JP2015037193A5 - - Google Patents
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- Publication number
- JP2015037193A5 JP2015037193A5 JP2014164134A JP2014164134A JP2015037193A5 JP 2015037193 A5 JP2015037193 A5 JP 2015037193A5 JP 2014164134 A JP2014164134 A JP 2014164134A JP 2014164134 A JP2014164134 A JP 2014164134A JP 2015037193 A5 JP2015037193 A5 JP 2015037193A5
- Authority
- JP
- Japan
- Prior art keywords
- ceramic body
- electrode
- electrodes
- external
- lead portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 140
- 239000003985 ceramic capacitor Substances 0.000 claims description 78
- 239000000758 substrate Substances 0.000 claims description 29
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 11
- 230000005534 acoustic noise Effects 0.000 description 11
- 239000003990 capacitor Substances 0.000 description 9
- 238000007747 plating Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910010293 ceramic material Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 229910000314 transition metal oxide Inorganic materials 0.000 description 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020130095952A KR20140038876A (ko) | 2013-08-13 | 2013-08-13 | 적층 세라믹 커패시터 및 그 실장 기판 |
| KR10-2013-0095952 | 2013-08-13 | ||
| KR1020140087022A KR101659155B1 (ko) | 2013-08-13 | 2014-07-10 | 적층 세라믹 커패시터 및 그 실장 기판 |
| KR10-2014-0087022 | 2014-07-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015037193A JP2015037193A (ja) | 2015-02-23 |
| JP2015037193A5 true JP2015037193A5 (enExample) | 2015-07-30 |
Family
ID=50647002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014164134A Pending JP2015037193A (ja) | 2013-08-13 | 2014-08-12 | 積層セラミックキャパシター及びその実装基板 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2015037193A (enExample) |
| KR (3) | KR20140038876A (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9098891B2 (en) * | 2013-04-08 | 2015-08-04 | Kla-Tencor Corp. | Adaptive sampling for semiconductor inspection recipe creation, defect review, and metrology |
| CN106537534B (zh) * | 2014-07-30 | 2019-07-26 | 京瓷株式会社 | 层叠型电子部件及其安装构造体 |
| JP2014220528A (ja) | 2014-08-13 | 2014-11-20 | 株式会社村田製作所 | 積層コンデンサ |
| JP2014222783A (ja) | 2014-08-13 | 2014-11-27 | 株式会社村田製作所 | 積層コンデンサ及び積層コンデンサの実装構造体 |
| JP2014241452A (ja) | 2014-08-13 | 2014-12-25 | 株式会社村田製作所 | 積層セラミック電子部品 |
| JP2015019079A (ja) | 2014-08-13 | 2015-01-29 | 株式会社村田製作所 | 積層セラミック電子部品 |
| JP2015019083A (ja) | 2014-08-13 | 2015-01-29 | 株式会社村田製作所 | 積層コンデンサ及び積層コンデンサの実装構造体 |
| JP2014239259A (ja) | 2014-08-13 | 2014-12-18 | 株式会社村田製作所 | 積層コンデンサ及び積層コンデンサの実装構造体 |
| JP2015035630A (ja) | 2014-11-13 | 2015-02-19 | 株式会社村田製作所 | ３端子型コンデンサ |
| JP2015065455A (ja) | 2014-11-13 | 2015-04-09 | 株式会社村田製作所 | ３端子型コンデンサ |
| JP2015079980A (ja) | 2014-12-04 | 2015-04-23 | 株式会社村田製作所 | ３端子型コンデンサ |
| US9214282B1 (en) | 2014-12-08 | 2015-12-15 | Murata Manufacturing Co., Ltd. | Three-terminal capacitor |
| KR101681410B1 (ko) | 2015-04-20 | 2016-11-30 | 삼성전기주식회사 | 커패시터 부품 |
| KR102189802B1 (ko) * | 2015-12-15 | 2020-12-11 | 삼성전기주식회사 | 복합 전자 부품 및 그 실장 기판 |
| KR102473414B1 (ko) * | 2017-10-12 | 2022-12-02 | 삼성전기주식회사 | 적층형 전자 부품 및 그 실장 기판 |
| KR20200063452A (ko) * | 2018-11-28 | 2020-06-05 | 주식회사 모다이노칩 | 적층형 소자 |
| KR102803433B1 (ko) | 2019-12-13 | 2025-05-07 | 삼성전기주식회사 | 전자 부품 |
| KR20230100880A (ko) | 2021-12-29 | 2023-07-06 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6048230U (ja) * | 1983-09-11 | 1985-04-04 | 株式会社村田製作所 | 積層コンデンサ |
| US6950300B2 (en) | 2003-05-06 | 2005-09-27 | Marvell World Trade Ltd. | Ultra low inductance multi layer ceramic capacitor |
| US7920370B2 (en) * | 2007-02-05 | 2011-04-05 | Samsung Electro-Mechanics Co., Ltd. | Multilayer chip capacitor |
| KR100920614B1 (ko) * | 2007-02-05 | 2009-10-08 | 삼성전기주식회사 | 적층형 칩 커패시터 |
| JP2009021512A (ja) * | 2007-07-13 | 2009-01-29 | Taiyo Yuden Co Ltd | 積層コンデンサ |
| KR100867505B1 (ko) * | 2007-09-19 | 2008-11-07 | 삼성전기주식회사 | 적층형 칩 커패시터 실장용 회로기판 및 적층형 칩커패시터를 구비한 회로기판 장치 |
| KR100925603B1 (ko) * | 2007-09-28 | 2009-11-06 | 삼성전기주식회사 | 적층형 캐패시터 |
| JP4730424B2 (ja) * | 2008-11-17 | 2011-07-20 | 株式会社村田製作所 | 積層コンデンサ |
| KR101025999B1 (ko) * | 2008-12-12 | 2011-03-30 | 삼성전기주식회사 | 회로기판 장치 및 집적회로 장치 |
| KR101187538B1 (ko) * | 2010-02-19 | 2012-10-02 | 가부시키가이샤 무라타 세이사쿠쇼 | 콘덴서 및 그 제조방법 |
| KR101548774B1 (ko) * | 2011-08-26 | 2015-08-31 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
| JP5884653B2 (ja) * | 2011-09-01 | 2016-03-15 | 株式会社村田製作所 | 実装構造 |
-
2013
- 2013-08-13 KR KR1020130095952A patent/KR20140038876A/ko active Pending
-
2014
- 2014-07-10 KR KR1020140087022A patent/KR101659155B1/ko active Active
- 2014-08-12 JP JP2014164134A patent/JP2015037193A/ja active Pending
-
2015
- 2015-06-12 KR KR1020150083644A patent/KR101952860B1/ko active Active
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