JPWO2023054246A1 - - Google Patents

Info

Publication number
JPWO2023054246A1
JPWO2023054246A1 JP2023551466A JP2023551466A JPWO2023054246A1 JP WO2023054246 A1 JPWO2023054246 A1 JP WO2023054246A1 JP 2023551466 A JP2023551466 A JP 2023551466A JP 2023551466 A JP2023551466 A JP 2023551466A JP WO2023054246 A1 JPWO2023054246 A1 JP WO2023054246A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023551466A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023054246A1 publication Critical patent/JPWO2023054246A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/17—Containers or parts thereof characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
JP2023551466A 2021-09-30 2022-09-26 Pending JPWO2023054246A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021161125 2021-09-30
PCT/JP2022/035650 WO2023054246A1 (ja) 2021-09-30 2022-09-26 電子部品搭載用パッケージ及び電子装置

Publications (1)

Publication Number Publication Date
JPWO2023054246A1 true JPWO2023054246A1 (https=) 2023-04-06

Family

ID=85782638

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023551466A Pending JPWO2023054246A1 (https=) 2021-09-30 2022-09-26

Country Status (2)

Country Link
JP (1) JPWO2023054246A1 (https=)
WO (1) WO2023054246A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024225235A1 (ja) * 2023-04-25 2024-10-31 京セラ株式会社 電子部品収納用パッケージおよび電子モジュール

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11274340A (ja) * 1998-03-24 1999-10-08 Kyocera Corp 混成集積回路装置
JP2002076495A (ja) * 2000-08-31 2002-03-15 Sumitomo Electric Ind Ltd 光半導体気密封止容器
JP2011044695A (ja) * 2009-07-22 2011-03-03 Kyocera Corp 電子部品収納用パッケージ、および電子装置
JP2015084378A (ja) * 2013-10-25 2015-04-30 キヤノン株式会社 電子部品、電子機器、実装部材の製造方法、電子部品の製造方法
JP2016072341A (ja) * 2014-09-29 2016-05-09 日本碍子株式会社 センサノード用パッケージ
JP2018121017A (ja) * 2017-01-27 2018-08-02 京セラ株式会社 半導体パッケージおよび半導体装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11274340A (ja) * 1998-03-24 1999-10-08 Kyocera Corp 混成集積回路装置
JP2002076495A (ja) * 2000-08-31 2002-03-15 Sumitomo Electric Ind Ltd 光半導体気密封止容器
JP2011044695A (ja) * 2009-07-22 2011-03-03 Kyocera Corp 電子部品収納用パッケージ、および電子装置
JP2015084378A (ja) * 2013-10-25 2015-04-30 キヤノン株式会社 電子部品、電子機器、実装部材の製造方法、電子部品の製造方法
JP2016072341A (ja) * 2014-09-29 2016-05-09 日本碍子株式会社 センサノード用パッケージ
JP2018121017A (ja) * 2017-01-27 2018-08-02 京セラ株式会社 半導体パッケージおよび半導体装置

Also Published As

Publication number Publication date
WO2023054246A1 (ja) 2023-04-06

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