WO2023054246A1 - 電子部品搭載用パッケージ及び電子装置 - Google Patents

電子部品搭載用パッケージ及び電子装置 Download PDF

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Publication number
WO2023054246A1
WO2023054246A1 PCT/JP2022/035650 JP2022035650W WO2023054246A1 WO 2023054246 A1 WO2023054246 A1 WO 2023054246A1 JP 2022035650 W JP2022035650 W JP 2022035650W WO 2023054246 A1 WO2023054246 A1 WO 2023054246A1
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WO
WIPO (PCT)
Prior art keywords
frame
electronic component
component mounting
metal substrate
mounting package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/035650
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English (en)
French (fr)
Japanese (ja)
Inventor
耕治 久保田
真二 中本
俊之 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2023551466A priority Critical patent/JPWO2023054246A1/ja
Publication of WO2023054246A1 publication Critical patent/WO2023054246A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/17—Containers or parts thereof characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals

Definitions

  • the present disclosure relates to an electronic component mounting package and an electronic device.
  • Japanese Patent Application Laid-Open No. 2015-018884 describes a semiconductor element housing substrate in which a ceramic frame is positioned on a metal substrate so as to surround a semiconductor element housing portion.
  • An electronic component mounting package includes: a metal substrate having an electronic component mounting portion; a frame composed of a member having a coefficient of thermal expansion different from that of the metal substrate and positioned on the metal substrate; an intervening member positioned on the metal substrate; with The frame has at least a pair of side surfaces spaced apart from each other, The intervening member is positioned between the pair of side portions, The mounting portion is surrounded by the frame and the intervening member.
  • An electronic device includes: the electronic component mounting package; an electronic component mounted in the electronic component mounting package; Prepare.
  • FIG. 1 is a perspective view showing an electronic component mounting package and an electronic device according to an embodiment of the present disclosure
  • FIG. 1 is an exploded perspective view showing an electronic component mounting package and an electronic device according to an embodiment
  • FIG. BRIEF DESCRIPTION OF THE DRAWINGS It is a side view which shows the package for electronic component mounting of embodiment, and an electronic device. It is a top view which shows a metal substrate, a frame, and an intervening member in embodiment. It is a top view which shows the modification 1 of a frame. It is a perspective view which shows the modification 2 of a frame.
  • FIG. 11 is an enlarged side view showing a portion of an intervening member in an electronic component mounting package of Modification 3; FIG.
  • FIG. 11 is an enlarged plan view showing a part of an intervening member in an electronic component mounting package according to Modification 3; It is a figure explaining the modification 4 of a frame. It is a figure explaining the modification 5 of a frame. It is a figure explaining the modification 6 of a frame. It is a figure explaining the modification 7 of a frame.
  • FIG. 21 is an exploded perspective view showing a metal substrate, a frame, and an intervening member in an electronic component mounting package of modification 8;
  • FIG. 20 is a vertical cross-sectional view showing a metal substrate, a frame, and an intervening member in an electronic component mounting package of modification 8;
  • FIG. 21 is an exploded perspective view showing a frame, a lid, and an intervening member in an electronic component mounting package of Modification 9;
  • FIG. 21 is a vertical cross-sectional view showing a frame, a lid, and an intervening member in an electronic component mounting package of Modification 9;
  • FIG. 1 is a perspective view showing an electronic component mounting package and an electronic device according to an embodiment of the present disclosure.
  • FIG. 2 is an exploded perspective view showing the electronic component mounting package and the electronic device according to the embodiment.
  • FIG. 3 is a side view showing the electronic component mounting package and the electronic device according to the embodiment.
  • FIG. 4 is a plan view showing a metal substrate, a frame, and intervening members in the embodiment.
  • FIG. 1 shows a state in which the lid 50 is not attached.
  • the electronic component mounting package 1 includes, as shown in FIG. .
  • the lid 50 may be prepared separately from the electronic component mounting package 1 instead of being a component of the electronic component mounting package 1 .
  • An electronic device 100 includes an electronic component mounting package 1 and an electronic component 70 mounted on the electronic component mounting package 1 .
  • the electronic component 70 may be a semiconductor element for electric power use, or may be a semiconductor element for other uses.
  • the electronic component 70 may be another electronic element such as a capacitor or resistor, or may be a component that generates heat.
  • the metal substrate 10 has a mounting portion 11 on which the electronic component 70 is mounted on its upper surface.
  • the mounting portion 11 may be conductive like other portions of the metal substrate 10 .
  • the metal substrate 10 may have a flat plate shape, the mounting portion 11 may be recessed from the surroundings, the mounting portion 11 may protrude from the surroundings, or may have a stepped portion at any location. may be
  • the metal substrate 10 is made of metal.
  • the material of the metal substrate 10 may be Cu (copper: a metal containing 95% by mass or more of copper), aluminum, an aluminum alloy, or the like. This material can improve the heat dissipation of the metal substrate 10 and reduce the material cost.
  • the material of the metal substrate 10 may be a copper alloy such as CuW (copper-tungsten), CMC (copper-molybdenum-copper composite material), CPC (copper-copper-molybdenum-copper composite material), Other metals may also be used.
  • the frame 20 is positioned on the upper surface of the metal substrate 10 along the periphery of the mounting portion 11 .
  • the frame 20 has insulating properties.
  • the frame 20 is made of a material having a thermal expansion coefficient different from that of the metal substrate 10 .
  • the material of the frame 20 may be a ceramic such as an Al 2 O 3 ceramic, an AlN ceramic, or a 3Al 2 O 3 .2SiO 2 ceramic. Being ceramic provides high insulation and high strength.
  • the frame 20 has at least a pair of side portions ⁇ 23a1, 23a2 ⁇ , ⁇ 23b1, 23b2 ⁇ spaced apart from each other (see FIGS. 2 to 4).
  • the reference numerals of the pair of side portions are indicated by brackets.
  • the part between the pair of side parts positioned with a space therebetween is referred to as a "separation part”.
  • the frame 20 has at least one separating portion 23a, 23b.
  • the frame 20 may have a first frame member 21A and a second frame member 21B.
  • the first frame member 21A may be integrally constructed from a single material.
  • the second frame member 21B may be integrally constructed from a single material.
  • FIG. 5A is a plan view showing Modification 1 of the frame.
  • the frame body 20 may be configured from one frame member 21 and have one separating portion 23a.
  • FIG. 5B is a perspective view showing Modification 2 of the frame.
  • the first frame member 21A may have a base portion 28a integrally made of a single material and another material portion 28b such as a conductor. The other material portion 28b may be positioned so as not to divide the base portion 28a into a plurality of parts in the longitudinal direction of the first frame member 21A.
  • the intervening member 31a is positioned on the upper surface of the metal substrate 10 at the separating portion 23a (between the pair of side portions 23a1 and 23a2), as shown in FIGS.
  • the other intervening member 31b is positioned on the upper surface of the metal substrate 10 at the other separating portion 23b (between the pair of side portions 23b1 and 23b2).
  • the frame 20 and the intervening members 31a and 31b are joined via the joining material f. That is, the side portions 23a1, 23a2, 23b1, and 23b2 of the frame 20 are joined to the intervening members 31a and 31b via the joint material f, and the joint material f is positioned between the intervening members 31a and 31b and the frame 20. It is sealed by doing.
  • the frame 20 and intervening members 31a and 31b are joined to the metal substrate 10 via a joining material (not shown).
  • the mounting portion 11 is surrounded by a configuration in which the frame 20 and the intervening members 31a and 31b are combined.
  • the frame 20 has the separated portions 23a and 23b, and the intervening members 31a and 31b are positioned in the separated portions 23a and 23b. can be surrounded by Furthermore, with the above configuration, even if stress is generated between the frame 20 and the metal substrate 10, the stress is divided at the intervening members 31a and 31b. Therefore, deformation of the metal substrate 10 and the frame 20 due to stress is reduced, and the durability of the frame 20 can be improved. For example, after the metal substrate 10, the frame 20, and the intervening members 31a and 31b are joined at a high temperature, the stress is generated by the amount of thermal contraction of the metal substrate 10 and the heat of the frame 20 when the temperature drops to room temperature. It occurs due to the difference in contraction amount.
  • the lead terminals 40 are conductors, and are members for transmitting electrical signals or power between the inside and outside of the electronic component mounting package 1 .
  • the lead terminal 40 may have a thin plate shape, and extends from the outside of the frame 20 to the vicinity of the inside of the frame 20 in plan view.
  • the lead terminal 40 is joined to the top surface of the frame 20 .
  • the frame 20 may have a recess corresponding to the thickness of the lead terminal 40 at the portion where the lead terminal 40 is joined, or may not have the recess.
  • the lid body 50 covers the mounting portion 11 from above.
  • the upper side is the direction in which the frame 20 is positioned with respect to the metal substrate 10 .
  • the lid 50 may be plate-shaped.
  • the lid 50 may have insulating properties.
  • the lid 50 may be made of ceramic or resin.
  • Electronic component 70 is mounted on mounting portion 11 , and electronic component 70 and lead terminals 40 are electrically connected.
  • the lid 50 is bonded onto the frame 20 and the lead terminals 40 via a bonding material f1 (see FIG. 3).
  • the mounting portion 11 is sealed by the bonding of the lid 50 .
  • the frame 20 may have a plurality of separating portions 23a and 23b as shown in FIG. That is, the frame 20 may have a plurality of pairs of side portions ⁇ 23a1, 23a2 ⁇ , ⁇ 23b1, 23b2 ⁇ between which the intervening members 31a, 31b are positioned.
  • the frame 20 is divided into a plurality of frame members (the first frame member 21A and the second frame member 21B in FIG. 2), so the stress applied to the frame 20 can be divided into a plurality of parts. Therefore, deformation of the frame 20 due to stress is reduced, and the durability of the frame 20 can be further improved.
  • the combined configuration of the frame 20 and the intervening members 31a and 31b includes a first short side A1, a first long side A2, a second short side A3 and a second long side A4.
  • the frame 20 includes a first frame member 21A having a first short side A1, a part of the first long side A2, and a part of the second long side A4, and a second short side A3. , another part of the first long side A2, and a second frame member 21B having another part of the second long side A4.
  • Another portion means a portion other than the portion included in the first frame member 21A.
  • the first frame member 21A may be U-shaped or angular U-shaped in plan view.
  • the second frame member 21B may be U-shaped or angular U-shaped in plan view.
  • the first frame member 21A and the second frame member 21B may be symmetrical with respect to a plane that bisects the frame 20 in the longitudinal direction.
  • the rectangular mounting portion 11 can be secured. Furthermore, due to the above-described shapes of the first frame member 21A and the second frame member 21B, the separation portions 23a and 23b are positioned in the long portions (the first long side portion A2 and the second long side portion A4) of the frame 20. As a result, the stress applied to the long portion can be divided. Therefore, the amount of deformation of the frame 20 and the metal substrate 10 due to stress can be further reduced, and the durability of the electronic component mounting package 1 can be further improved.
  • the intervening members 31a and 31b may be made of metal. By being made of metal, the difference in coefficient of thermal expansion between the metal substrate 10 and the intervening members 31a and 31b is reduced, and the stress generated between the intervening members 31a and 31b and the metal substrate 10 can be reduced. In addition, by being made of metal, when a signal or power is transmitted between one side and the other side of the intervening member 31a in a plan view, crosstalk or noise propagation occurring between these signals or power can be suppressed. can be reduced. The same applies to the other intervening member 31b.
  • the metal material of the intervening members 31a and 31b may be the same as that of the metal substrate 10. FIG. The difference in coefficient of thermal expansion between the intervening members 31a and 31b and the metal substrate 10 can be further reduced. Further, a part of the intervening members 31a and 31b may include another material portion.
  • the intervening members 31a and 31b may be made of various members such as resin, ceramic, and low-melting glass.
  • the intervening members 31a and 31b may be composed of a member having a non-dielectric constant higher than that of ceramics and a member having thermal conductivity higher than that of ceramics.
  • a bonding material (not shown) that bonds the metal substrate 10 and the frame 20 may be an organic bonding material.
  • the organic bonding material is a bonding material whose main component is an organic substance, and may be an epoxy resin, a thermoplastic resin, a thermosetting resin, a rubber/elastomer, or the like.
  • the bonding material has a lower bonding temperature (temperature required for bonding) than brazing material or the like. Therefore, by applying the bonding material described above, the thermal stress generated when bonding the metal substrate 10 and the frame 20 can be reduced, and the durability of the electronic component mounting package 1 can be improved.
  • the bonding material (not shown) that bonds the metal substrate 10 and the intervening members 31a and 31b may be an organic bonding material. Since the bonding material has a lower bonding temperature than brazing material or the like, it is possible to reduce the thermal stress generated when the metal substrate 10 and the frame 20 are bonded together. Therefore, the durability of the electronic component mounting package 1 can be improved.
  • the bonding material f that bonds the frame 20 and the intervening members 31 a and 31 b may be the same as the bonding material that bonds the metal substrate 10 and the frame 20 . According to this configuration, the manufacturing cost of the electronic component mounting package 1 can be reduced by unifying the process of joining the metal substrate 10, the frame 20, and the intervening members 31a and 31b. Furthermore, since the bonding material f is an organic bonding material, it is superior in flexibility as compared with metal, so that the stress applied to the frame 20 can be absorbed at the separation portions 23a and 23b.
  • a bonding material (not shown) that bonds the lead terminal 40 and the frame 20 may be an organic bonding material. If the lead terminals 40 are to be brazed to the ceramic frame 20 , the joining portion of the frame 20 needs to be metallized. However, by applying the organic bonding material, the metallizing treatment can be omitted, and the manufacturing cost of the electronic component mounting package 1 can be reduced.
  • the lead terminals 40 and the frame 20 may be joined together by brazing, so that the joint strength between the lead terminals 40 and the frame 20 can be improved. In this case, the lead terminals 40 and the frame 20 may be joined before the metal substrate 10 and the frame 20 are joined.
  • FIG. 6A is an enlarged side view showing the location of an intervening member in the electronic component mounting package of Modification 3.
  • FIG. 6B is an enlarged plan view showing a portion of an intervening member in the electronic component mounting package of Modification 3.
  • the electronic component mounting package 1 and the electronic device 100 of Modification 3 are the same as those of the above-described embodiment except that the intervening members 31a and 31b are different.
  • the configuration of the intervening members 31a and 31b of Modification 3 is similarly applicable to Modification 1 described above and Modifications 4 to 7 described later.
  • the intervening member 31a may be an organic bonding material.
  • the intervening members 31a and 31b and the frame 20 do not have to be joined with another joining material. That is, the separated portions 23a and 23b of the frame body 20 are filled with a bonding material that has not yet been cured or is cured, and the bonding material is melted and cured, so that the cured bonding material becomes the intervening members 31a and 31b.
  • the members 31a and 31b and the frame body 20 can be joined.
  • the organic bonding material may be the same as the bonding material that bonds the metal substrate 10 and the frame 20 together.
  • the temperature at which the metal substrate 10 and the frame 20 are joined is close to the temperature at which the intervening members 31a and 31b are fixed, so the process of assembling the electronic component mounting package 1 is facilitated.
  • the distance between the pair of side portions ⁇ 23a1, 23a2 ⁇ , ⁇ 23b1, 23b2 ⁇ may be, for example, 1.5 mm or less. In this case, the separating portions 23a and 23b can be more easily filled with the bonding material.
  • the intervening members 31a and 31b are organic bonding materials, the stress applied to the frame 20 can be absorbed more at the separating portions 23a and 23b. Therefore, the deformation of the metal substrate 10 and the frame 20 due to stress is reduced, and the durability of the electronic component mounting package 1 can be further improved. Further, the steps of manufacturing the interposed members 31a and 31b and the steps of fixing the interposed members 31a and 31b can be integrated, and the number of manufacturing steps can be reduced, thereby reducing the manufacturing cost of the electronic component mounting package 1. FIG.
  • Warpage of the metal substrate was compared between the configuration of the comparative example and the configuration of Modified Example 3.
  • FIG. In the comparative example described above, as the frame body surrounding the mounting portion 11, an integral configuration was adopted without having the separation portions 23a and 23b.
  • the frame In the comparative example and the modified example 3, the frame was made of ceramic, the metal substrate was made of Cu, and the dimensions of the frame and the metal substrate were the same except for the separation portions 23a and 23b.
  • the frame and the metal substrate were bonded at 120 to 150° C., and the warp was measured after cooling to room temperature. As a result of the test, it was found that the warpage of Modification 3 was reduced to about 65% to 80% of the warpage of Comparative Example.
  • Modification 4-7) 7A to 7D are diagrams for explaining modifications of the frame, with FIG. 7A showing modification 4, FIG. 7B showing modification 5, FIG. 7C showing modification 6, and FIG. 7D showing modification 7, respectively.
  • FIGS. 7A to 7D the positions of the separating portions 23c to 23h, 23j to 23m, 23o to 23r, 23t, and 23u of the frame 20 can be varied.
  • the number and shape of the frame members 21C to 21H, 21J to 21M, 21O to 21R, 21T, and 21U that constitute the frame 20 can be varied.
  • the electronic component mounting packages of modified examples 4 to 7 have the number and shape of frame members 21C to 21H, 21J to 21M, 21O to 21R, 21T, and 21U, intervening members 31c to 31h, 31j to 31m, 31o to 31r, and 31t. , 31u are configured in the same manner as in the above-described embodiment except for the number, shape and arrangement of them.
  • the frame 20 of Modification 4 has a plurality of frame members 21C to 21H and a plurality of pairs of side portions ⁇ 23c1, 23c2 ⁇ to ⁇ 23h1, 23h2 ⁇ . Separation portions 23c to 23h are provided between the portions. Intervening members 31c to 31h are positioned in the separating portions 23c to 23h, respectively, and the plurality of frame members 21C to 21H are connected via the intervening members 31c to 31h.
  • each of the plurality of frame members 21C to 21H forming the frame 20 may be rectangular in plan view. With this shape, it is possible to reduce the concentration of stress on any part of each of the frame members 21C to 21H. Therefore, the durability of the electronic component mounting package 1 can be improved. Furthermore, according to this configuration, when manufacturing the frame members 21C to 21H, it is possible to reduce wasted portions when cutting out the portions to be the frame members 21C to 21H from one block (for example, a ceramic block before firing). , frame members 21C to 21H.
  • the frame member 21C may have a rounded shape (outwardly convex rounded shape) at the corner e in plan view.
  • the frame member 21C has a bottom surface facing the metal substrate 10, a top surface opposite to the bottom surface, and a plurality of side surfaces positioned between the bottom surface and the top surface. If the cross-sectional shape of the corner e between the two side surfaces (the first side surface and the second side surface) is an outwardly convex corner e, it may include an outwardly convex curve. According to this configuration, the concentration of stress applied between the metal substrate 10 and the frame member 21C at the corners e of the frame member 21C can be reduced, and the durability of the frame member 21C can be improved.
  • the other frame members 21D to 21H may have similar shapes.
  • the corner e it is not necessary for all the corners e to have a rounded shape, and if one corner e has a rounded shape, the collection of stress at the corner e can be reduced, and the durability of the corner e can be improved. can improve. Further, when the frame member has an inwardly convex corner (corner), the corner may have an inwardly convex round shape (a cross-sectional outline including an inwardly convex curved surface). , the same effect can be obtained with this configuration.
  • the frame 20 has two frame members 21C and 21H on one long side. According to this configuration, application of stress over a long range can be reduced, and the amount of deformation of the metal substrate 10 and the frame 20 caused by the stress can be reduced. The same applies to the other long side.
  • two rectangular frame members 21C and 21D are positioned so that their longitudinal directions intersect at one corner of the frame 20 (upper right corner of the paper surface of FIG. 7A).
  • a side portion 23d1 of one frame member 21C and a side portion 23d2 of the other frame member 21D are opposed to each other with a gap therebetween to form a separating portion 23d.
  • One side surface portion 23d1 is a part of the side surface along the longitudinal direction of the frame member 21C, and the other side surface portion 23d2 corresponds to a side surface that intersects the longitudinal direction of the frame member 21D.
  • the frame body 20 of Modification 5 has a plurality of frame members 21J to 21M and a plurality of pairs of side portions ⁇ 23j1, 23j2 ⁇ to ⁇ 23m1, 23m2 ⁇ . Separation portions 23j to 23m are provided between the portions. Interposed members 31j to 31m are positioned in the separating portions 23j to 23m, respectively.
  • both the long side and the short side of the frame 20 have separating portions 23j to 23m. Therefore, the stress is divided even in the short side portions, and the amount of deformation between the metal substrate 10 and the frame body 20 can be reduced. Therefore, the durability of the frame 20 is improved even in the short side portions.
  • each of the frame members 21J to 21M has an L shape in plan view. According to this configuration, when manufacturing the frame members 21J to 21M, it is possible to reduce wasteful portions when cutting out the portions to be the frame members 21J to 21M from one block (for example, a ceramic block before firing). It is possible to increase the number of parts that will be the members 21J to 21M. In addition, since the stress applied to the corners can be dispersed by reducing the number of corners of the frame members 21J to 21M, the durability of the electronic component mounting package 1 can be improved.
  • the frame body 20 of Modification 6 has a plurality of frame members 21O to 21R and a plurality of pairs of side portions ⁇ 23o1, 23o2 ⁇ to ⁇ 23r1, 23r2 ⁇ . Separation portions 23o to 23r are provided between the portions. Interposed members 31o to 31r are positioned in the separating portions 23o to 23r, respectively.
  • the plurality of frame members 21O to 21R include frame members 21P and 21R that are rectangular in plan view and frame members 21O and 21Q that are curved in plan view. More specifically, three frame members 21O, 21R, and 21Q are included in one long side of the frame (the long side on the upper side of the paper surface of FIG. 7C), and one long side of the frame 20 has two sides. It is divided by two separating parts 23q and 23r. The same applies to the other long side portion (the long side portion at the bottom of the page of FIG. 7C). According to this configuration, the stress applied along the longitudinal direction of the metal substrate 10 is divided into three parts, and the deformation of the metal substrate 10 and the frame 20 due to the stress can be further reduced. Therefore, the durability of the electronic component mounting package 1 can be further improved.
  • the frame members 21O and 21Q which are curved in plan view, have an angular U shape in plan view, but may be a simple U shape or a combination of a pair of L shapes. may be
  • the frame body 20 of Modification 7 has a plurality of frame members 21T and 21U and a plurality of pairs of side portions ⁇ 23t1, 23t2 ⁇ and ⁇ 23u1, 23u2 ⁇ . Separating portions 23t and 23u are provided between the portions. Interposed members 31u and 31u are located in the separating portions 23t and 23u, respectively.
  • the frame 20 has a separation portion 23u at a position deviated from the center in the longitudinal direction on one long side (the long side on the upper side of the paper surface of FIG. 7D). The same applies to the other long side portion (the long side portion on the lower side of the paper surface of FIG. 7D). More specifically, the frame 20 has two angular U-shaped frame members 21T and 21U. The two frame members 21T, 21U are asymmetric with respect to a plane that bisects the frame 20 in the longitudinal direction. Also in this configuration, the stress generated between the metal substrate 10 and the frame 20 can be separated in the longitudinal direction, and the deformation of the metal substrate 10 and the frame 20 caused by the stress can be reduced. Therefore, the durability of the electronic component mounting package 1 can be improved.
  • Modification 8 8A is an exploded perspective view showing a metal substrate, a frame, and an intervening member in an electronic component mounting package of Modification 8.
  • FIG. 8B is a vertical cross-sectional view showing a metal substrate, a frame, and an intervening member in the electronic component mounting package of Modification 8.
  • FIG. Modification 8 is the same as the above-described embodiment, except that the configurations of intervening members 12a and 12b are different. The configuration of the intervening members 12a and 12b of Modification 8 can be similarly applied to Modifications 1 and 4 to 7 described above.
  • the intervening members 12 a and 12 b of Modification 8 are integrated with the metal substrate 10 .
  • integrated may mean integrally formed from a single material.
  • the intervening members 12a and 12b are made of the same metal as the metal substrate 10, the difference in coefficient of thermal expansion between the metal substrate 10 and the intervening members 12a and 12b is small, and the intervening members 12a and 12b and the metal The stress generated between the substrate 10 can be reduced.
  • the intervening members 12a and 12b are made of metal, when a signal or power is transmitted between one side and the other side of the intervening member 12a in a plan view, crosstalk or power generated between these signals or power may occur. Noise propagation can be reduced. The same applies to the other intervening member 12b.
  • the intervening members 12a and 12b with the metal substrate 10, it is possible to reduce the number of components of the electronic component mounting package 1 and the number of assembly man-hours. Furthermore, in the step of bonding the frame 20 to the metal substrate 10, the alignment of the frame 20 becomes easier.
  • At least one intervening member may be integrated with the metal substrate 10 and the remaining intervening members may not be integrated with the metal substrate 10 .
  • Modification 9A is an exploded perspective view showing a frame, a lid, and an intervening member in the electronic component mounting package of Modification 9.
  • FIG. 9B is a vertical cross-sectional view showing a frame, a lid, and an intervening member in the electronic component mounting package of Modification 9.
  • FIG. Modification 9 is the same as the above-described embodiment, except that the configurations of intervening members 12a and 12b are different. The configuration of the intervening members 12a and 12b of Modification 9 is similarly applicable to Modifications 4 to 7 described above.
  • the intervening members 51 a and 51 b of Modification 9 are integrated with the lid 50 .
  • integrated may mean integrally formed from a single material. According to this configuration, it is possible to reduce the number of components of the electronic component mounting package 1 and reduce the number of assembly man-hours. Furthermore, in the step of joining the lid 50, alignment of the lid 50 can be facilitated.
  • a concave portion 53 may be positioned on the surface of the lid body 50 facing the metal substrate 10 . The concave portion 53 may be configured to avoid the lead wire (bonding wire or the like) connected to the lead terminal 40 (see FIG. 1).
  • the electronic component mounting package 1 has a plurality of intervening members, at least one intervening member may be integrated with the lid 50 and the remaining intervening members may not be integrated with the lid 50 . At least one of the intervening members that are not integrated with the lid 50 may be integrated with the metal substrate 10 as in the eighth modification.
  • the electronic component mounting package and the electronic device according to the present disclosure are not limited to the above embodiments.
  • the metal substrate 10 is shown as the substrate having the mounting portion 11 and to which the frame 20 is bonded.
  • SiC substrates have a smaller coefficient of thermal expansion than ceramics. Therefore, when the frame is made of ceramic and a SiC substrate is applied as the substrate, stress is generated between the frame and the SiC substrate after the bonding process, and the configuration of the present disclosure is useful. be.
  • the configuration of the present disclosure is particularly effective when the ratio of the coefficient of thermal expansion of the substrate to the coefficient of thermal expansion of the frame (frame member) is 1.4 or more or 0.7 or less.
  • the present disclosure can be used for electronic component mounting packages and electronic devices.

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  • Microelectronics & Electronic Packaging (AREA)
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PCT/JP2022/035650 2021-09-30 2022-09-26 電子部品搭載用パッケージ及び電子装置 Ceased WO2023054246A1 (ja)

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WO2024225235A1 (ja) * 2023-04-25 2024-10-31 京セラ株式会社 電子部品収納用パッケージおよび電子モジュール

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JPH11274340A (ja) * 1998-03-24 1999-10-08 Kyocera Corp 混成集積回路装置
JP2002076495A (ja) * 2000-08-31 2002-03-15 Sumitomo Electric Ind Ltd 光半導体気密封止容器
JP2011044695A (ja) * 2009-07-22 2011-03-03 Kyocera Corp 電子部品収納用パッケージ、および電子装置
JP2015084378A (ja) * 2013-10-25 2015-04-30 キヤノン株式会社 電子部品、電子機器、実装部材の製造方法、電子部品の製造方法
JP2016072341A (ja) * 2014-09-29 2016-05-09 日本碍子株式会社 センサノード用パッケージ
JP2018121017A (ja) * 2017-01-27 2018-08-02 京セラ株式会社 半導体パッケージおよび半導体装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11274340A (ja) * 1998-03-24 1999-10-08 Kyocera Corp 混成集積回路装置
JP2002076495A (ja) * 2000-08-31 2002-03-15 Sumitomo Electric Ind Ltd 光半導体気密封止容器
JP2011044695A (ja) * 2009-07-22 2011-03-03 Kyocera Corp 電子部品収納用パッケージ、および電子装置
JP2015084378A (ja) * 2013-10-25 2015-04-30 キヤノン株式会社 電子部品、電子機器、実装部材の製造方法、電子部品の製造方法
JP2016072341A (ja) * 2014-09-29 2016-05-09 日本碍子株式会社 センサノード用パッケージ
JP2018121017A (ja) * 2017-01-27 2018-08-02 京セラ株式会社 半導体パッケージおよび半導体装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024225235A1 (ja) * 2023-04-25 2024-10-31 京セラ株式会社 電子部品収納用パッケージおよび電子モジュール

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