JP2015026786A5 - - Google Patents

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Publication number
JP2015026786A5
JP2015026786A5 JP2013156903A JP2013156903A JP2015026786A5 JP 2015026786 A5 JP2015026786 A5 JP 2015026786A5 JP 2013156903 A JP2013156903 A JP 2013156903A JP 2013156903 A JP2013156903 A JP 2013156903A JP 2015026786 A5 JP2015026786 A5 JP 2015026786A5
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JP
Japan
Prior art keywords
image sensor
pixel region
illuminated image
wavelength
dummy wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2013156903A
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English (en)
Japanese (ja)
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JP2015026786A (ja
JP6209890B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2013156903A external-priority patent/JP6209890B2/ja
Priority to JP2013156903A priority Critical patent/JP6209890B2/ja
Priority to CN201480036251.3A priority patent/CN105340079B/zh
Priority to TW103125155A priority patent/TWI633653B/zh
Priority to PCT/JP2014/003838 priority patent/WO2015015753A1/en
Priority to US14/904,795 priority patent/US10050077B2/en
Priority to KR1020167000904A priority patent/KR102276530B1/ko
Priority to EP14748301.0A priority patent/EP3028306B1/en
Publication of JP2015026786A publication Critical patent/JP2015026786A/ja
Publication of JP2015026786A5 publication Critical patent/JP2015026786A5/ja
Publication of JP6209890B2 publication Critical patent/JP6209890B2/ja
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013156903A 2013-07-29 2013-07-29 裏面照射型イメージセンサ、撮像装置、および電子機器 Expired - Fee Related JP6209890B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2013156903A JP6209890B2 (ja) 2013-07-29 2013-07-29 裏面照射型イメージセンサ、撮像装置、および電子機器
US14/904,795 US10050077B2 (en) 2013-07-29 2014-07-22 Back surface radiation type image sensor, imaging device, and electronic apparatus
TW103125155A TWI633653B (zh) 2013-07-29 2014-07-22 背面輻射式影像感測器，成像器件及電子裝置
PCT/JP2014/003838 WO2015015753A1 (en) 2013-07-29 2014-07-22 Back surface radiation type image sensor, imaging device, and electronic apparatus
CN201480036251.3A CN105340079B (zh) 2013-07-29 2014-07-22 背面照射型图像传感器、成像装置和电子设备
KR1020167000904A KR102276530B1 (ko) 2013-07-29 2014-07-22 이면 조사형 이미지 센서, 촬상 장치, 및 전자 기기
EP14748301.0A EP3028306B1 (en) 2013-07-29 2014-07-22 Back surface radiation type image sensor, imaging device, and electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013156903A JP6209890B2 (ja) 2013-07-29 2013-07-29 裏面照射型イメージセンサ、撮像装置、および電子機器

Publications (3)

Publication Number Publication Date
JP2015026786A JP2015026786A (ja) 2015-02-05
JP2015026786A5 true JP2015026786A5 (enExample) 2016-04-07
JP6209890B2 JP6209890B2 (ja) 2017-10-11

Family

ID=51298916

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013156903A Expired - Fee Related JP6209890B2 (ja) 2013-07-29 2013-07-29 裏面照射型イメージセンサ、撮像装置、および電子機器

Country Status (7)

Country Link
US (1) US10050077B2 (enExample)
EP (1) EP3028306B1 (enExample)
JP (1) JP6209890B2 (enExample)
KR (1) KR102276530B1 (enExample)
CN (1) CN105340079B (enExample)
TW (1) TWI633653B (enExample)
WO (1) WO2015015753A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2018034092A1 (ja) * 2016-08-18 2019-06-13 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、固体撮像素子の製造方法、及び、電子機器
JP7066316B2 (ja) * 2016-12-13 2022-05-13 ソニーセミコンダクタソリューションズ株式会社 撮像素子及び電子機器
KR20180071802A (ko) 2016-12-20 2018-06-28 삼성전자주식회사 이미지 센서
WO2021149577A1 (ja) * 2020-01-24 2021-07-29 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子および電子機器

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3137072B2 (ja) * 1998-04-30 2001-02-19 日本電気株式会社 半導体集積回路の自動配線レイアウト方法
JP3877565B2 (ja) * 2001-10-04 2007-02-07 松下電器産業株式会社 撮像装置
US6815787B1 (en) * 2002-01-08 2004-11-09 Taiwan Semiconductor Manufacturing Company Grid metal design for large density CMOS image sensor
WO2003079675A1 (en) 2002-03-20 2003-09-25 Sony Corporation Solid-state image pickup device and its drive method
JP4147861B2 (ja) * 2002-08-06 2008-09-10 ソニー株式会社 固体撮像素子の製造方法
JP4826111B2 (ja) * 2005-03-17 2011-11-30 ソニー株式会社 固体撮像素子および固体撮像素子の製造方法および画像撮影装置
JP5187934B2 (ja) * 2007-07-26 2013-04-24 株式会社サトー知識財産研究所 検査支援装置
JP5173493B2 (ja) 2008-02-29 2013-04-03 キヤノン株式会社 撮像装置及び撮像システム
JP5198150B2 (ja) * 2008-05-29 2013-05-15 株式会社東芝 固体撮像装置
KR101545638B1 (ko) 2008-12-17 2015-08-19 삼성전자 주식회사 이미지 센서 및 그 제조 방법, 이미지 센서를 포함하는 장치 및 그 제조 방법
JP5306123B2 (ja) * 2009-09-11 2013-10-02 株式会社東芝 裏面照射型固体撮像装置
JP2011129627A (ja) * 2009-12-16 2011-06-30 Panasonic Corp 半導体装置
JP5696513B2 (ja) * 2011-02-08 2015-04-08 ソニー株式会社 固体撮像装置とその製造方法、及び電子機器
JP5909051B2 (ja) * 2011-04-26 2016-04-26 キヤノン株式会社 固体撮像素子及び撮像装置
JP5919653B2 (ja) * 2011-06-09 2016-05-18 ソニー株式会社 半導体装置
JP5956866B2 (ja) * 2011-09-01 2016-07-27 キヤノン株式会社 固体撮像装置
JP5893302B2 (ja) * 2011-09-01 2016-03-23 キヤノン株式会社 固体撮像装置
JP6026102B2 (ja) 2011-12-07 2016-11-16 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子および電子機器

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