JP2015029105A5 - - Google Patents

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Publication number
JP2015029105A5
JP2015029105A5 JP2014164252A JP2014164252A JP2015029105A5 JP 2015029105 A5 JP2015029105 A5 JP 2015029105A5 JP 2014164252 A JP2014164252 A JP 2014164252A JP 2014164252 A JP2014164252 A JP 2014164252A JP 2015029105 A5 JP2015029105 A5 JP 2015029105A5
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JP
Japan
Prior art keywords
wafer
support plate
adhesive composition
adhesive
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014164252A
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English (en)
Japanese (ja)
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JP2015029105A (ja
JP6212450B2 (ja
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Priority to JP2014164252A priority Critical patent/JP6212450B2/ja
Priority claimed from JP2014164252A external-priority patent/JP6212450B2/ja
Publication of JP2015029105A publication Critical patent/JP2015029105A/ja
Publication of JP2015029105A5 publication Critical patent/JP2015029105A5/ja
Application granted granted Critical
Publication of JP6212450B2 publication Critical patent/JP6212450B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014164252A 2012-08-10 2014-08-12 ウエハの処理方法 Expired - Fee Related JP6212450B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014164252A JP6212450B2 (ja) 2012-08-10 2014-08-12 ウエハの処理方法

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2012178576 2012-08-10
JP2012178576 2012-08-10
JP2012264463 2012-12-03
JP2012264463 2012-12-03
JP2013122027 2013-06-10
JP2013122027 2013-06-10
JP2014164252A JP6212450B2 (ja) 2012-08-10 2014-08-12 ウエハの処理方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2013538746A Division JP5639280B2 (ja) 2012-08-10 2013-08-06 ウエハの処理方法

Publications (3)

Publication Number Publication Date
JP2015029105A JP2015029105A (ja) 2015-02-12
JP2015029105A5 true JP2015029105A5 (https=) 2016-07-07
JP6212450B2 JP6212450B2 (ja) 2017-10-11

Family

ID=50068085

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2013538746A Active JP5639280B2 (ja) 2012-08-10 2013-08-06 ウエハの処理方法
JP2014164252A Expired - Fee Related JP6212450B2 (ja) 2012-08-10 2014-08-12 ウエハの処理方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2013538746A Active JP5639280B2 (ja) 2012-08-10 2013-08-06 ウエハの処理方法

Country Status (6)

Country Link
US (1) US9855734B2 (https=)
JP (2) JP5639280B2 (https=)
KR (1) KR101516147B1 (https=)
CN (1) CN104520974B (https=)
TW (1) TWI539535B (https=)
WO (1) WO2014024861A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6564325B2 (ja) * 2014-02-07 2019-08-21 積水化学工業株式会社 ウエハの処理方法
CN107922796B (zh) * 2015-07-06 2020-09-25 蓝星有机硅法国两合公司 自粘多层制品及其制备方法
KR102521872B1 (ko) * 2015-11-26 2023-04-14 가부시끼가이샤 레조낙 전자 부품의 제조방법, 가고정용 수지 조성물, 가고정용 수지 필름 및 가고정용 수지 필름 시트
CN108243615B (zh) * 2016-02-29 2021-03-09 琳得科株式会社 半导体加工片
CN112218926A (zh) * 2018-06-06 2021-01-12 积水化学工业株式会社 粘合带
CN112424308A (zh) * 2018-09-10 2021-02-26 昭和电工株式会社 粘接片
JP7640675B2 (ja) * 2021-03-26 2025-03-05 三井化学Ictマテリア株式会社 ウエハの処理方法
JPWO2023127395A1 (https=) * 2021-12-28 2023-07-06
WO2024024862A1 (ja) 2022-07-28 2024-02-01 日東電工株式会社 接合体、接合体の解体方法および接合体に用いられる熱硬化性粘着剤
KR20250041152A (ko) 2022-07-28 2025-03-25 닛토덴코 가부시키가이샤 점착 시트 및 점착 시트의 박리 방법
KR20250041153A (ko) 2022-07-28 2025-03-25 닛토덴코 가부시키가이샤 점착 시트 및 점착 시트의 박리 방법
CN120476186A (zh) 2023-01-30 2025-08-12 日东电工株式会社 粘合片材
TW202432760A (zh) 2023-01-30 2024-08-16 日商日東電工股份有限公司 黏著片材

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003231872A (ja) 2001-08-03 2003-08-19 Sekisui Chem Co Ltd 両面粘着テープ及びそれを用いたｉｃチップの製造方法
JP3532186B2 (ja) 2002-01-11 2004-05-31 旭化成ケミカルズ株式会社 半導体ウエハーの加工方法
US7534498B2 (en) * 2002-06-03 2009-05-19 3M Innovative Properties Company Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body
JP2004022634A (ja) 2002-06-13 2004-01-22 Sekisui Chem Co Ltd ウエハ支持体及び半導体ウエハの製造方法
JP2004182797A (ja) 2002-11-29 2004-07-02 Sekisui Chem Co Ltd 両面粘着テープ及びｉｃチップの製造方法
EP1918341A4 (en) * 2005-08-05 2012-08-15 Hitachi Chemical Co Ltd ADHESIVE FOIL AND MACHINE SEMI-FINISHING DEVICE
JP2009146974A (ja) * 2007-12-12 2009-07-02 Sekisui Chem Co Ltd 半導体加工用両面粘着テープ
KR101386367B1 (ko) 2007-12-12 2014-04-16 세키스이가가쿠 고교가부시키가이샤 반도체 가공용 양면 점착 테이프 및 반도체 가공용 테이프
JP5448430B2 (ja) 2007-12-18 2014-03-19 古河電気工業株式会社 ウエハ貼着用貼着シートおよびウエハの加工方法
JP5519971B2 (ja) * 2008-11-26 2014-06-11 日東電工株式会社 ダイシング・ダイボンドフィルム及び半導体装置の製造方法
TWI490303B (zh) 2008-12-01 2015-07-01 Furukawa Electric Co Ltd Wafer adhesive tape and wafer processing methods
JP2010205807A (ja) 2009-03-02 2010-09-16 Jsr Corp 被覆層形成方法
JP5437111B2 (ja) 2010-03-01 2014-03-12 日東電工株式会社 ダイボンドフィルム、ダイシング・ダイボンドフィルム及び半導体装置
JP4846067B2 (ja) 2010-03-24 2011-12-28 積水化学工業株式会社 半導体ウエハの処理方法及びｔｓｖウエハの製造方法
US8852391B2 (en) * 2010-06-21 2014-10-07 Brewer Science Inc. Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate
JP5130405B2 (ja) * 2010-09-16 2013-01-30 積水化学工業株式会社 粘着剤組成物、粘着テープ、及び、ウエハの処理方法
US20130084459A1 (en) * 2011-09-30 2013-04-04 3M Innovative Properties Company Low peel adhesive

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