JP2015233141A - パワー半導体デバイス - Google Patents
パワー半導体デバイス Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 74
- 210000000746 body region Anatomy 0.000 claims abstract description 61
- 230000008859 change Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 71
- 239000000463 material Substances 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- 238000009792 diffusion process Methods 0.000 description 9
- 239000010949 copper Substances 0.000 description 8
- 230000000903 blocking effect Effects 0.000 description 7
- 238000002161 passivation Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 229910052814 silicon oxide Inorganic materials 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 239000005380 borophosphosilicate glass Substances 0.000 description 4
- 239000005388 borosilicate glass Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000002513 implantation Methods 0.000 description 4
- 239000005360 phosphosilicate glass Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000005368 silicate glass Substances 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910016570 AlCu Inorganic materials 0.000 description 2
- 229910000789 Aluminium-silicon alloy Inorganic materials 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000005036 potential barrier Methods 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical group 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000036470 plasma concentration Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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Abstract
【解決手段】 本発明は、第2導電型の下部半導体層と、下部半導体層上の第1導電型の上部半導体層とを有する半導体基板と;半導体基板の上部に位置する、第2導電型を有するボディ領域と;ボディ領域の上部に位置する、第1導電型を有するソース領域と;少なくとも部分的にボディ領域の下に位置しており、かつ少なくとも部分的に上部半導体層の上にあり、ドーピング濃度が上部半導体層のドーピング濃度よりも高く、かつ垂直延伸が相対的に小さい第1導電型の第1ドープ領域と;前記ソース領域に電気的に接続されたエミッタ電極と;前記エミッタ電極に接続されるシールド電極を含む、半導体基板の上部から下向きに延びるトレンチと;少なくとも一部のソース領域およびボディ領域の上方に少なくとも部分的に形成され、かつ前記シールド電極とは電気的に絶縁されたゲートと、を備えたパワー半導体デバイスに関する。
【選択図】 図1
Description
230 第1導電型の半導体ベース層
50、250 第2導電型のボディ領域
51、251 第1導電型のソース領域
40、240、340 第1導電型の第1ドープ領域
90、290 エミッタ電極
77、277 シールド電極
76、276 トレンチ
70、270 ゲート
100、200 パワー半導体デバイス
542 第2導電型の追加ドープ領域
252 第2導電型を有する第2ドープ領域
10、210 コレクタ電極
30 半導体ベース層
41 最高ドーピング領域
52 p+領域
75 絶縁層
271 パッシベーション層
291 パッド
350、450 p型ボディ領域
440、540 n型ドープ領域
Claims (15)
- 第2導電型の下部半導体層(20、220)を有する第1導電型の半導体ベース層(230)と;
アクティブ領域であって、
第2導電型のボディ領域(50、250)と;
ボディ領域(50、250)に位置する、第1導電型のソース領域(51、251)と;
少なくとも部分的にボディ領域の下に位置しており、ドーピング濃度が不均一であり、かつ最高ドーピング濃度領域がボディ領域の下に位置しており、かつ最高ドーピング濃度が少なくとも半導体ベース層(230)のドーピング濃度よりも高い、第1導電型の第1ドープ領域(40、240、340)と;
前記ソース領域(51、251)に電気的に接続されたエミッタ電極(90、290)と;
前記エミッタ電極(90、290)に電気的に接続されたシールド電極(77、277)を備え、第1ドープ領域よりも深い深さまでベース層へ下向きに延びるトレンチ(76、276)と;
少なくとも一部のソース領域およびボディ領域の上方に少なくとも部分的に形成され、かつ前記シールド電極とは電気的に絶縁されたゲート(70、270)と
を備えるアクティブ領域と、
を備えることを特徴とするパワー半導体デバイス(100、200)。 - 前記第1ドープ領域(40、240、340)のドーピング濃度が、少なくとも垂直方向において、ボディ領域(50、250)と前記第1ドープ領域(40、240、340)との間の表面から前記第1ドープ領域とベース層との間の表面に向けて増加することを特徴とする請求項1に記載のパワー半導体デバイス。
- 前記第1ドープ領域のドーピング濃度が、ボディ領域の下の第1深さにおいて最大値を有することを特徴とする請求項2に記載のパワー半導体デバイス。
- 前記第1ドープ領域がボディ領域の下にのみ位置することを特徴とする請求項1に記載のパワー半導体デバイス。
- 前記第1ドープ領域の垂直延伸が、500nm〜5μmの範囲内にあることを特徴とする請求項1に記載のパワー半導体デバイス。
- 前記第1ドープ領域の垂直延伸が、1μm〜3μmの範囲内にあることを特徴とする請求項5に記載のパワー半導体デバイス。
- 前記第1ドープ領域のドーピング濃度が、半導体デバイス中の第2深さにおいて少なくとも1つの最低点を有することを特徴とする請求項1に記載のパワー半導体デバイス。
- 第1導電型のドーピング濃度の前記少なくとも1つの最低点が第2導電型の有効ドーピングを有することを特徴とする請求項7に記載のパワー半導体デバイス。
- 第1導電型のドーピング濃度の前記少なくとも1つの最低点が島の形式を有することを特徴とする請求項7または8に記載のパワー半導体デバイス。
- 幅および距離が横向き方向において一定であるかまたは変化する隙間を有する複数のリボンを形成するために、前記第1ドープ領域が横向き方向において中断されていることを特徴とする請求項1に記載のパワー半導体デバイス。
- ボディ領域と前記第1ドープ領域との間で形成されたpn結合の、高い曲率を有する位置で、前記第1ドープ領域が省略されるかまたは前記第1ドープ領域のドーピング濃度が相対的に低いことを特徴とする請求項1に記載のパワー半導体デバイス。
- 前記第1ドープ領域に位置するかまたは前記第1ドープ領域に近接する第2導電型の追加ドープ領域(542)をさらに備えることを特徴とする請求項1に記載のパワー半導体デバイス。
- ボディ領域に位置しており、かつエミッタ電極(290)に電気的に接続された、第2導電型を有する第2ドープ領域(252)をさらに備えることを特徴とする請求項1に記載のパワー半導体デバイス。
- ボディ領域に位置しており、前記ソース領域の下にある、ドーピング濃度がボディ領域のドーピング濃度よりも高い、第2導電型を有する第2ドープ領域(252)をさらに備えることを特徴とする請求項1に記載のパワー半導体デバイス。
- 前記半導体デバイスが垂直型パワーデバイスであり、かつ、半導体ベース層の底部に位置しており下部半導体層(20、220)と接触するコレクタ電極(10、210)を備え、かつ、前記ゲートは、平面ゲート、垂直ゲート、またはそれらの組み合わせのうち少なくとも1つを含むことを特徴とする請求項1〜8および10〜14のいずれか一項に記載のパワー半導体デバイス。
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