FR2977098B1 - Emetteur pour transmission multivoie puce-a-puce en champ proche - Google Patents

Emetteur pour transmission multivoie puce-a-puce en champ proche

Info

Publication number
FR2977098B1
FR2977098B1 FR1101902A FR1101902A FR2977098B1 FR 2977098 B1 FR2977098 B1 FR 2977098B1 FR 1101902 A FR1101902 A FR 1101902A FR 1101902 A FR1101902 A FR 1101902A FR 2977098 B1 FR2977098 B1 FR 2977098B1
Authority
FR
France
Prior art keywords
transmission
chip
multivoie
near field
chip near
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1101902A
Other languages
English (en)
Other versions
FR2977098A1 (fr
Inventor
Frederic Broyde
Evelyne Clavelier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Apple Inc
Original Assignee
Tekcem SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tekcem SAS filed Critical Tekcem SAS
Priority to FR1101902A priority Critical patent/FR2977098B1/fr
Priority to PCT/IB2012/052709 priority patent/WO2012176081A1/fr
Priority to US14/128,440 priority patent/US9525465B2/en
Priority to KR1020137033602A priority patent/KR101569982B1/ko
Publication of FR2977098A1 publication Critical patent/FR2977098A1/fr
Application granted granted Critical
Publication of FR2977098B1 publication Critical patent/FR2977098B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B5/00Near-field transmission systems, e.g. inductive or capacitive transmission systems
    • H04B5/20Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by the transmission technique; characterised by the transmission medium
    • H04B5/24Inductive coupling
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64Impedance arrangements
    • H01L23/66High-frequency adaptations
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F3/00Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/45Differential amplifiers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B5/00Near-field transmission systems, e.g. inductive or capacitive transmission systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657Stacked arrangements of devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B5/00Near-field transmission systems, e.g. inductive or capacitive transmission systems
    • H04B5/20Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by the transmission technique; characterised by the transmission medium
    • H04B5/22Capacitive coupling

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Amplifiers (AREA)
FR1101902A 2011-06-21 2011-06-21 Emetteur pour transmission multivoie puce-a-puce en champ proche Active FR2977098B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR1101902A FR2977098B1 (fr) 2011-06-21 2011-06-21 Emetteur pour transmission multivoie puce-a-puce en champ proche
PCT/IB2012/052709 WO2012176081A1 (fr) 2011-06-21 2012-05-30 Émetteur pour transmission multicanaux de puce à puce en champ proche
US14/128,440 US9525465B2 (en) 2011-06-21 2012-05-30 Transmitter for near-field chip-to-chip multichannel transmission
KR1020137033602A KR101569982B1 (ko) 2011-06-21 2012-05-30 근접장 칩-투-칩 다중채널 송신용 송신기

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1101902A FR2977098B1 (fr) 2011-06-21 2011-06-21 Emetteur pour transmission multivoie puce-a-puce en champ proche

Publications (2)

Publication Number Publication Date
FR2977098A1 FR2977098A1 (fr) 2012-12-28
FR2977098B1 true FR2977098B1 (fr) 2016-06-24

Family

ID=46456958

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1101902A Active FR2977098B1 (fr) 2011-06-21 2011-06-21 Emetteur pour transmission multivoie puce-a-puce en champ proche

Country Status (4)

Country Link
US (1) US9525465B2 (fr)
KR (1) KR101569982B1 (fr)
FR (1) FR2977098B1 (fr)
WO (1) WO2012176081A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101456795B1 (ko) * 2013-08-26 2014-10-31 숭실대학교산학협력단 칩 간 무선 전력 전송을 위한 안테나
US10014578B2 (en) 2014-05-05 2018-07-03 Nxp B.V. Body antenna system
US9819075B2 (en) 2014-05-05 2017-11-14 Nxp B.V. Body communication antenna
US10015604B2 (en) 2014-05-05 2018-07-03 Nxp B.V. Electromagnetic induction field communication
US10009069B2 (en) 2014-05-05 2018-06-26 Nxp B.V. Wireless power delivery and data link
US9819395B2 (en) 2014-05-05 2017-11-14 Nxp B.V. Apparatus and method for wireless body communication
US9812788B2 (en) * 2014-11-24 2017-11-07 Nxp B.V. Electromagnetic field induction for inter-body and transverse body communication
US9819097B2 (en) 2015-08-26 2017-11-14 Nxp B.V. Antenna system
US10320086B2 (en) 2016-05-04 2019-06-11 Nxp B.V. Near-field electromagnetic induction (NFEMI) antenna

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL15978C (fr) 1924-07-07
FR1101902A (fr) 1954-05-21 1955-10-12 Talon de chaussure
FR2896360B1 (fr) 2006-01-17 2008-10-31 Excem Soc Par Actions Simplifi Amplificateur a entrees multiples et sorties multiples
FR2902946B1 (fr) 2006-06-23 2008-08-29 Excem Sas Amplificateur a entrees multiples et sorties multiples utilisant l'induction mutuelle dans le reseau de retroaction
FR2904165B1 (fr) * 2006-07-18 2008-11-28 Excem Soc Par Actions Simplifiee Procede et dispositif pour la reception radioelectrique utilisant une pluralite d'antennes
JP4893483B2 (ja) * 2006-09-11 2012-03-07 ソニー株式会社 通信システム
JP4345850B2 (ja) * 2006-09-11 2009-10-14 ソニー株式会社 通信システム及び通信装置
EP1926223B1 (fr) * 2006-11-21 2018-02-28 Sony Corporation Système et appareil de communication
FR2917921B1 (fr) * 2007-06-21 2011-02-11 Excem Dispositif d'interface pseudo-differentiel avec circuit de terminaison
US8975752B2 (en) * 2008-01-09 2015-03-10 Oracle America, Inc. Multiple access over proximity communication
US8415777B2 (en) * 2008-02-29 2013-04-09 Broadcom Corporation Integrated circuit with millimeter wave and inductive coupling and methods for use therewith
FR2933823B1 (fr) * 2008-07-11 2011-10-28 Excem Amplificateur a entrees multiples et sorties multiples ayant des entrees pseudo-differentielles
US20110127953A1 (en) * 2009-11-30 2011-06-02 Broadcom Corporation Wireless power system
KR20110091380A (ko) * 2010-02-05 2011-08-11 삼성전자주식회사 터치 패널의 노이즈 보상 방법 및 장치

Also Published As

Publication number Publication date
US9525465B2 (en) 2016-12-20
US20140315486A1 (en) 2014-10-23
FR2977098A1 (fr) 2012-12-28
KR101569982B1 (ko) 2015-11-17
KR20140023387A (ko) 2014-02-26
WO2012176081A1 (fr) 2012-12-27

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