JP2015015468A - 半導体デバイスおよび製造方法 - Google Patents
半導体デバイスおよび製造方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 117
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims description 39
- 239000002019 doping agent Substances 0.000 claims abstract description 62
- 238000002513 implantation Methods 0.000 claims abstract description 45
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 28
- 230000000903 blocking effect Effects 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 24
- 230000005669 field effect Effects 0.000 claims description 7
- 229910044991 metal oxide Inorganic materials 0.000 claims description 7
- 150000004706 metal oxides Chemical class 0.000 claims description 7
- 230000007423 decrease Effects 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 63
- 230000015556 catabolic process Effects 0.000 description 9
- 239000007943 implant Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 238000005468 ion implantation Methods 0.000 description 5
- 230000005684 electric field Effects 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
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Abstract
【解決手段】第1のドーパント型でドープされた第1の領域121に、単一の注入マスク130および実質的に同様の注入ドーズ量を使用して、半導体層120に第2のドーパント型を注入して、半導体層中に第2の領域122および接合終端拡張(JTE)124を形成する。注入ドーズ量は約2×1013cm-2〜約12×1013cm-2の範囲とする。
【選択図】図3
Description
120 半導体層
121 第1の領域
122 第2の領域
123 ソース領域
124 接合終端拡張(JTE)
125 主阻止接合
126 ソース電極
127 ドレイン電極
128 ゲート電極
129 絶縁層
130 注入マスク
131 窓領域
134 窓領域
135 領域
136 終端部分
140 注入ドーズ量
141 ベース領域
Claims (20)
- 半導体デバイスを製造する方法であって、
炭化ケイ素を含む半導体層を設けるステップにおいて、前記半導体層が、第1のドーパント型でドープされた第1の領域を備えるステップと、
単一の注入マスクおよび実質的に同様の注入ドーズ量を使用して、前記半導体層に第2のドーパント型を注入し、前記半導体層中に第2の領域および接合終端拡張(JTE)を形成するステップと
を含み、
前記注入ドーズ量が約2×1013cm-2〜約12×1013cm-2の範囲にある、方法。 - 前記単一の注入マスクが前記半導体層中に前記第2の領域および前記JTEを画成する複数の窓領域を備え、前記窓領域が前記半導体層中に主阻止接合を画成する領域をさらに含み、前記窓領域の開口窓の密度が前記主阻止接合を画成する前記領域から横方向に遠ざかる方向に減少する、請求項1記載の方法。
- 前記主阻止接合を画成する前記領域での開口窓の密度が80パーセントより小さい、請求項2記載の方法。
- 前記窓領域の開口窓の密度が横方向に変化し、それにより実効的な注入されたドーズ量が、前記主阻止接合での約80パーセントから前記JTEの終端部分での注入されたドーズ量全体の約10パーセントの範囲で変化する、請求項2記載の方法。
- 前記窓領域の開口窓の密度が横方向に変化し、それにより実効的な注入されたドーズ量が、前記主阻止接合での約70パーセントから前記JTEの終端部分での注入されたドーズ量全体の約10パーセントの範囲で変化する、請求項2記載の方法。
- 前記注入ドーズ量が約2×1013cm-2〜約7.5×1013cm-2の範囲にある、請求項1記載の方法。
- 前記注入ドーズ量が約2×1013cm-2〜約5×1013cm-2の範囲にある、請求項1記載の方法。
- 前記半導体層に第2のドーパント型を注入するステップが、5keVを上回り、かつ700keVを下回る範囲にある1つまたは複数の注入エネルギーで行われる、請求項1記載の方法。
- 前記第1のドーパント型がn型であり、前記第2のドーパント型がp型である、請求項1記載の方法。
- 前記JTEが互いに分離された複数の離散的な領域を備え、前記JTEにおける前記離散的な領域が、前記JTEの実効的なドーピングプロファイルが前記主阻止接合のエッジから遠ざかる方向に減少するように、前記第2のドーパント型でドープされる、請求項1記載の方法。
- 前記半導体デバイスが金属酸化膜半導体電界効果トランジスタ(MOSFET)である、請求項1記載の方法。
- 前記半導体デバイスが絶縁ゲートバイポーラトランジスタ(IGBT)である、請求項1記載の方法。
- 炭化ケイ素(SiC)の基板と、
第1の領域、第2の領域、および接合終端拡張(JTE)を備える、前記基板上に配置された炭化ケイ素を含む半導体層であって、
前記第1の領域が、第1の導電型を有するように、第1のドーパント型でドープされ、前記第2の領域および前記JTEが、第2の導電型を有するように、第2のドーパント型でドープされ、
前記第2の領域および前記JTEにおける注入されたドーズ量が約2×1013cm-2〜約12×1013cm-2の範囲にあり、
前記第2の領域におけるドーパント濃度が前記JTEにおけるドーパント濃度と実質的に同じである、半導体層と
を備える半導体デバイス。 - 前記第1のドーパント型がn型であり、前記第2のドーパント型がp型である、請求項13記載の半導体デバイス。
- 前記JTEが互いに分離されている複数の離散的な領域を備え、前記JTEにおける前記離散的な領域が、前記JTEの実効的なドーピングプロファイルが前記主阻止接合のエッジから遠ざかる方向に減少するように、前記第2のドーパント型でドープされる、請求項13記載の半導体デバイス。
- 前記半導体デバイスが金属酸化膜半導体電界効果トランジスタ(MOSFET)である、請求項13記載の半導体デバイス。
- 基板と、
第1の領域、第2の領域、および接合終端拡張(JTE)を備える、前記基板上に配置された炭化ケイ素を含む半導体層であって、
前記第1の領域が、第1の導電型を有するように、第1のドーパント型でドープされ、前記第2の領域および前記JTEが、第2の導電型を有するように、第2のドーパント型でドープされ、
前記第2の領域および前記JTEにおける注入されたドーズ量が約2×1013cm-2〜約7.5×1013cm-2の範囲にあり、
前記第2の領域におけるドーパント濃度が前記JTEにおけるドーパント濃度と実質的に同じである、半導体層と
を備える半導体デバイス。 - 前記第1のドーパント型がn型であり、前記第2のドーパント型がp型である、請求項17記載の半導体デバイス。
- 前記JTEが互いに分離されている複数の離散的な領域を備え、前記JTEにおける前記複数の離散的な領域が、前記JTEの実効的なドーピングプロファイルが前記主阻止接合のエッジから遠ざかる方向に減少するように、前記第2のドーパント型でドープされる、請求項17記載の半導体デバイス。
- 前記半導体デバイスが金属酸化膜半導体電界効果トランジスタ(MOSFET)である、請求項17記載の半導体デバイス。
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JP6809330B2 (ja) * | 2017-03-28 | 2021-01-06 | 豊田合成株式会社 | 半導体装置の製造方法 |
DE102018103550B4 (de) * | 2018-02-16 | 2021-08-12 | Infineon Technologies Ag | Halbleitervorrichtung mit einem halbleiterkörper aus siliziumcarbid |
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GB201411664D0 (en) | 2014-08-13 |
FR3008226B1 (fr) | 2019-05-31 |
CN104282537A (zh) | 2015-01-14 |
US20150008446A1 (en) | 2015-01-08 |
CN104282537B (zh) | 2020-10-09 |
BR102014016375A2 (pt) | 2016-05-31 |
GB2517285A (en) | 2015-02-18 |
JP6812087B2 (ja) | 2021-01-13 |
CA2855304C (en) | 2021-09-28 |
IN2014CH03234A (ja) | 2015-09-18 |
FR3008226A1 (fr) | 2015-01-09 |
GB2517285B (en) | 2017-03-29 |
US10347489B2 (en) | 2019-07-09 |
CA2855304A1 (en) | 2015-01-02 |
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