JP2015035531A - 回路基板及び電子機器 - Google Patents

回路基板及び電子機器 Download PDF

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Publication number
JP2015035531A
JP2015035531A JP2013166262A JP2013166262A JP2015035531A JP 2015035531 A JP2015035531 A JP 2015035531A JP 2013166262 A JP2013166262 A JP 2013166262A JP 2013166262 A JP2013166262 A JP 2013166262A JP 2015035531 A JP2015035531 A JP 2015035531A
Authority
JP
Japan
Prior art keywords
solder
circuit board
land
mounting land
resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013166262A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015035531A5 (enExample
Inventor
光一 小田垣
Koichi Odagaki
光一 小田垣
収一 加藤
Shuichi Kato
収一 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2013166262A priority Critical patent/JP2015035531A/ja
Priority to US14/453,146 priority patent/US9521749B2/en
Publication of JP2015035531A publication Critical patent/JP2015035531A/ja
Publication of JP2015035531A5 publication Critical patent/JP2015035531A5/ja
Pending legal-status Critical Current

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Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing & Machinery (AREA)
JP2013166262A 2013-08-09 2013-08-09 回路基板及び電子機器 Pending JP2015035531A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013166262A JP2015035531A (ja) 2013-08-09 2013-08-09 回路基板及び電子機器
US14/453,146 US9521749B2 (en) 2013-08-09 2014-08-06 Circuit substrate and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013166262A JP2015035531A (ja) 2013-08-09 2013-08-09 回路基板及び電子機器

Publications (2)

Publication Number Publication Date
JP2015035531A true JP2015035531A (ja) 2015-02-19
JP2015035531A5 JP2015035531A5 (enExample) 2016-09-08

Family

ID=52448500

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013166262A Pending JP2015035531A (ja) 2013-08-09 2013-08-09 回路基板及び電子機器

Country Status (2)

Country Link
US (1) US9521749B2 (enExample)
JP (1) JP2015035531A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190038139A (ko) * 2017-09-29 2019-04-08 엘지이노텍 주식회사 인쇄회로기판

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD729808S1 (en) * 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
USD780763S1 (en) * 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
JP6750862B2 (ja) * 2016-07-13 2020-09-02 キヤノン株式会社 撮像素子およびその実装基板
CN110996551B (zh) * 2019-11-22 2021-03-05 珠海景旺柔性电路有限公司 厚补强凹槽内贴器件的加工方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08139233A (ja) * 1994-11-08 1996-05-31 Matsushita Electric Ind Co Ltd モジュール部品
JPH0974267A (ja) * 1995-09-04 1997-03-18 Matsushita Electric Ind Co Ltd 回路基板
JPH10335797A (ja) * 1997-05-29 1998-12-18 Canon Inc 回路基板、及び電子回路装置の製造方法
JP2004158575A (ja) * 2002-11-05 2004-06-03 Kyocera Corp 半導体素子収納用パッケージおよびこれを用いた半導体装置
JP2006049675A (ja) * 2004-08-06 2006-02-16 Matsushita Electric Ind Co Ltd 半導体装置
JP2006073601A (ja) * 2004-08-31 2006-03-16 Olympus Corp プリント配線基板
JP2007012850A (ja) * 2005-06-30 2007-01-18 Omron Corp 回路基板
JP2010010203A (ja) * 2008-06-24 2010-01-14 Alps Electric Co Ltd 半導体チップの実装構造

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6849805B2 (en) * 2000-12-28 2005-02-01 Canon Kabushiki Kaisha Printed wiring board and electronic apparatus
US8216930B2 (en) * 2006-12-14 2012-07-10 Stats Chippac, Ltd. Solder joint flip chip interconnection having relief structure
JP2006303173A (ja) 2005-04-20 2006-11-02 Mitsubishi Electric Corp 回路基板デバイスおよびその製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08139233A (ja) * 1994-11-08 1996-05-31 Matsushita Electric Ind Co Ltd モジュール部品
JPH0974267A (ja) * 1995-09-04 1997-03-18 Matsushita Electric Ind Co Ltd 回路基板
JPH10335797A (ja) * 1997-05-29 1998-12-18 Canon Inc 回路基板、及び電子回路装置の製造方法
JP2004158575A (ja) * 2002-11-05 2004-06-03 Kyocera Corp 半導体素子収納用パッケージおよびこれを用いた半導体装置
JP2006049675A (ja) * 2004-08-06 2006-02-16 Matsushita Electric Ind Co Ltd 半導体装置
JP2006073601A (ja) * 2004-08-31 2006-03-16 Olympus Corp プリント配線基板
JP2007012850A (ja) * 2005-06-30 2007-01-18 Omron Corp 回路基板
JP2010010203A (ja) * 2008-06-24 2010-01-14 Alps Electric Co Ltd 半導体チップの実装構造

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190038139A (ko) * 2017-09-29 2019-04-08 엘지이노텍 주식회사 인쇄회로기판
KR102422055B1 (ko) * 2017-09-29 2022-07-18 엘지이노텍 주식회사 인쇄회로기판

Also Published As

Publication number Publication date
US9521749B2 (en) 2016-12-13
US20150043184A1 (en) 2015-02-12

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