JP2015084378A - 電子部品、電子機器、実装部材の製造方法、電子部品の製造方法 - Google Patents

電子部品、電子機器、実装部材の製造方法、電子部品の製造方法 Download PDF

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Publication number
JP2015084378A
JP2015084378A JP2013222522A JP2013222522A JP2015084378A JP 2015084378 A JP2015084378 A JP 2015084378A JP 2013222522 A JP2013222522 A JP 2013222522A JP 2013222522 A JP2013222522 A JP 2013222522A JP 2015084378 A JP2015084378 A JP 2015084378A
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JP
Japan
Prior art keywords
frame
rigidity
region
electronic component
electronic device
Prior art date
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Pending
Application number
JP2013222522A
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English (en)
Japanese (ja)
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JP2015084378A5 (enExample
Inventor
隆典 鈴木
Takanori Suzuki
隆典 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2013222522A priority Critical patent/JP2015084378A/ja
Priority to US14/520,211 priority patent/US9576877B2/en
Publication of JP2015084378A publication Critical patent/JP2015084378A/ja
Publication of JP2015084378A5 publication Critical patent/JP2015084378A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Manufacturing & Machinery (AREA)
JP2013222522A 2013-10-25 2013-10-25 電子部品、電子機器、実装部材の製造方法、電子部品の製造方法 Pending JP2015084378A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013222522A JP2015084378A (ja) 2013-10-25 2013-10-25 電子部品、電子機器、実装部材の製造方法、電子部品の製造方法
US14/520,211 US9576877B2 (en) 2013-10-25 2014-10-21 Electronic component, electronic device, method of manufacturing mounted member, and method of manufacturing electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013222522A JP2015084378A (ja) 2013-10-25 2013-10-25 電子部品、電子機器、実装部材の製造方法、電子部品の製造方法

Publications (2)

Publication Number Publication Date
JP2015084378A true JP2015084378A (ja) 2015-04-30
JP2015084378A5 JP2015084378A5 (enExample) 2016-12-01

Family

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JP2013222522A Pending JP2015084378A (ja) 2013-10-25 2013-10-25 電子部品、電子機器、実装部材の製造方法、電子部品の製造方法

Country Status (2)

Country Link
US (1) US9576877B2 (enExample)
JP (1) JP2015084378A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015231732A (ja) * 2014-05-13 2015-12-24 キヤノン株式会社 液体吐出ヘッド
JP2018531525A (ja) * 2015-12-29 2018-10-25 チャイナ ウェーハ レベル シーエスピー カンパニー リミテッド イメージセンシングチップパッケージ構造およびそのパッケージ方法
US10735673B2 (en) 2018-04-27 2020-08-04 Canon Kabushiki Kaisha Imaging device module, imaging system, imaging device package, and manufacturing method
JPWO2023054246A1 (enExample) * 2021-09-30 2023-04-06

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6703029B2 (ja) * 2018-03-26 2020-06-03 キヤノン株式会社 電子モジュールおよび撮像システム
JP7406314B2 (ja) * 2019-06-24 2023-12-27 キヤノン株式会社 電子モジュール及び機器

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003100920A (ja) * 2001-09-25 2003-04-04 Kyocera Corp 光半導体素子収納用容器
JP2005101327A (ja) * 2003-09-25 2005-04-14 Kyocera Corp 半導体装置およびその製造方法
JP2011044695A (ja) * 2009-07-22 2011-03-03 Kyocera Corp 電子部品収納用パッケージ、および電子装置
JP2011249575A (ja) * 2010-05-27 2011-12-08 Kyocera Corp 配線基板および電子装置
JP2013077701A (ja) * 2011-09-30 2013-04-25 Canon Inc 電子部品および電子機器ならびにこれらの製造方法。
JP2013089739A (ja) * 2011-10-18 2013-05-13 Kyocera Corp 電子部品収納用パッケージおよび電子装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2746171B2 (ja) * 1995-02-21 1998-04-28 日本電気株式会社 固体撮像装置及びその製造方法
JP2007208045A (ja) 2006-02-02 2007-08-16 Sony Corp 撮像装置、カメラモジュール、電子機器および撮像装置の製造方法
US8653649B2 (en) * 2009-09-29 2014-02-18 Kyocera Corporation Device housing package and mounting structure
JP5361663B2 (ja) 2009-10-29 2013-12-04 京セラ株式会社 素子収納用パッケージ、並びに実装構造体
JP2013093494A (ja) 2011-10-27 2013-05-16 Kyocera Corp 電子部品収納用パッケージおよび電子装置
JP2015103619A (ja) * 2013-11-22 2015-06-04 京セラ株式会社 素子収納用パッケージおよび実装構造体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003100920A (ja) * 2001-09-25 2003-04-04 Kyocera Corp 光半導体素子収納用容器
JP2005101327A (ja) * 2003-09-25 2005-04-14 Kyocera Corp 半導体装置およびその製造方法
JP2011044695A (ja) * 2009-07-22 2011-03-03 Kyocera Corp 電子部品収納用パッケージ、および電子装置
JP2011249575A (ja) * 2010-05-27 2011-12-08 Kyocera Corp 配線基板および電子装置
JP2013077701A (ja) * 2011-09-30 2013-04-25 Canon Inc 電子部品および電子機器ならびにこれらの製造方法。
JP2013089739A (ja) * 2011-10-18 2013-05-13 Kyocera Corp 電子部品収納用パッケージおよび電子装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015231732A (ja) * 2014-05-13 2015-12-24 キヤノン株式会社 液体吐出ヘッド
JP2018531525A (ja) * 2015-12-29 2018-10-25 チャイナ ウェーハ レベル シーエスピー カンパニー リミテッド イメージセンシングチップパッケージ構造およびそのパッケージ方法
US10735673B2 (en) 2018-04-27 2020-08-04 Canon Kabushiki Kaisha Imaging device module, imaging system, imaging device package, and manufacturing method
JPWO2023054246A1 (enExample) * 2021-09-30 2023-04-06
WO2023054246A1 (ja) * 2021-09-30 2023-04-06 京セラ株式会社 電子部品搭載用パッケージ及び電子装置

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Publication number Publication date
US20150116975A1 (en) 2015-04-30
US9576877B2 (en) 2017-02-21

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