JP2015084378A - 電子部品、電子機器、実装部材の製造方法、電子部品の製造方法 - Google Patents

電子部品、電子機器、実装部材の製造方法、電子部品の製造方法 Download PDF

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Publication number
JP2015084378A
JP2015084378A JP2013222522A JP2013222522A JP2015084378A JP 2015084378 A JP2015084378 A JP 2015084378A JP 2013222522 A JP2013222522 A JP 2013222522A JP 2013222522 A JP2013222522 A JP 2013222522A JP 2015084378 A JP2015084378 A JP 2015084378A
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JP
Japan
Prior art keywords
frame
rigidity
region
electronic component
electronic device
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Pending
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JP2013222522A
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English (en)
Japanese (ja)
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JP2015084378A5 (https=
Inventor
隆典 鈴木
Takanori Suzuki
隆典 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
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Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2013222522A priority Critical patent/JP2015084378A/ja
Priority to US14/520,211 priority patent/US9576877B2/en
Publication of JP2015084378A publication Critical patent/JP2015084378A/ja
Publication of JP2015084378A5 publication Critical patent/JP2015084378A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

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  • Engineering & Computer Science (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2013222522A 2013-10-25 2013-10-25 電子部品、電子機器、実装部材の製造方法、電子部品の製造方法 Pending JP2015084378A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013222522A JP2015084378A (ja) 2013-10-25 2013-10-25 電子部品、電子機器、実装部材の製造方法、電子部品の製造方法
US14/520,211 US9576877B2 (en) 2013-10-25 2014-10-21 Electronic component, electronic device, method of manufacturing mounted member, and method of manufacturing electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013222522A JP2015084378A (ja) 2013-10-25 2013-10-25 電子部品、電子機器、実装部材の製造方法、電子部品の製造方法

Publications (2)

Publication Number Publication Date
JP2015084378A true JP2015084378A (ja) 2015-04-30
JP2015084378A5 JP2015084378A5 (https=) 2016-12-01

Family

ID=52995205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013222522A Pending JP2015084378A (ja) 2013-10-25 2013-10-25 電子部品、電子機器、実装部材の製造方法、電子部品の製造方法

Country Status (2)

Country Link
US (1) US9576877B2 (https=)
JP (1) JP2015084378A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015231732A (ja) * 2014-05-13 2015-12-24 キヤノン株式会社 液体吐出ヘッド
JP2018531525A (ja) * 2015-12-29 2018-10-25 チャイナ ウェーハ レベル シーエスピー カンパニー リミテッド イメージセンシングチップパッケージ構造およびそのパッケージ方法
US10735673B2 (en) 2018-04-27 2020-08-04 Canon Kabushiki Kaisha Imaging device module, imaging system, imaging device package, and manufacturing method
WO2023054246A1 (ja) * 2021-09-30 2023-04-06 京セラ株式会社 電子部品搭載用パッケージ及び電子装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6703029B2 (ja) * 2018-03-26 2020-06-03 キヤノン株式会社 電子モジュールおよび撮像システム
JP7406314B2 (ja) * 2019-06-24 2023-12-27 キヤノン株式会社 電子モジュール及び機器

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003100920A (ja) * 2001-09-25 2003-04-04 Kyocera Corp 光半導体素子収納用容器
JP2005101327A (ja) * 2003-09-25 2005-04-14 Kyocera Corp 半導体装置およびその製造方法
JP2011044695A (ja) * 2009-07-22 2011-03-03 Kyocera Corp 電子部品収納用パッケージ、および電子装置
JP2011249575A (ja) * 2010-05-27 2011-12-08 Kyocera Corp 配線基板および電子装置
JP2013077701A (ja) * 2011-09-30 2013-04-25 Canon Inc 電子部品および電子機器ならびにこれらの製造方法。
JP2013089739A (ja) * 2011-10-18 2013-05-13 Kyocera Corp 電子部品収納用パッケージおよび電子装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2746171B2 (ja) * 1995-02-21 1998-04-28 日本電気株式会社 固体撮像装置及びその製造方法
JP2007208045A (ja) * 2006-02-02 2007-08-16 Sony Corp 撮像装置、カメラモジュール、電子機器および撮像装置の製造方法
JP5518086B2 (ja) * 2009-09-29 2014-06-11 京セラ株式会社 素子収納用パッケージおよび実装構造体
JP5361663B2 (ja) 2009-10-29 2013-12-04 京セラ株式会社 素子収納用パッケージ、並びに実装構造体
JP2013093494A (ja) 2011-10-27 2013-05-16 Kyocera Corp 電子部品収納用パッケージおよび電子装置
JP2015103619A (ja) * 2013-11-22 2015-06-04 京セラ株式会社 素子収納用パッケージおよび実装構造体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003100920A (ja) * 2001-09-25 2003-04-04 Kyocera Corp 光半導体素子収納用容器
JP2005101327A (ja) * 2003-09-25 2005-04-14 Kyocera Corp 半導体装置およびその製造方法
JP2011044695A (ja) * 2009-07-22 2011-03-03 Kyocera Corp 電子部品収納用パッケージ、および電子装置
JP2011249575A (ja) * 2010-05-27 2011-12-08 Kyocera Corp 配線基板および電子装置
JP2013077701A (ja) * 2011-09-30 2013-04-25 Canon Inc 電子部品および電子機器ならびにこれらの製造方法。
JP2013089739A (ja) * 2011-10-18 2013-05-13 Kyocera Corp 電子部品収納用パッケージおよび電子装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015231732A (ja) * 2014-05-13 2015-12-24 キヤノン株式会社 液体吐出ヘッド
JP2018531525A (ja) * 2015-12-29 2018-10-25 チャイナ ウェーハ レベル シーエスピー カンパニー リミテッド イメージセンシングチップパッケージ構造およびそのパッケージ方法
US10735673B2 (en) 2018-04-27 2020-08-04 Canon Kabushiki Kaisha Imaging device module, imaging system, imaging device package, and manufacturing method
WO2023054246A1 (ja) * 2021-09-30 2023-04-06 京セラ株式会社 電子部品搭載用パッケージ及び電子装置
JPWO2023054246A1 (https=) * 2021-09-30 2023-04-06

Also Published As

Publication number Publication date
US20150116975A1 (en) 2015-04-30
US9576877B2 (en) 2017-02-21

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