JP2015115342A5 - - Google Patents

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Publication number
JP2015115342A5
JP2015115342A5 JP2013253978A JP2013253978A JP2015115342A5 JP 2015115342 A5 JP2015115342 A5 JP 2015115342A5 JP 2013253978 A JP2013253978 A JP 2013253978A JP 2013253978 A JP2013253978 A JP 2013253978A JP 2015115342 A5 JP2015115342 A5 JP 2015115342A5
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JP
Japan
Prior art keywords
electronic component
mounting apparatus
component mounting
type electronic
melf type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013253978A
Other languages
English (en)
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JP2015115342A (ja
JP6289063B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2013253978A priority Critical patent/JP6289063B2/ja
Priority claimed from JP2013253978A external-priority patent/JP6289063B2/ja
Priority to US14/452,785 priority patent/US9723718B2/en
Priority to DE102014222601.5A priority patent/DE102014222601B4/de
Priority to CN201410747912.5A priority patent/CN104703406B/zh
Publication of JP2015115342A publication Critical patent/JP2015115342A/ja
Publication of JP2015115342A5 publication Critical patent/JP2015115342A5/ja
Application granted granted Critical
Publication of JP6289063B2 publication Critical patent/JP6289063B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (1)

  1. 請求項１に記載の電子部品実装装置であって、
    前記導電性部材は、
    前記メルフ型電子部品と前記絶縁基板との間に空隙を設けた状態で、前記メルフ型電子部品と前記金属パターンとを接合する、電子部品実装装置。
JP2013253978A 2013-12-09 2013-12-09 電子部品実装装置及びそれを備える半導体装置 Active JP6289063B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013253978A JP6289063B2 (ja) 2013-12-09 2013-12-09 電子部品実装装置及びそれを備える半導体装置
US14/452,785 US9723718B2 (en) 2013-12-09 2014-08-06 Electronic component mounting device and semiconductor device including the same
DE102014222601.5A DE102014222601B4 (de) 2013-12-09 2014-11-05 Vorrichtung mit montierten elektronischen Komponenten und Halbleitervorrichtung mit derselben
CN201410747912.5A CN104703406B (zh) 2013-12-09 2014-12-09 电子部件安装装置及具备电子部件安装装置的半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013253978A JP6289063B2 (ja) 2013-12-09 2013-12-09 電子部品実装装置及びそれを備える半導体装置

Publications (3)

Publication Number Publication Date
JP2015115342A JP2015115342A (ja) 2015-06-22
JP2015115342A5 true JP2015115342A5 (ja) 2016-02-18
JP6289063B2 JP6289063B2 (ja) 2018-03-07

Family

ID=53185527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013253978A Active JP6289063B2 (ja) 2013-12-09 2013-12-09 電子部品実装装置及びそれを備える半導体装置

Country Status (4)

Country Link
US (1) US9723718B2 (ja)
JP (1) JP6289063B2 (ja)
CN (1) CN104703406B (ja)
DE (1) DE102014222601B4 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108282957B (zh) * 2018-01-30 2019-10-15 维沃移动通信有限公司 一种印制电路板、印制电路板的制作方法及移动终端
JP7507024B2 (ja) * 2020-07-17 2024-06-27 ローム株式会社 半導体装置
EP4220706A1 (de) * 2022-02-01 2023-08-02 Siemens Aktiengesellschaft Anordnung für eine halbleiteranordnung mit mindestens einem passiven bauelement und einem substrat

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5991769U (ja) * 1982-12-13 1984-06-21 富士電気化学株式会社 部品実装用ランド形状
JPS61174795A (ja) * 1985-01-30 1986-08-06 株式会社東芝 印刷配線板及びそれに取り付けられるチツプ部品の半田付けチエツク方法
JPH02148884A (ja) * 1988-11-30 1990-06-07 Taiyo Yuden Co Ltd 電子部品塔載ランドとその形成方法
JPH0362U (ja) * 1989-05-19 1991-01-07
JPH03280591A (ja) * 1990-03-29 1991-12-11 Taiyo Yuden Co Ltd 電子部品の半田付方法
JP2809115B2 (ja) * 1993-10-13 1998-10-08 ヤマハ株式会社 半導体装置とその製造方法
JPH098441A (ja) 1995-06-22 1997-01-10 Fuji Electric Co Ltd 半導体装置
US5994648A (en) * 1997-03-27 1999-11-30 Ford Motor Company Three-dimensional molded sockets for mechanical and electrical component attachment
JP2002198638A (ja) 2000-12-27 2002-07-12 Shinko Electric Ind Co Ltd チップ部品の実装用基板及びその製造方法並びに実装構造及び実装方法
DE10256058A1 (de) 2002-11-30 2004-06-24 Semikron Elektronik Gmbh Leistungshalbleitermodul mit verbesserten EMV Eigenschaften
JP4458780B2 (ja) 2003-07-11 2010-04-28 シチズン電子株式会社 電波時計用のアンテナ装置
JP2006032511A (ja) 2004-07-14 2006-02-02 Citizen Electronics Co Ltd 基板及び実装基板
US7876577B2 (en) * 2007-03-12 2011-01-25 Tyco Electronics Corporation System for attaching electronic components to molded interconnection devices
KR20090129791A (ko) 2008-06-13 2009-12-17 가부시키가이샤 교토 소프트웨어 리서치 다치 플래시 메모리
CN101616544B (zh) 2009-08-12 2012-05-23 杭州华三通信技术有限公司 一种pcb组件及实现方法
CN104160502A (zh) * 2012-03-09 2014-11-19 三菱电机株式会社 半导体模块
JP5738226B2 (ja) * 2012-03-22 2015-06-17 三菱電機株式会社 電力用半導体装置モジュール

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