JP2015223665A - 研削装置及び矩形基板の研削方法 - Google Patents

研削装置及び矩形基板の研削方法 Download PDF

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Publication number
JP2015223665A
JP2015223665A JP2014110054A JP2014110054A JP2015223665A JP 2015223665 A JP2015223665 A JP 2015223665A JP 2014110054 A JP2014110054 A JP 2014110054A JP 2014110054 A JP2014110054 A JP 2014110054A JP 2015223665 A JP2015223665 A JP 2015223665A
Authority
JP
Japan
Prior art keywords
grinding
rectangular substrate
chuck table
wheel
grinding wheel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014110054A
Other languages
English (en)
Japanese (ja)
Inventor
聡 山中
Satoshi Yamanaka
聡 山中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Abrasive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Abrasive Systems Ltd filed Critical Disco Abrasive Systems Ltd
Priority to JP2014110054A priority Critical patent/JP2015223665A/ja
Priority to TW104112095A priority patent/TW201600244A/zh
Priority to KR1020150061477A priority patent/KR20150136994A/ko
Priority to CN201510246815.2A priority patent/CN105269423A/zh
Publication of JP2015223665A publication Critical patent/JP2015223665A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/002—Grinding heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2014110054A 2014-05-28 2014-05-28 研削装置及び矩形基板の研削方法 Pending JP2015223665A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014110054A JP2015223665A (ja) 2014-05-28 2014-05-28 研削装置及び矩形基板の研削方法
TW104112095A TW201600244A (zh) 2014-05-28 2015-04-15 磨削裝置及矩形基板之磨削方法
KR1020150061477A KR20150136994A (ko) 2014-05-28 2015-04-30 연삭 장치 및 직사각형 기판의 연삭 방법
CN201510246815.2A CN105269423A (zh) 2014-05-28 2015-05-15 磨削装置和矩形基板的磨削方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014110054A JP2015223665A (ja) 2014-05-28 2014-05-28 研削装置及び矩形基板の研削方法

Publications (1)

Publication Number Publication Date
JP2015223665A true JP2015223665A (ja) 2015-12-14

Family

ID=54840838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014110054A Pending JP2015223665A (ja) 2014-05-28 2014-05-28 研削装置及び矩形基板の研削方法

Country Status (4)

Country Link
JP (1) JP2015223665A (zh)
KR (1) KR20150136994A (zh)
CN (1) CN105269423A (zh)
TW (1) TW201600244A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107234519A (zh) * 2016-03-28 2017-10-10 沈阳海默数控机床有限公司 一种垂直槽面进给的磨削方法
CN112589540A (zh) * 2019-10-02 2021-04-02 株式会社迪思科 板状工件的磨削方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7193969B2 (ja) * 2018-10-03 2022-12-21 株式会社ディスコ 矩形基板の研削方法
CN113001286B (zh) * 2021-02-18 2022-05-27 江西联益电子科技有限公司 一种电子元器件加工设备及方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09253991A (ja) * 1996-03-15 1997-09-30 Hitachi Zosen Corp 研磨装置およびこの研磨装置を用いた研磨方法
JP2006062055A (ja) * 2004-08-30 2006-03-09 Atsunobu Une 加工方法、加工装置およびこの加工方法により加工された矩形平板状の加工物
JP2009107064A (ja) * 2007-10-30 2009-05-21 Tosoh Corp 機械研磨方法、機械研磨装置および研磨物
JP2009214271A (ja) * 2008-03-12 2009-09-24 Tosoh Corp 研磨装置用の研磨工具および研磨方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2740496B2 (ja) * 1996-01-29 1998-04-15 株式会社ホーライ 面直し装置
JPH11170168A (ja) * 1997-12-15 1999-06-29 Nikon Corp 高精度平滑平面加工方法
JP5064102B2 (ja) * 2007-04-27 2012-10-31 株式会社ディスコ 基板の研削加工方法および研削加工装置
CN202910710U (zh) * 2012-10-10 2013-05-01 大丰瑞禾机械有限公司 立轴矩台精密研磨机

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09253991A (ja) * 1996-03-15 1997-09-30 Hitachi Zosen Corp 研磨装置およびこの研磨装置を用いた研磨方法
JP2006062055A (ja) * 2004-08-30 2006-03-09 Atsunobu Une 加工方法、加工装置およびこの加工方法により加工された矩形平板状の加工物
JP2009107064A (ja) * 2007-10-30 2009-05-21 Tosoh Corp 機械研磨方法、機械研磨装置および研磨物
JP2009214271A (ja) * 2008-03-12 2009-09-24 Tosoh Corp 研磨装置用の研磨工具および研磨方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107234519A (zh) * 2016-03-28 2017-10-10 沈阳海默数控机床有限公司 一种垂直槽面进给的磨削方法
CN107234519B (zh) * 2016-03-28 2019-06-18 沈阳海默数控机床有限公司 一种垂直槽面进给的磨削方法
CN112589540A (zh) * 2019-10-02 2021-04-02 株式会社迪思科 板状工件的磨削方法
JP2021053790A (ja) * 2019-10-02 2021-04-08 株式会社ディスコ 板状ワークの研削方法
JP7312077B2 (ja) 2019-10-02 2023-07-20 株式会社ディスコ 板状ワークの研削方法
CN112589540B (zh) * 2019-10-02 2024-02-23 株式会社迪思科 板状工件的磨削方法

Also Published As

Publication number Publication date
KR20150136994A (ko) 2015-12-08
CN105269423A (zh) 2016-01-27
TW201600244A (zh) 2016-01-01

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