JP2014534615A5 - - Google Patents

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Publication number
JP2014534615A5
JP2014534615A5 JP2014533684A JP2014533684A JP2014534615A5 JP 2014534615 A5 JP2014534615 A5 JP 2014534615A5 JP 2014533684 A JP2014533684 A JP 2014533684A JP 2014533684 A JP2014533684 A JP 2014533684A JP 2014534615 A5 JP2014534615 A5 JP 2014534615A5
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JP
Japan
Prior art keywords
substrate
hump
brush
contact
rounded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014533684A
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English (en)
Japanese (ja)
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JP2014534615A (ja
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Priority claimed from PCT/US2012/057337 external-priority patent/WO2013049207A2/en
Publication of JP2014534615A publication Critical patent/JP2014534615A/ja
Publication of JP2014534615A5 publication Critical patent/JP2014534615A5/ja
Pending legal-status Critical Current

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JP2014533684A 2011-09-26 2012-09-26 Ｃｍｐ後クリーニング装置および方法 Pending JP2014534615A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161539342P 2011-09-26 2011-09-26
US61/539,342 2011-09-26
PCT/US2012/057337 WO2013049207A2 (en) 2011-09-26 2012-09-26 Post-cmp cleaning apparatus and method

Publications (2)

Publication Number Publication Date
JP2014534615A JP2014534615A (ja) 2014-12-18
JP2014534615A5 true JP2014534615A5 (enExample) 2015-11-19

Family

ID=47996722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014533684A Pending JP2014534615A (ja) 2011-09-26 2012-09-26 Ｃｍｐ後クリーニング装置および方法

Country Status (6)

Country Link
US (1) US20140230170A1 (enExample)
JP (1) JP2014534615A (enExample)
KR (1) KR20140069043A (enExample)
CN (1) CN103918063A (enExample)
TW (1) TW201318779A (enExample)
WO (1) WO2013049207A2 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10504753B2 (en) * 2013-12-13 2019-12-10 Taiwan Semiconductor Manufacturing Co., Ltd. Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method
US10790167B2 (en) 2014-02-20 2020-09-29 Entegris, Inc. Nodule ratios for targeted enhanced cleaning performance
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
KR102295988B1 (ko) 2014-10-17 2021-09-01 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
JP6316730B2 (ja) * 2014-10-31 2018-04-25 株式会社荏原製作所 ロール部材、ペンシル部材、及びそれらの少なくともいずれか一方を含む基板処理装置
KR102389613B1 (ko) 2015-05-06 2022-04-22 삼성전자주식회사 기판 세정 장치
CN113103145B (zh) 2015-10-30 2023-04-11 应用材料公司 形成具有期望ζ电位的抛光制品的设备与方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
JP6643942B2 (ja) * 2016-04-12 2020-02-12 株式会社荏原製作所 洗浄部材、基板洗浄装置及び基板処理装置
US11923208B2 (en) * 2017-05-19 2024-03-05 Illinois Tool Works Inc. Methods and apparatuses for chemical delivery for brush conditioning
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
WO2020050932A1 (en) 2018-09-04 2020-03-12 Applied Materials, Inc. Formulations for advanced polishing pads
US11694910B2 (en) * 2019-09-10 2023-07-04 Illinois Tool Works Inc. Brush with non-constant nodule density
US11470956B2 (en) 2020-03-06 2022-10-18 Applied Materials, Inc. Brush, method of forming a brush, and structure embodied in a machine readable medium used in a design process
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
JP2022134658A (ja) * 2021-03-03 2022-09-15 アイオン株式会社 ブラシローラ
JP7714819B2 (ja) * 2022-05-31 2025-07-29 インテグリス・インコーポレーテッド 半導体作製プロセスのための洗浄ブラシ
JP2024047416A (ja) * 2022-09-26 2024-04-05 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄ブラシおよび基板洗浄装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS596974A (ja) * 1982-07-05 1984-01-14 カネボウ株式会社 洗浄方法
US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
JP4554011B2 (ja) * 1999-08-10 2010-09-29 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
US6467120B1 (en) * 1999-09-08 2002-10-22 International Business Machines Corporation Wafer cleaning brush profile modification
JP2001358110A (ja) * 2000-06-13 2001-12-26 Hitachi Ltd スクラブ洗浄装置およびそれを用いた半導体装置の製造方法
JP2003051481A (ja) * 2001-08-07 2003-02-21 Hitachi Ltd 半導体集積回路装置の製造方法
CN1863645B (zh) * 2003-08-08 2011-11-30 安格斯公司 用于制作浇注在可旋转基体上的整体式多孔垫的方法和材料
US7469443B2 (en) * 2005-01-10 2008-12-30 Intel Corporation Brush for cleaning wafer
JP2008119621A (ja) * 2006-11-14 2008-05-29 Matsushita Electric Ind Co Ltd 洗浄用ローラブラシ
JP2009117765A (ja) * 2007-11-09 2009-05-28 Aion Kk 洗浄用スポンジローラ
KR101579572B1 (ko) * 2008-06-30 2015-12-22 아이온 가부시키가이샤 세정용 스폰지 롤러
USD682497S1 (en) * 2010-12-21 2013-05-14 Entegris, Inc. Substrate cleaning brush

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