734A1 (en) * 2003-11-07 2005-06-09 Georgia Tech Research Corporation Combination catheter devices, methods, and systems
US8118748B2 (en) * 2005-04-28 2012-02-21 Medtronic, Inc. Implantable capacitive pressure sensor system and method
ITRM20060238A1 (it) * 2006-05-03 2007-11-04 Esaote Spa Trasduttore ultracustico capacitivo multipiano
EP2150791B1 (en) * 2007-04-23 2016-03-16 Given Imaging (Los Angeles) LLC Suspended membrane pressure sensing array
CN101815933A (zh) * 2007-08-27 2010-08-25 皇家飞利浦电子股份有限公司 压力传感器、包括压力传感器的传感器探头、包括传感器探头的医疗设备、以及制造传感器探头的方法
US8787116B2 (en) * 2007-12-14 2014-07-22 Koninklijke Philips N.V. Collapsed mode operable cMUT including contoured substrate
EP2269746B1 (en) * 2009-07-02 2014-05-14 Nxp B.V. Collapsed mode capacitive sensor
JP5733898B2 (ja) * 2010-02-14 2015-06-10 キヤノン株式会社 静電容量型電気機械変換装置
US8704538B2 (en) * 2010-07-01 2014-04-22 Mks Instruments, Inc. Capacitance sensors
IN2014CN03656A (https=) 2011-11-17 2015-10-16 Koninkl Philips Nv
US9200973B2 (en) * 2012-06-28 2015-12-01 Intel Corporation Semiconductor package with air pressure sensor
WO2014103334A1 (ja) * 2012-12-28 2014-07-03 コニカミノルタ株式会社 超音波振動子セル、超音波プローブ、及び超音波振動子セルの制御方法
CN105592940B (zh) * 2013-09-24 2018-09-25 皇家飞利浦有限公司 Cmut装置制造方法、cmut装置和设备
WO2015153938A1 (en) * 2014-04-04 2015-10-08 Robert Bosch Gmbh Membrane-based sensor and method for robust manufacture of a membrane-based sensor
EP3134003B1 (en) * 2014-04-23 2020-08-12 Koninklijke Philips N.V. Catheter with integrated controller for imaging and pressure sensing
US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
WO2017036827A1 (en) * 2015-09-03 2017-03-09 Koninklijke Philips N.V. Ic die, probe and ultrasound system

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