200843048 九、發明說明： 【發明所屬之技術領域】 尤其係關於一種影像感 本發明關於一種影像感測器 測器封裝結構。 【先前技術】200843048 IX. Description of the invention: [Technical field to which the invention pertains] In particular, the invention relates to an image sensing device package structure. [Prior Art]
\ 隨著科技之不斷發展，攜帶式電子裝置如移動電話， 應用日m同時也日_向於輕巧、美觀及多功能化， 其中照相功能係近年流行的軸㈣之附加功能。應用於 移動電話之數位減倾不僅要滿足㈣短小之要^，其 還須具有較高之照相性能。•位相機影像感_組中ς 影像感測器係決定數位相機體積大小之主要因素之一，因 此’改善影像制i、之封I結構將有職縮小影像感測模 組之體積，進而可以縮小相機之體積。 先丽一種影像感測器，如圖i及圖2所示，該影像感 測器包括一基板1、一粘膠體2、複數焊線3、一影像感測 晶片4、一凸緣5以及一透明蓋6。其中所述粘膠體2用於 粘結影像感測晶片4於基板之上表面7上，並用焊線3電 性連接影像感測晶片4之焊墊δ至基板！之内接點9。所 述凸緣5用於與透明蓋6來密閉影像感測晶片4。 上述影像感測器之基板1之内接點9分佈於影像感測 晶片4之區域之四周，利用焊線3使得内接點9與影像感 測晶片4上之焊墊8電性導通，從而將影像感測晶片4上 所感測到之影像資料導出，但是，由於基板工上設置有内 接點9，增大了該基板1之使用面積，從而增大了該影像 7 200843048 感測器之體積，進而會增大了相機之體積。 . 【發明内容】 有鐾於此，有必要提供一種具有較小使用面積之基板 之影像感測晶片封裝結構。 一種影像感測器封裝結構，其包括一基板、一貼附於 基板上之影像感測晶片、一設置於所述基板上之凸緣。該 基板具有一用於貼附所述凸緣及影像感測晶片之第一表面 與一個設置有複數外接點之第二表面。所述凸緣内側壁上 設置有複數内接點，該内接點與第二表面之外接點電性導 通。所述影像感測晶片具有複數焊墊，該複數焊墊分別與 凸緣上之内接點電連接。 一種影像感測器封裝結構，其包括一基板，該基板具 有第一表面與第二表面，該第二表面設置有複數外接點; 一影像感測晶片，該影像感測晶片貼附於基板之上第一表 面，且所述影像感測晶片具有複數焊墊；一凸緣，該凸緣 , 與所述基板一體成型，並内側壁上設置有複數内接點；該内 " 接點與第二表面之外接點電性導通，該複數焊墊分別與凸 緣上之内接點電連接。 上述影像感測器封裝結構由於把基板上之内接點設 置於凸緣上，因此，基板不再需要設置内接點，從而可減 少基板之使用面積，進而縮小了基板及影像感測器之體積。 【實施方式】 為了對本發明作更進一步說明，舉以下較佳實施例並 配合圖式詳細描述如下。 8 200843048 請參閱圖3至圖5，本發明第一實施例之所提供之影 像感測器封裝結構，其包括一基板10、一影像感測晶片 11、一凸緣12、複數條焊線13，一透明蓋14以及粘膠體 15。所述影像感測晶片11通過粘膠體15貼附於基板10 上。所述凸緣12設置於所述基板10之邊緣，且所述透明 蓋14蓋設於凸緣12上，所述凸緣12與透明蓋14以及凸 緣12與基板10通過粘膠體15膠連在一起用於密封所述貼 附於基板10上之影像感測晶片11。 所述基板10可為一種具有一第一表面101與一第二 表面102之電路板’且其為形成有電路圖案（圖未不）之雙 層或複數層印刷電路板或陶瓷電路板。 該第一表面101上設置有一粘晶區103，優選地，所 述粘晶區103設置於所述基板10之第一表面101中央。 該第二表面102上設置有複數外接點104，優選地， 所述複數外接點104設置於第二表面102之周邊，以擴大 基板10之第二表面102中央之可利用面積，如用於散熱。 所述基板10之四周設置有複數貫穿於基板10之插孔 105，其個數與外接點104之個數相當。 所述粘膠體15可以為液態或粘稠膠態塗施之熱固性 環氧膠，如銀膠或B階樹脂膠，也可為紫外線固化膠體。 在本實施例中為銀膠。 所述影像感測晶片11可以為一種具有一感測表面111 及一對應於該感測表面111之背面112。該影像感測器11 可以為一積體電路晶片，用於感測所拍攝影像（圖未示）之 9 200843048 資訊。 該感測表面111之周邊設置有複數焊墊113，且該焊 墊113之個數與基板10之外接點104之個數相當。 該背面112通過粘膠體15固定於所述基板10之第一 表面101之粘晶區103。 所述凸緣12為一周邊封閉之無蓋無底之框形元件， 其高度大於所述影像感測晶片11之厚度。 該凸緣12之框形形狀與所述基板10之形狀相同，即 如果基板10為圓形，則該凸緣12所圍成之形狀也為圓形， 在本實施例中所述基板為矩形，故，該凸緣12所圍成之形 狀也為矩形。所述凸緣12所圍之面積與基板10之面積相 當。 該凸緣12可通過粘膠體15固定於所述基板10之第 一表面101之周邊。 在該凸緣12内側壁上設置有複數内接點121，該内接 點121之個數與焊墊113及基板10之外接點104之個數相 當，優選地，所述内接點121到基板10之最小高度大於影 像感測晶片11之厚度。 所述凸緣12上之内接點121與基板10上之外接點 104電連接，在本實施例中該凸緣12之内部設置有與所述 複數内接點121相連之導線122，且所述導線122從凸緣 12中延伸出來，而且從凸緣12延伸出來之部分之長度大 於基板10之厚度，該導線122 —端與内接點121電氣連 接，另一端穿過基板10上相對應之插孔105，並與基板10 10 200843048 之外接點104電氣連接。 所述焊線13用於連接影像感測晶片11之焊墊113與 内接點121，並使影像感測晶片11電性相連於基板10之 外接點104。該焊線13之材料可與焊墊113及内接點121 之材料相同。 所述透明蓋14可以為玻璃或透明塑膠，甚至可以為 透鏡，其用於與所述基板10、凸緣12 —起密封影像感測 晶片10，以避免該影像感測晶片10被灰塵等污染。 請參閱圖3及圖4，以組裝第一實施例所提供之影像 感測器封裝結構為例，其組裝方法包括以下步驟： 步驟一：提供所述之基板10，該基板10包括一具有 粘晶區103之第一表面101、一設置有複數外接點104之 第二表面102以及個數與外接點104之個數相當之插孔 105。 步驟二：將粘膠體15塗設於基板10之粘晶區103上， 並將影像感測晶片11貼附於該粘晶區103上。 步驟三：將粘膠體15塗設於露有導線122之凸緣12 之一端，並該粘膠體15不淹沒所述導線122延伸出於凸緣 12之部分。 步驟四：將凸緣12之導線122插設於基板10之相對 應之插孔105中，擠壓並固定該凸緣122於基板10之邊 緣，並使導線122與基板10之外接點104電性相連。 步驟五：將焊線13焊接於影像感測晶片11之焊墊113 與凸緣12之内接點121之間。 11 200843048 步驟六：在凸緣12相對於設置有導線122之另一端 塗設粘膠體15，並將透明蓋14蓋覆於凸緣12上，使得透 明蓋14、凸緣12以及基板10密封影像感測晶片11於其 所形成之空間中。 請參閱圖6及圖7，第二實施例所提供之影像感測器 封裝結構包括一基板20、一影像感測晶片21、一凸緣22、 複數條焊線23，一透明蓋24以及粘膠體25。所述影像感 測晶片21通過粘膠體25貼附於基板20上。如圖7所示， 第二實施例所提供之影像感測器之封裝結構與第一實施例 之封裝結構所不同的係所述基板20與所述凸緣22 —體成 型。所述凸緣22可以從基板20邊緣垂直於基板20延伸而 出，也可以從基板20邊緣遠離於基板20方向延伸而出， 在本實施例中所述凸緣22從基板20邊緣遠離於基板20 方向延伸而出，且該凸緣22與基板20為一體成型之撓性 板。 參閱圖6，所述基板20與第一實施例所提供之基板 10之區別在於，在所述基板20成型時，分別在基板20四 個邊之邊緣一體成型出與第一實施例之凸緣12形狀相同 之凸緣22。 所述基板20包括一第一表面201與一該第一表面201 相對之第二表面202，所述第二表面202上設置有複數外 接點204。 在該凸緣22之内侧壁上設置有複數内接點221，該内 接點221與所述基板20第二表面202之外接點204電連接。 12 200843048 在組裝時，只將凸緣22沿貼附於基板10上之影像感 測晶片21四個邊，並朝向影像感測晶片21之一面折疊起， 其他步驟，例如將焊線23焊接於内接點221與影像感測晶 片21之間，將透明蓋24利用粘膠體25貼附於凸緣22上， 與第一實施例所提供之影像感測器之封裝結構之組裝方法 一致。至此，第二實施例所提供之影像感測器已封裝完畢。 可以理解的是，當凸緣22係從基板20邊緣垂直於基 板20延伸而出時，還可省略上述之折疊步驟，只需將影像 感測晶片21貼附於基板20上，將焊線23焊接於内接點 221與影像感測晶片21之間並將透明蓋24利用粘膠體25 貼附於凸緣22上，該影像感測器就封裝完畢。 當然可以想到的是，為了補強基板20及凸緣22之強 度，可以在基板20及凸緣22之外侧壁貼裝較硬之板材（圖 未示）來加強基板20及凸緣22強度，也可以將彎折後之凸 緣22與影像感測晶片21之間隙中填充粘膠來其強度，從 而該凸緣22有躍然足夠之強度以支撐透明蓋24。 上述第一、二實施例所提供之影像感測器封裝結構將 設於基板周邊之内接點設置於所述凸緣12、22之内侧壁或 凸緣12、22之相對於相接基板10、20之另一面上，使得 基板10、20之使用面積變得更小，從而減小了影像感測器 之體積。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施例，本發 明之範圍並不以上述實施例為限，舉凡熟習本案技藝之人 13 200843048 士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於 以下申請專利範圍内。 【圖式簡单說明】 圖1係先前一種影像感測晶片之封裝結構之示意圖； 圖2係先前一種影像感測晶片之基板及組合有影像感 測晶片之平面結構不意圖， 圖3係本發明第一實施例所提供之影像感測器封裝結 構之基板及組合有影像感測晶片之平面結構不意圖； 圖4係圖3沿IV-IV線之截面示意圖； 圖5係圖3中之影像感測器之封裝結構之截面示意 圖； 圖6係第二實施例所提供之影像感測器之封裝結構之 截面示意圖； 圖7係圖6之影像感測器之基板及組合有影像感測晶 片之平面結構示意圖。 【主要元件符號說明】 基板 1 、 10 、 20 第一表面 7、101 第二表面 102 黏晶區 103 、 201 外接點 104 、 204 插孔 105 影像感侧晶片 4 、 11 、 21 感測表面 111 背面 112 焊墊 8、113 凸緣 5 、 12 、 22 内接點 9、121、221 導線 122 焊線 3 、 13 、 23 蓋板 6 、 14 、 24 粘膠體 2、15 14With the continuous development of technology, portable electronic devices such as mobile phones, the application day m is also light, beautiful and multi-functional, among which the camera function is an additional function of the popular axis (4) in recent years. The digital subtraction applied to mobile phones must not only satisfy the shortness of (4), but also must have high photographic performance. • Camera image sense _ group ς Image sensor is one of the main factors determining the size of the digital camera, so 'improving the image system i, the I structure will reduce the size of the image sensing module, and thus can be reduced The size of the camera. An image sensor, as shown in FIG. 1 and FIG. 2, the image sensor includes a substrate 1, a glue body 2, a plurality of bonding wires 3, an image sensing chip 4, a flange 5, and a Transparent cover 6. The adhesive body 2 is used for bonding the image sensing wafer 4 on the upper surface 7 of the substrate, and electrically connecting the pad δ of the image sensing wafer 4 to the substrate by the bonding wire 3! Within the junction 9. The flange 5 is used to seal the image sensing wafer 4 with the transparent cover 6. The inner contact 9 of the substrate 1 of the image sensor is distributed around the area of the image sensing wafer 4, and the inner contact 9 is electrically connected to the bonding pad 8 on the image sensing wafer 4 by using the bonding wire 3, thereby The image data sensed on the image sensing chip 4 is derived. However, since the substrate is provided with the internal contact 9, the use area of the substrate 1 is increased, thereby increasing the image 7 200843048 sensor The volume, which in turn increases the size of the camera. SUMMARY OF THE INVENTION Accordingly, it is desirable to provide an image sensing chip package structure having a substrate having a small area of use. An image sensor package structure includes a substrate, an image sensing wafer attached to the substrate, and a flange disposed on the substrate. The substrate has a first surface for attaching the flange and the image sensing wafer and a second surface provided with a plurality of external contacts. A plurality of inner contacts are disposed on the inner sidewall of the flange, and the inner contacts are electrically connected to the outer contacts of the second surface. The image sensing wafer has a plurality of pads that are electrically connected to internal contacts on the flanges, respectively. An image sensor package structure includes a substrate having a first surface and a second surface, the second surface is provided with a plurality of external contacts, and an image sensing chip attached to the substrate a first surface, and the image sensing wafer has a plurality of pads; a flange, the flange is integrally formed with the substrate, and the inner sidewall is provided with a plurality of internal contacts; the inner " contact The contacts outside the second surface are electrically connected, and the plurality of pads are electrically connected to the inner contacts on the flanges, respectively. Since the image sensor package structure is disposed on the flange on the substrate, the substrate no longer needs to be provided with internal contacts, thereby reducing the use area of the substrate, thereby reducing the substrate and the image sensor. volume. [Embodiment] In order to further clarify the present invention, the following preferred embodiments are described in detail below with reference to the drawings. The image sensor package structure of the first embodiment of the present invention includes a substrate 10, an image sensing wafer 11, a flange 12, and a plurality of bonding wires 13 , a transparent cover 14 and a glue body 15. The image sensing wafer 11 is attached to the substrate 10 through the adhesive 15 . The flange 12 is disposed at an edge of the substrate 10, and the transparent cover 14 is covered on the flange 12. The flange 12 and the transparent cover 14 and the flange 12 are glued to the substrate 10 through the adhesive body 15. Together, the image sensing wafer 11 attached to the substrate 10 is sealed. The substrate 10 can be a circuit board having a first surface 101 and a second surface 102 and is a two-layer or a plurality of printed circuit boards or ceramic circuit boards formed with a circuit pattern (not shown). The first surface 101 is provided with a die bonding region 103. Preferably, the die bonding region 103 is disposed at the center of the first surface 101 of the substrate 10. The second surface 102 is provided with a plurality of external contacts 104. Preferably, the plurality of external contacts 104 are disposed at the periphery of the second surface 102 to enlarge the available area of the second surface 102 of the substrate 10, such as for heat dissipation. . A plurality of insertion holes 105 penetrating through the substrate 10 are disposed around the substrate 10, and the number thereof is equivalent to the number of the external contacts 104. The viscose body 15 may be a liquid or viscous colloidal thermosetting epoxy glue, such as silver glue or B-stage resin glue, or may be an ultraviolet curing gel. In this embodiment, it is a silver paste. The image sensing wafer 11 can have a sensing surface 111 and a back surface 112 corresponding to the sensing surface 111. The image sensor 11 can be an integrated circuit chip for sensing information of a captured image (not shown). A plurality of pads 113 are disposed around the sensing surface 111, and the number of the pads 113 is equivalent to the number of the contacts 104 outside the substrate 10. The back surface 112 is fixed to the die bonding region 103 of the first surface 101 of the substrate 10 by the adhesive body 15. The flange 12 is a peripherally closed, frameless, bottomless frame-shaped component having a height greater than the thickness of the image sensing wafer 11. The frame shape of the flange 12 is the same as that of the substrate 10. That is, if the substrate 10 is circular, the shape of the flange 12 is also circular. In this embodiment, the substrate is rectangular. Therefore, the shape enclosed by the flange 12 is also rectangular. The area enclosed by the flange 12 is comparable to the area of the substrate 10. The flange 12 can be fixed to the periphery of the first surface 101 of the substrate 10 by a glue body 15. A plurality of inner contacts 121 are disposed on the inner side wall of the flange 12, and the number of the inner contacts 121 is equal to the number of the pads 113 and the outer contacts 104 of the substrate 10. Preferably, the inner contacts 121 are The minimum height of the substrate 10 is greater than the thickness of the image sensing wafer 11. The inner contact 121 on the flange 12 is electrically connected to the external contact 104 on the substrate 10. In the embodiment, the inner portion of the flange 12 is provided with a wire 122 connected to the plurality of inner contacts 121. The wire 122 extends from the flange 12, and the length of the portion extending from the flange 12 is greater than the thickness of the substrate 10. The wire 122 is electrically connected to the inner contact 121 and the other end is passed through the substrate 10. The jack 105 is electrically connected to the external contact 104 of the substrate 10 10 200843048. The bonding wire 13 is used to connect the pad 113 and the internal contact 121 of the image sensing chip 11 and electrically connect the image sensing die 11 to the external contact 104 of the substrate 10. The material of the bonding wire 13 can be the same as the material of the bonding pad 113 and the internal contact 121. The transparent cover 14 may be a glass or a transparent plastic, and may even be a lens for sealing the image sensing wafer 10 together with the substrate 10 and the flange 12 to prevent the image sensing wafer 10 from being contaminated by dust or the like. . Referring to FIG. 3 and FIG. 4 , the image sensor package structure provided in the first embodiment is assembled as an example. The assembly method includes the following steps: Step 1: providing the substrate 10 , the substrate 10 includes a paste The first surface 101 of the crystal region 103, a second surface 102 provided with a plurality of external contacts 104, and a plurality of sockets 105 corresponding to the number of external contacts 104. Step 2: Applying the adhesive 15 to the die-bonding region 103 of the substrate 10, and attaching the image sensing wafer 11 to the die-bonding region 103. Step 3: The adhesive body 15 is applied to one end of the flange 12 on which the wire 122 is exposed, and the adhesive body 15 does not submerge the portion of the wire 122 extending from the flange 12. Step 4: Insert the wire 122 of the flange 12 into the corresponding insertion hole 105 of the substrate 10, press and fix the flange 122 to the edge of the substrate 10, and electrically connect the wire 122 to the external contact 104 of the substrate 10. Sexual connection. Step 5: The bonding wire 13 is soldered between the pad 113 of the image sensing wafer 11 and the inner contact 121 of the flange 12. 11 200843048 Step 6: Apply the adhesive 15 to the flange 12 opposite to the other end on which the wire 122 is disposed, and cover the transparent cover 14 on the flange 12 so that the transparent cover 14, the flange 12 and the substrate 10 seal the image. The wafer 11 is sensed in the space in which it is formed. Referring to FIG. 6 and FIG. 7 , the image sensor package structure provided by the second embodiment includes a substrate 20 , an image sensing wafer 21 , a flange 22 , a plurality of bonding wires 23 , a transparent cover 24 , and a bonding layer . Colloid 25. The image sensing wafer 21 is attached to the substrate 20 via the adhesive body 25. As shown in FIG. 7, the package structure of the image sensor provided in the second embodiment is different from the package structure of the first embodiment in that the substrate 20 and the flange 22 are integrally formed. The flange 22 may extend from the edge of the substrate 20 perpendicular to the substrate 20 or may extend away from the edge of the substrate 20 away from the substrate 20. In the embodiment, the flange 22 is away from the edge of the substrate 20 away from the substrate. The flexible plate is integrally formed in the direction of 20, and the flange 22 and the substrate 20 are integrally formed. Referring to FIG. 6, the substrate 20 is different from the substrate 10 provided in the first embodiment in that, when the substrate 20 is formed, the flange of the first embodiment is integrally formed on the edges of the four sides of the substrate 20, respectively. 12 flanges 22 of identical shape. The substrate 20 includes a first surface 201 opposite to a second surface 202 of the first surface 201, and the second surface 202 is provided with a plurality of external contacts 204. A plurality of inner contacts 221 are disposed on the inner side wall of the flange 22, and the inner contacts 221 are electrically connected to the outer contacts 204 of the second surface 202 of the substrate 20. 12 200843048 At the time of assembly, only the flange 22 is attached to the four sides of the image sensing wafer 21 attached to the substrate 10, and folded toward one side of the image sensing wafer 21, and other steps, such as soldering the bonding wire 23 to Between the inner contact 221 and the image sensing wafer 21, the transparent cover 24 is attached to the flange 22 by the adhesive body 25, which is consistent with the assembly method of the image sensor package structure provided in the first embodiment. So far, the image sensor provided by the second embodiment has been packaged. It can be understood that when the flange 22 extends from the edge of the substrate 20 perpendicular to the substrate 20, the folding step described above may be omitted, and only the image sensing wafer 21 is attached to the substrate 20, and the bonding wire 23 is attached. Soldering between the inner contact 221 and the image sensing wafer 21 and attaching the transparent cover 24 to the flange 22 by the adhesive 25, the image sensor is packaged. It is of course conceivable that in order to reinforce the strength of the substrate 20 and the flange 22, a hard plate (not shown) may be attached to the outer side of the substrate 20 and the flange 22 to strengthen the strength of the substrate 20 and the flange 22. The gap between the folded flange 22 and the image sensing wafer 21 can be filled with adhesive to its strength, so that the flange 22 has sufficient strength to support the transparent cover 24. The image sensor package structure provided in the first and second embodiments is disposed on the inner side of the flanges 12, 22 or the flanges 12, 22 opposite to the interface substrate 10 at the inner periphery of the substrate. On the other side of the 20, the use area of the substrates 10, 20 is made smaller, thereby reducing the volume of the image sensor. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and those skilled in the art will be equivalent to the modification of the spirit of the present invention. Changes are to be covered by the following patent applications. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a package structure of a conventional image sensing chip; FIG. 2 is a schematic view of a substrate of a prior image sensing chip and a planar structure in which an image sensing wafer is combined, FIG. 3 is a schematic view. The substrate of the image sensor package structure and the planar structure of the image sensing chip provided by the first embodiment of the invention are not intended; FIG. 4 is a schematic cross-sectional view along line IV-IV of FIG. 3; FIG. 6 is a schematic cross-sectional view showing a package structure of an image sensor according to a second embodiment; FIG. 7 is a substrate and a combination of image sensing of the image sensor of FIG. Schematic diagram of the planar structure of the wafer. [Main component symbol description] substrate 1, 10, 20 first surface 7, 101 second surface 102 die bonding region 103, 201 external contact 104, 204 jack 105 image sensing side wafer 4, 11, 21 sensing surface 111 back 112 pads 8, 113 flanges 5, 12, 22 internal contacts 9, 121, 221 conductors 122 bonding wires 3, 13, 23 cover plates 6, 14, 24 adhesives 2, 15 14