JP2015220398A - パワー半導体モジュール - Google Patents
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Abstract
Description
図1に断面図で示した本発明の実施形態1のパワー半導体モジュール1は、概略円柱の外形を有している(図6(a)参照)。パワー半導体モジュール1は、枠体9と、第1電極板2と、半導体素子としての半導体チップ3と、絶縁基板4と、配線部材7と、第2電極板10と、金属ブロック11を備えている。第1電極板2は、本実施形態のパワー半導体モジュール1を使用するときに外部の導電板と圧接して電流を流す電極である。外部の導電板と位置合わせできるように、第1電極板2は、外面の中央部に凸部2aを有している。この凸部2aの高さは、1mm程度あれば、十分な接触性が確保できる。
更に、一つの半導体チップ3に対する導電ポスト6の設置数は任意であり、一つの電極に複数個の導電ポスト6を接合することも可能である。
そして、枠体9、第1電極板2及び第2電極板10で構成されるパワー半導体モジュール1の筐体の内部に、半導体チップ3、絶縁基板4、配線部材7および金属ブロック11が収容されている。
図4に、本発明の実施形態2のパワー半導体モジュール20の断面図を示す。図4には、図1に示したパワー半導体モジュール1と同一の部材については同一の符号を付しており、以下では重複する記載を省略する。
図5に、本発明の実施形態3のパワー半導体モジュール30の断面図を示す。図5には、図1に示したパワー半導体モジュール1と同一の部材については同一の符号を付しており、以下では重複する記載を省略する。
本発明のパワー半導体モジュールの実施形態4を、図6を用いて説明する。まず、実施形態1〜3のパワー半導体モジュール1、20又は30を複数個用意し、またそれらを搭載可能な冷却板61を用意する(図6(a))。次に、冷却板61上に、用意したパワー半導体モジュール1(又は20、30)を搭載する(図6では3個)。また、搭載されたパワー半導体モジュール1(又は20、30)の第2電極板10と、電気的かつ機械的に接続される外部電極62を用意する(図6(b))。そして、外部電極62を、パワー半導体モジュール1(又は20、30)の上に圧接して設置することにより、パワー半導体モジュール40としている(図6(c))。パワー半導体モジュール40は、3個のパワー半導体モジュール1(又は20、30)が並列に接続されているため、1個のパワー半導体モジュール1(又は20、30)に比べて定格電流を大きくすることができる。
本発明のパワー半導体モジュールの実施形態5を、図7を用いて説明する。実施形態1〜3のパワー半導体モジュール1、20又は30の複数個、図示した例では3個を積み重ねて圧接して設置することにより、パワー半導体モジュール50としている。直列に接続して一つのパワー半導体モジュール50としている。図7に示したパワー半導体モジュール50は、3個のパワー半導体モジュール1(又は20、30)が直列に接続されているため、1個のパワー半導体モジュール1(又は20、30)に比べて定格電圧を大きくすることができる。
2 第1電極板
3 半導体チップ
4 絶縁基板
5 プリント基板
6 導電ポスト
7 配線部材
8 封止材
9 枠体
9a 第1開口部
9b 第2開口部
10 第2電極板
11、21、31 金属ブロック
11a 第1面
11b 凸部
11c 第2面
Claims (11)
- 絶縁体で構成され、第1開口部および第2開口部を有する枠体と、
金属で構成され、該枠体の第1開口部に固定された第1電極板と、
おもて面電極および裏面電極を有し、該裏面電極が該第1電極板の主面に電気的かつ機械的に接続された半導体素子と、
回路板、絶縁板、金属板が積層して構成され、該金属板が該第1電極板の主面に固定された絶縁基板と、
該半導体素子のおもて面電極と該絶縁基板の回路板との間を電気的に接続する配線部材と、
金属で構成され、該枠体の第2開口部に固定された第2電極板と、
凸部を有する第1面と該第1面の反対側に位置する第2面を有し、該凸部が該絶縁基板の回路板に電気的かつ機械的に接続され、該第2面が該第2電極板に電気的かつ機械的に接続され、該第1面から該第2面にかけて先細り形状を有する金属ブロックと、
を備えるパワー半導体モジュール。 - 前記金属ブロックの第1面が、封止材を介して前記半導体素子と対向している請求項1記載のパワー半導体モジュール。
- 前記配線部材が、
金属膜を有し、前記半導体素子及び前記絶縁基板に対向するプリント基板と、
一端が該おもて面電極もしくは該回路板に電気的かつ機械的に接続され、他端が該金属膜に電気的かつ機械的に接続される複数の導電ポストと、
を備える請求項2記載のパワー半導体モジュール。 - 前記封止材が、熱硬化性樹脂よりなり、該封止材の高さが前記プリント基板及び導電ポストの上端から1〜3mmである請求項3記載のパワー半導体モジュール。
- 前記金属ブロックが、円錐台形状を有する請求項1記載のパワー半導体モジュール。
- 前記金属ブロックが、複数の円錐台を組み合わせた形状を有する請求項1記載のパワー半導体モジュール。
- 前記第1電極板が主面に凹部を有し、前記凹部に前記絶縁基板が配置された請求項1記載のパワー半導体モジュール。
- 前記第1電極板及び前記第2電極板が、外方に突出する凸部を有する請求項1記載のパワー半導体モジュール。
- 前記枠体が外面に凹凸を有する請求項1記載のパワー半導体モジュール。
- 前記半導体素子が炭化ケイ素からなる請求項1記載のパワー半導体モジュール。
- 前記半導体素子がダイオードである請求項1記載のパワー半導体モジュール。
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JP2014104366A JP6248803B2 (ja) | 2014-05-20 | 2014-05-20 | パワー半導体モジュール |
US14/695,276 US9209099B1 (en) | 2014-05-20 | 2015-04-24 | Power semiconductor module |
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JP2014104366A JP6248803B2 (ja) | 2014-05-20 | 2014-05-20 | パワー半導体モジュール |
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JP2015220398A true JP2015220398A (ja) | 2015-12-07 |
JP6248803B2 JP6248803B2 (ja) | 2017-12-20 |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP6330436B2 (ja) * | 2014-04-01 | 2018-05-30 | 富士電機株式会社 | パワー半導体モジュール |
JP6480856B2 (ja) * | 2015-12-14 | 2019-03-13 | 株式会社東芝 | 半導体モジュール |
DE102018133089A1 (de) * | 2018-12-20 | 2020-06-25 | Danfoss Silicon Power Gmbh | Halbleitermodul mit einem Halbleiter und einem den Halbleiter teilweise einhausenden Gehäuse |
CN117766470B (zh) * | 2024-02-20 | 2024-05-14 | 北京怀柔实验室 | 半导体器件的封装结构和封装方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01122146A (ja) * | 1987-11-06 | 1989-05-15 | Fuji Electric Co Ltd | 平形半導体装置 |
JPH1197591A (ja) * | 1997-09-17 | 1999-04-09 | Toshiba Corp | 電子部品 |
JP2003289124A (ja) * | 2002-03-28 | 2003-10-10 | Hitachi Ltd | 半導体モジュール |
JP2004296764A (ja) * | 2003-03-27 | 2004-10-21 | Toshiba Corp | 平型半導体素子用スタック及びそれを用いた電力変換装置 |
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JP4294405B2 (ja) * | 2003-07-31 | 2009-07-15 | 株式会社ルネサステクノロジ | 半導体装置 |
JP4637784B2 (ja) | 2006-04-14 | 2011-02-23 | 三菱電機株式会社 | 電力用半導体装置 |
JP5083226B2 (ja) | 2009-01-14 | 2012-11-28 | 富士電機株式会社 | 半導体装置およびその製造方法 |
JP4947169B2 (ja) * | 2010-03-10 | 2012-06-06 | オムロン株式会社 | 半導体装置及びマイクロフォン |
KR20130055867A (ko) * | 2011-11-21 | 2013-05-29 | 한국전자통신연구원 | 압전 마이크로 발전기 및 그 제조 방법 |
JP2012074730A (ja) | 2011-12-07 | 2012-04-12 | Mitsubishi Electric Corp | 電力用半導体モジュール |
JP5899952B2 (ja) | 2012-01-19 | 2016-04-06 | 株式会社明電舎 | 半導体モジュール |
JP6097084B2 (ja) * | 2013-01-24 | 2017-03-15 | スタンレー電気株式会社 | 半導体発光装置 |
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JPH01122146A (ja) * | 1987-11-06 | 1989-05-15 | Fuji Electric Co Ltd | 平形半導体装置 |
JPH1197591A (ja) * | 1997-09-17 | 1999-04-09 | Toshiba Corp | 電子部品 |
JP2003289124A (ja) * | 2002-03-28 | 2003-10-10 | Hitachi Ltd | 半導体モジュール |
JP2004296764A (ja) * | 2003-03-27 | 2004-10-21 | Toshiba Corp | 平型半導体素子用スタック及びそれを用いた電力変換装置 |
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JP2015198171A (ja) * | 2014-04-01 | 2015-11-09 | 富士電機株式会社 | パワー半導体モジュール |
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