JP2015043426A - チップ間の無線電力伝送のためのアンテナ - Google Patents
チップ間の無線電力伝送のためのアンテナ Download PDFInfo
- Publication number
- JP2015043426A JP2015043426A JP2014170307A JP2014170307A JP2015043426A JP 2015043426 A JP2015043426 A JP 2015043426A JP 2014170307 A JP2014170307 A JP 2014170307A JP 2014170307 A JP2014170307 A JP 2014170307A JP 2015043426 A JP2015043426 A JP 2015043426A
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- JP
- Japan
- Prior art keywords
- antenna
- chips
- chip
- wireless power
- power transmission
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F38/00—Adaptations of transformers or inductances for specific applications or functions
- H01F38/14—Inductive couplings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/28—Combinations of substantially independent non-interacting antenna units or systems
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/05—Circuit arrangements or systems for wireless supply or distribution of electric power using capacitive coupling
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/40—Circuit arrangements or systems for wireless supply or distribution of electric power using two or more transmitting or receiving devices
- H02J50/402—Circuit arrangements or systems for wireless supply or distribution of electric power using two or more transmitting or receiving devices the two or more transmitting or the two or more receiving devices being integrated in the same unit, e.g. power mats with several coils or antennas with several sub-antennas
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Details Of Aerials (AREA)
- Near-Field Transmission Systems (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
【解決手段】本発明は、3次元無線チップパッケージでチップ間の無線電力伝送のためのアンテナにおいて、3次元無線チップパッケージは、送信アンテナを通じて交流電力を伝送する第1チップと、第1チップの上面または下面に順に積層されて、それぞれの受信アンテナを通じて第1チップから交流電力を受信する複数の第2チップと、を含み、それぞれの受信アンテナは、複数の第2チップに個別形成されるが、送信アンテナの上部または下部で互いに上下方向に重畳されない位置に区画されて形成されているチップ間の無線電力伝送のためのアンテナを提供する。
【選択図】図2
Description
Claims (5)
- 3次元無線チップパッケージでチップ間の無線電力伝送のためのアンテナにおいて、
前記3次元無線チップパッケージは、
送信アンテナを通じて交流電力を伝送する第1チップと、前記第1チップの上面または下面に順に積層されて、それぞれの受信アンテナを通じて前記第1チップから前記交流電力を受信する複数の第2チップと、を含み、
前記それぞれの受信アンテナは、
前記複数の第2チップに個別形成されるが、前記送信アンテナの上部または下部で互いに上下方向に重畳されない位置に区画されて形成されているチップ間の無線電力伝送のためのアンテナ。 - 前記それぞれの受信アンテナは、
前記送信アンテナとの離隔距離によって異なるサイズに形成された請求項1に記載のチップ間の無線電力伝送のためのアンテナ。 - 前記それぞれの受信アンテナは、
前記送信アンテナとの離隔距離が大きいほど大きなサイズに形成された請求項2に記載のチップ間の無線電力伝送のためのアンテナ。 - 前記それぞれの受信アンテナは、
前記送信アンテナとの離隔距離の二乗に比例するサイズに形成された請求項3に記載のチップ間の無線電力伝送のためのアンテナ。 - 前記それぞれの受信アンテナのサイズの和は、
前記送信アンテナのサイズと同一である請求項3に記載のチップ間の無線電力伝送のためのアンテナ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2013-0101079 | 2013-08-26 | ||
KR1020130101079A KR101456795B1 (ko) | 2013-08-26 | 2013-08-26 | 칩 간 무선 전력 전송을 위한 안테나 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015043426A true JP2015043426A (ja) | 2015-03-05 |
JP5916818B2 JP5916818B2 (ja) | 2016-05-11 |
Family
ID=51999046
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014170307A Active JP5916818B2 (ja) | 2013-08-26 | 2014-08-25 | チップ間の無線電力伝送のためのアンテナ |
Country Status (4)
Country | Link |
---|---|
US (1) | US9460848B2 (ja) |
JP (1) | JP5916818B2 (ja) |
KR (1) | KR101456795B1 (ja) |
TW (1) | TWI569506B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9653927B2 (en) | 2012-08-10 | 2017-05-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Composite integrated circuits and methods for wireless interactions therewith |
KR101609733B1 (ko) * | 2015-02-02 | 2016-04-06 | 주식회사 아이티엠반도체 | 안테나 모듈 패키지, 안테나 모듈 패키지 회로, 이를 포함하는 배터리 팩 및 이를 포함하는 모바일 장치 |
US20180323253A1 (en) * | 2017-05-02 | 2018-11-08 | Micron Technology, Inc. | Semiconductor devices with through-substrate coils for wireless signal and power coupling |
US20180323369A1 (en) | 2017-05-02 | 2018-11-08 | Micron Technology, Inc. | Inductors with through-substrate via cores |
US10134671B1 (en) | 2017-05-02 | 2018-11-20 | Micron Technology, Inc. | 3D interconnect multi-die inductors with through-substrate via cores |
US10872843B2 (en) | 2017-05-02 | 2020-12-22 | Micron Technology, Inc. | Semiconductor devices with back-side coils for wireless signal and power coupling |
NL2027140B1 (nl) * | 2020-12-17 | 2022-07-11 | Herman Johan Mensink Clemens | Een werkwijze voor het capacitief overdragen van energie en een halfgeleidercomponent en apparaat voor gebruik met de werkwijze |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61119012A (ja) * | 1984-11-15 | 1986-06-06 | Toyo Commun Equip Co Ltd | 粗結合トランス |
JP2005228981A (ja) * | 2004-02-13 | 2005-08-25 | Keio Gijuku | 電子回路 |
JP2012190882A (ja) * | 2011-03-09 | 2012-10-04 | Hitachi Maxell Energy Ltd | コイル装置およびそれを用いた非接触電力伝送装置 |
JP2013021245A (ja) * | 2011-07-14 | 2013-01-31 | Renesas Electronics Corp | インダクタ |
JP2013141362A (ja) * | 2012-01-05 | 2013-07-18 | Shindengen Electric Mfg Co Ltd | 非接触給電制御回路 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8975752B2 (en) * | 2008-01-09 | 2015-03-10 | Oracle America, Inc. | Multiple access over proximity communication |
JP5671200B2 (ja) * | 2008-06-03 | 2015-02-18 | 学校法人慶應義塾 | 電子回路 |
KR101414779B1 (ko) * | 2010-10-20 | 2014-07-03 | 한국전자통신연구원 | 무선 전력 전송 장치 |
KR101364992B1 (ko) * | 2011-01-28 | 2014-02-20 | 삼성전자주식회사 | 무선 전력 전송 장치 및 방법 |
FR2977098B1 (fr) * | 2011-06-21 | 2016-06-24 | Tekcem | Emetteur pour transmission multivoie puce-a-puce en champ proche |
KR101213090B1 (ko) | 2011-07-14 | 2012-12-18 | 유한회사 한림포스텍 | 무선전력 전송장치용 코어 어셈블리 및 그를 구비하는 무선전력 전송장치 |
TW201316642A (zh) * | 2011-10-12 | 2013-04-16 | Tdk Taiwan Corp | 近場通訊與無線充電共用感應模組的選擇方法及其選擇電路 |
US9086452B2 (en) * | 2012-08-10 | 2015-07-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Three-dimensional integrated circuit and method for wireless information access thereof |
CN204242218U (zh) * | 2012-12-07 | 2015-04-01 | 株式会社村田制作所 | 天线模块 |
-
2013
- 2013-08-26 KR KR1020130101079A patent/KR101456795B1/ko active IP Right Grant
-
2014
- 2014-08-25 JP JP2014170307A patent/JP5916818B2/ja active Active
- 2014-08-26 US US14/468,330 patent/US9460848B2/en not_active Expired - Fee Related
- 2014-08-26 TW TW103129250A patent/TWI569506B/zh not_active IP Right Cessation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61119012A (ja) * | 1984-11-15 | 1986-06-06 | Toyo Commun Equip Co Ltd | 粗結合トランス |
JP2005228981A (ja) * | 2004-02-13 | 2005-08-25 | Keio Gijuku | 電子回路 |
US20070289772A1 (en) * | 2004-02-13 | 2007-12-20 | Tadahiro Kuroda | Electronic Circuit |
JP2012190882A (ja) * | 2011-03-09 | 2012-10-04 | Hitachi Maxell Energy Ltd | コイル装置およびそれを用いた非接触電力伝送装置 |
JP2013021245A (ja) * | 2011-07-14 | 2013-01-31 | Renesas Electronics Corp | インダクタ |
JP2013141362A (ja) * | 2012-01-05 | 2013-07-18 | Shindengen Electric Mfg Co Ltd | 非接触給電制御回路 |
Also Published As
Publication number | Publication date |
---|---|
JP5916818B2 (ja) | 2016-05-11 |
US9460848B2 (en) | 2016-10-04 |
TW201517376A (zh) | 2015-05-01 |
US20150054710A1 (en) | 2015-02-26 |
KR101456795B1 (ko) | 2014-10-31 |
TWI569506B (zh) | 2017-02-01 |
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