JP2015170670A5 - - Google Patents

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Publication number
JP2015170670A5
JP2015170670A5 JP2014043318A JP2014043318A JP2015170670A5 JP 2015170670 A5 JP2015170670 A5 JP 2015170670A5 JP 2014043318 A JP2014043318 A JP 2014043318A JP 2014043318 A JP2014043318 A JP 2014043318A JP 2015170670 A5 JP2015170670 A5 JP 2015170670A5
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JP
Japan
Prior art keywords
hole
view
plan
wiring board
board according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014043318A
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English (en)
Japanese (ja)
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JP6334962B2 (ja
JP2015170670A (ja
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Application filed filed Critical
Priority to JP2014043318A priority Critical patent/JP6334962B2/ja
Priority claimed from JP2014043318A external-priority patent/JP6334962B2/ja
Priority to US14/625,809 priority patent/US9497863B2/en
Priority to CN201510093012.8A priority patent/CN104902682A/zh
Publication of JP2015170670A publication Critical patent/JP2015170670A/ja
Publication of JP2015170670A5 publication Critical patent/JP2015170670A5/ja
Application granted granted Critical
Publication of JP6334962B2 publication Critical patent/JP6334962B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014043318A 2014-03-05 2014-03-05 配線基板、及び、配線基板の製造方法 Active JP6334962B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014043318A JP6334962B2 (ja) 2014-03-05 2014-03-05 配線基板、及び、配線基板の製造方法
US14/625,809 US9497863B2 (en) 2014-03-05 2015-02-19 Wiring substrate and method of making wiring substrate
CN201510093012.8A CN104902682A (zh) 2014-03-05 2015-03-02 配线基板及配线基板的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014043318A JP6334962B2 (ja) 2014-03-05 2014-03-05 配線基板、及び、配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2015170670A JP2015170670A (ja) 2015-09-28
JP2015170670A5 true JP2015170670A5 (enExample) 2017-02-09
JP6334962B2 JP6334962B2 (ja) 2018-05-30

Family

ID=54018868

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014043318A Active JP6334962B2 (ja) 2014-03-05 2014-03-05 配線基板、及び、配線基板の製造方法

Country Status (3)

Country Link
US (1) US9497863B2 (enExample)
JP (1) JP6334962B2 (enExample)
CN (1) CN104902682A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6334962B2 (ja) 2014-03-05 2018-05-30 新光電気工業株式会社 配線基板、及び、配線基板の製造方法
JP6373605B2 (ja) * 2014-03-05 2018-08-15 新光電気工業株式会社 配線基板、及び、配線基板の製造方法
KR102356810B1 (ko) * 2015-01-22 2022-01-28 삼성전기주식회사 전자부품내장형 인쇄회로기판 및 그 제조방법
JP6016965B2 (ja) * 2015-03-02 2016-10-26 三菱電機株式会社 電子機器ユニット及びその製造金型装置
US20160315024A1 (en) * 2015-04-21 2016-10-27 Qualcomm Incorporated Mechanical handling support for thin cores using photo-patternable material
JP6693441B2 (ja) * 2017-02-27 2020-05-13 オムロン株式会社 電子装置およびその製造方法
CN111508923B (zh) * 2019-01-31 2024-03-26 奥特斯奥地利科技与系统技术有限公司 在部件承载件材料中制造具有低偏移的通孔
CN112201652A (zh) * 2019-07-07 2021-01-08 深南电路股份有限公司 线路板及其制作方法
KR20230093743A (ko) * 2021-12-20 2023-06-27 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판 제조 방법

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7876577B2 (en) 2007-03-12 2011-01-25 Tyco Electronics Corporation System for attaching electronic components to molded interconnection devices
CN101594740B (zh) * 2008-05-27 2012-06-06 华通电脑股份有限公司 嵌埋电子器件的电路板及其方法
JP5001395B2 (ja) 2010-03-31 2012-08-15 イビデン株式会社 配線板及び配線板の製造方法
JP2012079994A (ja) 2010-10-05 2012-04-19 Yamaichi Electronics Co Ltd 部品内蔵プリント配線板およびその製造方法
JP2012164952A (ja) * 2011-01-20 2012-08-30 Ibiden Co Ltd 電子部品内蔵配線板及びその製造方法
CN103563498B (zh) * 2011-05-13 2016-07-06 揖斐电株式会社 电路板及其制造方法
US8957320B2 (en) 2011-10-11 2015-02-17 Ibiden Co., Ltd. Printed wiring board
US9439289B2 (en) 2012-01-12 2016-09-06 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
JP6029342B2 (ja) * 2012-06-15 2016-11-24 新光電気工業株式会社 配線基板及びその製造方法
JP2014107431A (ja) * 2012-11-28 2014-06-09 Ibiden Co Ltd 電子部品内蔵配線板、及び、電子部品内蔵配線板の製造方法
JP5462404B1 (ja) 2013-09-12 2014-04-02 太陽誘電株式会社 部品内蔵基板及び部品内蔵基板用コア基材
JP2015159153A (ja) 2014-02-21 2015-09-03 イビデン株式会社 電子部品内蔵多層配線板
JP6334962B2 (ja) 2014-03-05 2018-05-30 新光電気工業株式会社 配線基板、及び、配線基板の製造方法
JP2015185828A (ja) 2014-03-26 2015-10-22 イビデン株式会社 電子部品内蔵多層配線板およびその製造方法
JP2015220281A (ja) 2014-05-15 2015-12-07 イビデン株式会社 プリント配線板

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