JP2015139207A5 - - Google Patents

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Publication number
JP2015139207A5
JP2015139207A5 JP2014011764A JP2014011764A JP2015139207A5 JP 2015139207 A5 JP2015139207 A5 JP 2015139207A5 JP 2014011764 A JP2014011764 A JP 2014011764A JP 2014011764 A JP2014011764 A JP 2014011764A JP 2015139207 A5 JP2015139207 A5 JP 2015139207A5
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JP
Japan
Prior art keywords
terminal
fet chip
stage fet
bonding wire
edge
Prior art date
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Application number
JP2014011764A
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English (en)
Japanese (ja)
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JP6265415B2 (ja
JP2015139207A (ja
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Publication date
Application filed filed Critical
Priority to JP2014011764A priority Critical patent/JP6265415B2/ja
Priority claimed from JP2014011764A external-priority patent/JP6265415B2/ja
Priority to US14/604,029 priority patent/US9331640B2/en
Publication of JP2015139207A publication Critical patent/JP2015139207A/ja
Priority to US15/099,866 priority patent/US9866186B2/en
Publication of JP2015139207A5 publication Critical patent/JP2015139207A5/ja
Application granted granted Critical
Publication of JP6265415B2 publication Critical patent/JP6265415B2/ja
Active legal-status Critical Current
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JP2014011764A 2014-01-24 2014-01-24 増幅装置 Active JP6265415B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014011764A JP6265415B2 (ja) 2014-01-24 2014-01-24 増幅装置
US14/604,029 US9331640B2 (en) 2014-01-24 2015-01-23 Amplifier
US15/099,866 US9866186B2 (en) 2014-01-24 2016-04-15 Amplifier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014011764A JP6265415B2 (ja) 2014-01-24 2014-01-24 増幅装置

Publications (3)

Publication Number Publication Date
JP2015139207A JP2015139207A (ja) 2015-07-30
JP2015139207A5 true JP2015139207A5 (enExample) 2017-02-23
JP6265415B2 JP6265415B2 (ja) 2018-01-24

Family

ID=53680036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014011764A Active JP6265415B2 (ja) 2014-01-24 2014-01-24 増幅装置

Country Status (2)

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US (2) US9331640B2 (enExample)
JP (1) JP6265415B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6658162B2 (ja) * 2016-03-18 2020-03-04 三菱電機株式会社 電力増幅器
CN110622286A (zh) 2017-05-17 2019-12-27 三菱电机株式会社 放大器
WO2022050422A1 (ja) * 2020-09-07 2022-03-10 住友電工デバイス・イノベーション株式会社 半導体装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6086904A (ja) * 1983-10-18 1985-05-16 Nec Corp 超高周波用増幅器
JPH06326530A (ja) * 1993-02-26 1994-11-25 Sumitomo Electric Ind Ltd 高出力増幅器
JP2839023B2 (ja) * 1995-12-14 1998-12-16 日本電気株式会社 半導体パッケージ及びそれを用いた増幅器
JP3180774B2 (ja) 1998-08-31 2001-06-25 日本電気株式会社 高周波増幅装置
JP2000079540A (ja) 1998-09-02 2000-03-21 Toyoda Mach Works Ltd トランスファマシン
US6162697A (en) * 1998-10-13 2000-12-19 Institute Of Microelectronics High Q inductor realization for use in MMIC circuits
JP2002111415A (ja) * 2000-09-29 2002-04-12 Hitachi Ltd 高周波電力増幅装置及び無線通信機
JP2005143079A (ja) * 2003-10-14 2005-06-02 Matsushita Electric Ind Co Ltd 高周波電力増幅器
US7266360B2 (en) * 2004-04-07 2007-09-04 Neoreach, Inc. Low noise amplifier for wireless communications
JP2005348206A (ja) * 2004-06-04 2005-12-15 Matsushita Electric Ind Co Ltd 高周波スイッチ回路及びそれを用いた半導体装置
US7564303B2 (en) * 2005-07-26 2009-07-21 Infineon Technologies Ag Semiconductor power device and RF signal amplifier
JP4892253B2 (ja) * 2006-02-28 2012-03-07 ルネサスエレクトロニクス株式会社 電子装置
JP2008118624A (ja) * 2006-10-13 2008-05-22 Matsushita Electric Ind Co Ltd 高周波電力増幅装置
JP2008228347A (ja) * 2008-05-26 2008-09-25 Renesas Technology Corp 高周波電力増幅器モジュール
US8829999B2 (en) * 2010-05-20 2014-09-09 Cree, Inc. Low noise amplifiers including group III nitride based high electron mobility transistors
JP5483581B2 (ja) * 2010-07-20 2014-05-07 住友電工デバイス・イノベーション株式会社 ドハティ増幅器および半導体装置
EP2843691A4 (en) * 2012-04-27 2015-12-02 Mitsubishi Electric Corp FIELD-CHIP
US9171828B2 (en) * 2014-02-05 2015-10-27 Texas Instruments Incorporated DC-DC converter having terminals of semiconductor chips directly attachable to circuit board
US9184121B2 (en) * 2014-02-05 2015-11-10 Texas Instruments Incorporated Stacked synchronous buck converter having chip embedded in outside recess of leadframe

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