JP2015216334A5 - - Google Patents

Download PDF

Info

Publication number
JP2015216334A5
JP2015216334A5 JP2014129952A JP2014129952A JP2015216334A5 JP 2015216334 A5 JP2015216334 A5 JP 2015216334A5 JP 2014129952 A JP2014129952 A JP 2014129952A JP 2014129952 A JP2014129952 A JP 2014129952A JP 2015216334 A5 JP2015216334 A5 JP 2015216334A5
Authority
JP
Japan
Prior art keywords
signal processing
present technology
devices
imaging
imaging device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014129952A
Other languages
English (en)
Japanese (ja)
Other versions
JP6245474B2 (ja
JP2015216334A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2014129952A external-priority patent/JP6245474B2/ja
Priority to JP2014129952A priority Critical patent/JP6245474B2/ja
Priority to TW104111027A priority patent/TWI667779B/zh
Priority to US15/302,705 priority patent/US10217785B2/en
Priority to CN201911263833.6A priority patent/CN110957339B/zh
Priority to CN201580006012.8A priority patent/CN105940493B/zh
Priority to KR1020247020532A priority patent/KR102807159B1/ko
Priority to KR1020227009868A priority patent/KR102506010B1/ko
Priority to PCT/JP2015/001990 priority patent/WO2015162867A1/en
Priority to KR1020257015066A priority patent/KR20250069695A/ko
Priority to KR1020167028470A priority patent/KR102383181B1/ko
Priority to KR1020237007336A priority patent/KR102678404B1/ko
Priority to EP19181062.1A priority patent/EP3565001B1/en
Priority to EP15718634.7A priority patent/EP3134918B1/en
Publication of JP2015216334A publication Critical patent/JP2015216334A/ja
Publication of JP2015216334A5 publication Critical patent/JP2015216334A5/ja
Publication of JP6245474B2 publication Critical patent/JP6245474B2/ja
Application granted granted Critical
Priority to US16/284,716 priority patent/US10811454B2/en
Priority to US17/014,891 priority patent/US12046619B2/en
Priority to US18/744,050 priority patent/US20240332336A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2014129952A 2014-04-21 2014-06-25 固体撮像素子、固体撮像素子の製造方法、並びに、電子機器 Active JP6245474B2 (ja)

Priority Applications (16)

Application Number Priority Date Filing Date Title
JP2014129952A JP6245474B2 (ja) 2014-04-21 2014-06-25 固体撮像素子、固体撮像素子の製造方法、並びに、電子機器
TW104111027A TWI667779B (zh) 2014-04-21 2015-04-02 固態成像裝置，固態成像裝置之製造方法及電子設備
KR1020237007336A KR102678404B1 (ko) 2014-04-21 2015-04-09 고체 촬상 소자, 고체 촬상 소자의 제조 방법, 및, 전자 기기
EP19181062.1A EP3565001B1 (en) 2014-04-21 2015-04-09 Solid-state imaging device and manufacturing method of solid-state imaging device
CN201580006012.8A CN105940493B (zh) 2014-04-21 2015-04-09 固态成像装置、固态成像装置的制造方法和电子设备
KR1020247020532A KR102807159B1 (ko) 2014-04-21 2015-04-09 고체 촬상 소자, 고체 촬상 소자의 제조 방법, 및, 전자 기기
KR1020227009868A KR102506010B1 (ko) 2014-04-21 2015-04-09 고체 촬상 소자, 고체 촬상 소자의 제조 방법, 및, 전자 기기
PCT/JP2015/001990 WO2015162867A1 (en) 2014-04-21 2015-04-09 Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic apparatus
KR1020257015066A KR20250069695A (ko) 2014-04-21 2015-04-09 고체 촬상 소자, 고체 촬상 소자의 제조 방법, 및, 전자 기기
KR1020167028470A KR102383181B1 (ko) 2014-04-21 2015-04-09 고체 촬상 소자, 고체 촬상 소자의 제조 방법, 및, 전자 기기
US15/302,705 US10217785B2 (en) 2014-04-21 2015-04-09 Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic apparatus
CN201911263833.6A CN110957339B (zh) 2014-04-21 2015-04-09 固态成像装置和电子设备
EP15718634.7A EP3134918B1 (en) 2014-04-21 2015-04-09 Solid-state imaging device and manufacturing method of solid-state imaging device
US16/284,716 US10811454B2 (en) 2014-04-21 2019-02-25 Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic apparatus
US17/014,891 US12046619B2 (en) 2014-04-21 2020-09-08 Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic apparatus
US18/744,050 US20240332336A1 (en) 2014-04-21 2024-06-14 Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic apparatus

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014087603 2014-04-21
JP2014087603 2014-04-21
JP2014129952A JP6245474B2 (ja) 2014-04-21 2014-06-25 固体撮像素子、固体撮像素子の製造方法、並びに、電子機器

Publications (3)

Publication Number Publication Date
JP2015216334A JP2015216334A (ja) 2015-12-03
JP2015216334A5 true JP2015216334A5 (cg-RX-API-DMAC7.html) 2017-03-23
JP6245474B2 JP6245474B2 (ja) 2017-12-13

Family

ID=53005615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014129952A Active JP6245474B2 (ja) 2014-04-21 2014-06-25 固体撮像素子、固体撮像素子の製造方法、並びに、電子機器

Country Status (7)

Country Link
US (4) US10217785B2 (cg-RX-API-DMAC7.html)
EP (2) EP3565001B1 (cg-RX-API-DMAC7.html)
JP (1) JP6245474B2 (cg-RX-API-DMAC7.html)
KR (5) KR20250069695A (cg-RX-API-DMAC7.html)
CN (2) CN110957339B (cg-RX-API-DMAC7.html)
TW (1) TWI667779B (cg-RX-API-DMAC7.html)
WO (1) WO2015162867A1 (cg-RX-API-DMAC7.html)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6245474B2 (ja) 2014-04-21 2017-12-13 ソニー株式会社 固体撮像素子、固体撮像素子の製造方法、並びに、電子機器
CN107735832B (zh) * 2015-06-05 2021-10-22 苹果公司 显示面板的发光控制装置和方法
KR102376504B1 (ko) * 2015-07-02 2022-03-18 삼성전자주식회사 반도체 소자
US9640108B2 (en) 2015-08-25 2017-05-02 X-Celeprint Limited Bit-plane pulse width modulated digital display system
US9930277B2 (en) * 2015-12-23 2018-03-27 X-Celeprint Limited Serial row-select matrix-addressed system
US10091446B2 (en) 2015-12-23 2018-10-02 X-Celeprint Limited Active-matrix displays with common pixel control
US9928771B2 (en) 2015-12-24 2018-03-27 X-Celeprint Limited Distributed pulse width modulation control
US20190053406A1 (en) * 2016-02-29 2019-02-14 Sony Corporation Semiconductor device
JP6494551B2 (ja) 2016-03-28 2019-04-03 アンリツ株式会社 電界強度分布測定装置及び電界強度分布測定方法
JP6919154B2 (ja) 2016-03-31 2021-08-18 ソニーグループ株式会社 固体撮像素子、撮像装置、および電子機器
JP2017183658A (ja) * 2016-03-31 2017-10-05 ソニー株式会社 固体撮像素子、撮像装置、および電子機器
US10360846B2 (en) 2016-05-10 2019-07-23 X-Celeprint Limited Distributed pulse-width modulation system with multi-bit digital storage and output device
US10453826B2 (en) 2016-06-03 2019-10-22 X-Celeprint Limited Voltage-balanced serial iLED pixel and display
CN106454162B (zh) * 2016-09-06 2019-05-31 豪威科技(上海)有限公司 堆栈式cmos图像传感器及其制造方法
JP7055544B2 (ja) * 2016-11-29 2022-04-18 ソニーセミコンダクタソリューションズ株式会社 センサチップおよび電子機器
JP2018101966A (ja) * 2016-12-22 2018-06-28 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、電子機器、および、固体撮像素子の制御方法
US10832609B2 (en) * 2017-01-10 2020-11-10 X Display Company Technology Limited Digital-drive pulse-width-modulated output system
US10070090B2 (en) * 2017-02-03 2018-09-04 SmartSens Technology (U.S.), Inc. Stacked image sensor pixel cell with selectable shutter modes and in-pixel CDS
JP6928746B2 (ja) * 2017-04-10 2021-09-01 ブリルニクス シンガポール プライベート リミテッド 固体撮像装置、固体撮像装置の製造方法、および電子機器
KR102897552B1 (ko) 2017-06-29 2025-12-09 소니 세미컨덕터 솔루션즈 가부시키가이샤 웨이퍼 접합 이면 조사형 이미저
TWI649864B (zh) * 2017-06-30 2019-02-01 香港商京鷹科技股份有限公司 影像感測裝置及影像感測方法
KR102356913B1 (ko) * 2017-07-03 2022-02-03 에스케이하이닉스 주식회사 이미지 센서
JP7102119B2 (ja) * 2017-09-29 2022-07-19 キヤノン株式会社 半導体装置および機器
DE112018005493T5 (de) * 2017-10-03 2020-10-15 Sony Semiconductor Solutions Corporation Bildgebungsvorrichtung
TWI788430B (zh) * 2017-10-30 2023-01-01 日商索尼半導體解決方案公司 背面照射型之固體攝像裝置、背面照射型之固體攝像裝置之製造方法、攝像裝置及電子機器
US10608027B2 (en) 2017-12-15 2020-03-31 Atomera Incorporated Method for making CMOS image sensor including stacked semiconductor chips and image processing circuitry including a superlattice
WO2019118840A1 (en) * 2017-12-15 2019-06-20 Atomera Incorporated Cmos image sensor including stacked semiconductor chips and readout circuitry including a superlattice and related methods
US10608043B2 (en) 2017-12-15 2020-03-31 Atomera Incorporation Method for making CMOS image sensor including stacked semiconductor chips and readout circuitry including a superlattice
US10615209B2 (en) * 2017-12-15 2020-04-07 Atomera Incorporated CMOS image sensor including stacked semiconductor chips and readout circuitry including a superlattice
US10529768B2 (en) 2017-12-15 2020-01-07 Atomera Incorporated Method for making CMOS image sensor including pixels with read circuitry having a superlattice
US10367028B2 (en) 2017-12-15 2019-07-30 Atomera Incorporated CMOS image sensor including stacked semiconductor chips and image processing circuitry including a superlattice
US10529757B2 (en) 2017-12-15 2020-01-07 Atomera Incorporated CMOS image sensor including pixels with read circuitry having a superlattice
JP2019165312A (ja) 2018-03-19 2019-09-26 ソニーセミコンダクタソリューションズ株式会社 撮像装置および電子機器
JP2019179782A (ja) * 2018-03-30 2019-10-17 ソニーセミコンダクタソリューションズ株式会社 半導体装置および半導体装置の製造方法
JP2020047734A (ja) * 2018-09-18 2020-03-26 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置及び電子機器
JP7452962B2 (ja) * 2018-11-16 2024-03-19 ソニーセミコンダクタソリューションズ株式会社 撮像装置
JP7292860B2 (ja) * 2018-11-22 2023-06-19 キヤノン株式会社 光電変換装置
KR102558301B1 (ko) * 2018-12-13 2023-07-24 에스케이하이닉스 주식회사 유기 픽셀 어레이 및 무기 픽셀 어레이를 갖는 이미지 센싱 디바이스
TWI872085B (zh) * 2019-06-26 2025-02-11 日商索尼半導體解決方案公司 攝像裝置
JP7625528B2 (ja) * 2019-11-01 2025-02-03 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置
JP7523904B2 (ja) 2019-12-27 2024-07-29 キヤノン株式会社 検査装置および半導体装置の製造方法
JP7583562B2 (ja) * 2020-09-11 2024-11-14 キヤノン株式会社 光電変換装置及び撮像システム
JP2021061618A (ja) * 2020-12-15 2021-04-15 株式会社ニコン 撮像素子および撮像装置
JP7646380B2 (ja) 2021-02-04 2025-03-17 キヤノン株式会社 光電変換装置、光電変換システム、移動体
EP4289360A4 (en) * 2021-03-11 2025-01-01 National University Corporation Shizuoka University Radiation imaging device
JPWO2023132002A1 (cg-RX-API-DMAC7.html) * 2022-01-05 2023-07-13
JP2024003462A (ja) 2022-06-27 2024-01-15 キヤノン株式会社 撮像素子及び撮像装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4497844A (en) 1980-08-18 1985-02-05 Fryday Corporation Method for producing a restructured food product
JP2902506B2 (ja) 1990-08-24 1999-06-07 キヤノン株式会社 半導体装置の製造方法及び半導体装置
JP4497844B2 (ja) 2003-05-30 2010-07-07 キヤノン株式会社 固体撮像装置の製造方法
CN101010944B (zh) * 2004-09-02 2010-06-16 索尼株式会社 摄像装置及摄像结果的输出方法
JP4277216B2 (ja) * 2005-01-13 2009-06-10 ソニー株式会社 撮像装置及び撮像結果の処理方法
JP4979893B2 (ja) * 2005-03-23 2012-07-18 ソニー株式会社 物理量分布検知装置並びに物理情報取得方法および物理情報取得装置
TW200913238A (en) * 2007-06-04 2009-03-16 Sony Corp Optical member, solid state imaging apparatus, and manufacturing method
WO2010073520A1 (ja) * 2008-12-26 2010-07-01 パナソニック株式会社 固体撮像デバイスおよびその製造方法
JP5521721B2 (ja) * 2009-08-28 2014-06-18 ソニー株式会社 撮像素子およびカメラシステム
EP2518768B1 (en) * 2009-12-26 2019-03-20 Canon Kabushiki Kaisha Solid-state imaging device and imaging system
JP5696513B2 (ja) * 2011-02-08 2015-04-08 ソニー株式会社 固体撮像装置とその製造方法、及び電子機器
BR112013029020A2 (pt) * 2011-05-12 2019-10-01 Olive Medical Corporation sensor de imagem com elementos de interconexão de otimização de tolerância
JP5953974B2 (ja) * 2011-09-15 2016-07-20 富士通セミコンダクター株式会社 半導体装置及び半導体装置の製造方法
JP2013172014A (ja) * 2012-02-21 2013-09-02 Sony Corp 固体撮像装置およびその製造方法、並びにカメラシステム
JP2013182943A (ja) * 2012-02-29 2013-09-12 Canon Inc 固体撮像装置の製造方法
JP2013197113A (ja) * 2012-03-15 2013-09-30 Sony Corp 固体撮像装置およびカメラシステム
US8878325B2 (en) * 2012-07-31 2014-11-04 Taiwan Semiconductor Manufacturing Company, Ltd. Elevated photodiode with a stacked scheme
TWI595637B (zh) * 2012-09-28 2017-08-11 新力股份有限公司 半導體裝置及電子機器
JP6245474B2 (ja) 2014-04-21 2017-12-13 ソニー株式会社 固体撮像素子、固体撮像素子の製造方法、並びに、電子機器

Similar Documents

Publication Publication Date Title
JP2015216334A5 (cg-RX-API-DMAC7.html)
KR101528656B1 (ko) 적층된 디바이스에서의 신호 전달
EP3134918B1 (en) Solid-state imaging device and manufacturing method of solid-state imaging device
US10388685B2 (en) Portable electronic device and image-capturing module thereof, and image-sensing assembly thereof
US20200335539A1 (en) Photosensitive module
KR20150098094A (ko) 복수의 이미지 신호 프로세서들을 포함하는 이미지 처리 장치 및 이미지 처리 방법
US10037941B2 (en) Integrated device package comprising photo sensitive fill between a substrate and a die
WO2017169879A3 (en) Solid-state imaging element, imaging device, and electronic device
CN104580939A (zh) 图像捕捉装置、固态图像传感器以及照相机
JP2013183425A (ja) カメラモジュール
JP2006309182A5 (cg-RX-API-DMAC7.html)
KR20170130381A (ko) 집적된 패키지 구조체를 낮은 z 높이 3d 카메라로 형성하는 방법
TW201528813A (zh) 具有高效率熱傳遞之成像設備及其相關系統
TW202116053A (zh) 相機模組
CN105847638A (zh) 一种拍摄装置和具有其的电子设备
US9848111B1 (en) Imager module with molded packaging
CN203289497U (zh) 便携式电子装置
JP6423391B2 (ja) 撮像レンズ及びその被写界深度の矯正方法
CN106950791A (zh) 全景摄影装置
CN207766355U (zh) 成像模组及电子装置
US20150288916A1 (en) Integrated circuit device and image processing apparatus
JP2015201735A5 (ja) 集積回路装置
CN203351584U (zh) 相机模组封装结构
CN113194224A (zh) 电路板及电子设备
TW202549590A (zh) 攝像裝置及電子裝置