FR2977098B1 - Emetteur pour transmission multivoie puce-a-puce en champ proche - Google Patents
Emetteur pour transmission multivoie puce-a-puce en champ procheInfo
- Publication number
- FR2977098B1 FR2977098B1 FR1101902A FR1101902A FR2977098B1 FR 2977098 B1 FR2977098 B1 FR 2977098B1 FR 1101902 A FR1101902 A FR 1101902A FR 1101902 A FR1101902 A FR 1101902A FR 2977098 B1 FR2977098 B1 FR 2977098B1
- Authority
- FR
- France
- Prior art keywords
- transmission
- chip
- multivoie
- near field
- chip near
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000005540 biological transmission Effects 0.000 title 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/20—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by the transmission technique; characterised by the transmission medium
- H04B5/24—Inductive coupling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/45—Differential amplifiers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/20—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by the transmission technique; characterised by the transmission medium
- H04B5/22—Capacitive coupling
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Amplifiers (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1101902A FR2977098B1 (fr) | 2011-06-21 | 2011-06-21 | Emetteur pour transmission multivoie puce-a-puce en champ proche |
PCT/IB2012/052709 WO2012176081A1 (fr) | 2011-06-21 | 2012-05-30 | Émetteur pour transmission multicanaux de puce à puce en champ proche |
US14/128,440 US9525465B2 (en) | 2011-06-21 | 2012-05-30 | Transmitter for near-field chip-to-chip multichannel transmission |
KR1020137033602A KR101569982B1 (ko) | 2011-06-21 | 2012-05-30 | 근접장 칩-투-칩 다중채널 송신용 송신기 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1101902A FR2977098B1 (fr) | 2011-06-21 | 2011-06-21 | Emetteur pour transmission multivoie puce-a-puce en champ proche |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2977098A1 FR2977098A1 (fr) | 2012-12-28 |
FR2977098B1 true FR2977098B1 (fr) | 2016-06-24 |
Family
ID=46456958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1101902A Active FR2977098B1 (fr) | 2011-06-21 | 2011-06-21 | Emetteur pour transmission multivoie puce-a-puce en champ proche |
Country Status (4)
Country | Link |
---|---|
US (1) | US9525465B2 (fr) |
KR (1) | KR101569982B1 (fr) |
FR (1) | FR2977098B1 (fr) |
WO (1) | WO2012176081A1 (fr) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101456795B1 (ko) * | 2013-08-26 | 2014-10-31 | 숭실대학교산학협력단 | 칩 간 무선 전력 전송을 위한 안테나 |
US10014578B2 (en) | 2014-05-05 | 2018-07-03 | Nxp B.V. | Body antenna system |
US9819075B2 (en) | 2014-05-05 | 2017-11-14 | Nxp B.V. | Body communication antenna |
US10015604B2 (en) | 2014-05-05 | 2018-07-03 | Nxp B.V. | Electromagnetic induction field communication |
US10009069B2 (en) | 2014-05-05 | 2018-06-26 | Nxp B.V. | Wireless power delivery and data link |
US9819395B2 (en) | 2014-05-05 | 2017-11-14 | Nxp B.V. | Apparatus and method for wireless body communication |
US9812788B2 (en) * | 2014-11-24 | 2017-11-07 | Nxp B.V. | Electromagnetic field induction for inter-body and transverse body communication |
US9819097B2 (en) | 2015-08-26 | 2017-11-14 | Nxp B.V. | Antenna system |
US10320086B2 (en) | 2016-05-04 | 2019-06-11 | Nxp B.V. | Near-field electromagnetic induction (NFEMI) antenna |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL15978C (fr) | 1924-07-07 | |||
FR1101902A (fr) | 1954-05-21 | 1955-10-12 | Talon de chaussure | |
FR2896360B1 (fr) | 2006-01-17 | 2008-10-31 | Excem Soc Par Actions Simplifi | Amplificateur a entrees multiples et sorties multiples |
FR2902946B1 (fr) | 2006-06-23 | 2008-08-29 | Excem Sas | Amplificateur a entrees multiples et sorties multiples utilisant l'induction mutuelle dans le reseau de retroaction |
FR2904165B1 (fr) * | 2006-07-18 | 2008-11-28 | Excem Soc Par Actions Simplifiee | Procede et dispositif pour la reception radioelectrique utilisant une pluralite d'antennes |
JP4893483B2 (ja) * | 2006-09-11 | 2012-03-07 | ソニー株式会社 | 通信システム |
JP4345850B2 (ja) * | 2006-09-11 | 2009-10-14 | ソニー株式会社 | 通信システム及び通信装置 |
EP1926223B1 (fr) * | 2006-11-21 | 2018-02-28 | Sony Corporation | Système et appareil de communication |
FR2917921B1 (fr) * | 2007-06-21 | 2011-02-11 | Excem | Dispositif d'interface pseudo-differentiel avec circuit de terminaison |
US8975752B2 (en) * | 2008-01-09 | 2015-03-10 | Oracle America, Inc. | Multiple access over proximity communication |
US8415777B2 (en) * | 2008-02-29 | 2013-04-09 | Broadcom Corporation | Integrated circuit with millimeter wave and inductive coupling and methods for use therewith |
FR2933823B1 (fr) * | 2008-07-11 | 2011-10-28 | Excem | Amplificateur a entrees multiples et sorties multiples ayant des entrees pseudo-differentielles |
US20110127953A1 (en) * | 2009-11-30 | 2011-06-02 | Broadcom Corporation | Wireless power system |
KR20110091380A (ko) * | 2010-02-05 | 2011-08-11 | 삼성전자주식회사 | 터치 패널의 노이즈 보상 방법 및 장치 |
-
2011
- 2011-06-21 FR FR1101902A patent/FR2977098B1/fr active Active
-
2012
- 2012-05-30 WO PCT/IB2012/052709 patent/WO2012176081A1/fr active Application Filing
- 2012-05-30 US US14/128,440 patent/US9525465B2/en active Active
- 2012-05-30 KR KR1020137033602A patent/KR101569982B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
US9525465B2 (en) | 2016-12-20 |
US20140315486A1 (en) | 2014-10-23 |
FR2977098A1 (fr) | 2012-12-28 |
KR101569982B1 (ko) | 2015-11-17 |
KR20140023387A (ko) | 2014-02-26 |
WO2012176081A1 (fr) | 2012-12-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FI11263U1 (fi) | Voimansiirtolaite | |
DE112012005262A5 (de) | Kupplungseinrichtung | |
DE112012002913T8 (de) | Leistungsübertragungsvorrichtung | |
DE102012214245A8 (de) | Multistream-Datenübertragung | |
ITMI20131486A1 (it) | Trasmissione epicicloidale | |
FR2977098B1 (fr) | Emetteur pour transmission multivoie puce-a-puce en champ proche | |
EP2690800A4 (fr) | Dispositif de transmission optique | |
FI20125974A (fi) | Liitin | |
IT1404805B1 (it) | Disperdenti | |
UA23983S (uk) | Навушник | |
DE102012107360A8 (de) | Transmission | |
EP2730808A4 (fr) | Transmission | |
BR112014011524A2 (pt) | transmissão sem fio | |
FI20115050A0 (fi) | Sähkötehon siirtolaitteisto | |
EP2685229A4 (fr) | Dispositif de transmission de force motrice | |
EP2698564A4 (fr) | Dispositif de transmission de puissance | |
DE112012004637A5 (de) | Kupplungsvorrichtung | |
DE112012001982A5 (de) | Verstellpumpe | |
DE112012000655A5 (de) | Kupplungsvorrichtung | |
GB201103278D0 (en) | Transmission arrangement | |
DK2721324T3 (da) | Gearkasseisolator | |
DE112012001762A5 (de) | Kupplungsvorrichtung | |
DE112012001968A5 (de) | Verstellpumpe | |
DE112012001285A5 (de) | Getriebeeinrichtung | |
EP2730809A4 (fr) | Transmission |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TP | Transmission of property |
Owner name: APPLE INC., US Effective date: 20130129 |
|
PLFP | Fee payment |
Year of fee payment: 5 |
|
PLFP | Fee payment |
Year of fee payment: 6 |
|
PLFP | Fee payment |
Year of fee payment: 7 |
|
PLFP | Fee payment |
Year of fee payment: 8 |
|
PLFP | Fee payment |
Year of fee payment: 10 |
|
PLFP | Fee payment |
Year of fee payment: 11 |
|
PLFP | Fee payment |
Year of fee payment: 12 |
|
PLFP | Fee payment |
Year of fee payment: 13 |