KR20140069043A - 포스트-cmp 세정 장치 및 방법 - Google Patents

포스트-cmp 세정 장치 및 방법 Download PDF

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Publication number
KR20140069043A
KR20140069043A KR1020147008038A KR20147008038A KR20140069043A KR 20140069043 A KR20140069043 A KR 20140069043A KR 1020147008038 A KR1020147008038 A KR 1020147008038A KR 20147008038 A KR20147008038 A KR 20147008038A KR 20140069043 A KR20140069043 A KR 20140069043A
Authority
KR
South Korea
Prior art keywords
nodules
brush
cylindrical base
cylindrical
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020147008038A
Other languages
English (en)
Korean (ko)
Inventor
친탄 파텔
Original Assignee
인티그리스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 인티그리스, 인코포레이티드 filed Critical 인티그리스, 인코포레이티드
Publication of KR20140069043A publication Critical patent/KR20140069043A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H10P72/0412—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
    • H10P70/277—

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning In General (AREA)
  • Rolls And Other Rotary Bodies (AREA)
KR1020147008038A 2011-09-26 2012-09-26 포스트-cmp 세정 장치 및 방법 Withdrawn KR20140069043A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161539342P 2011-09-26 2011-09-26
US61/539,342 2011-09-26
PCT/US2012/057337 WO2013049207A2 (en) 2011-09-26 2012-09-26 Post-cmp cleaning apparatus and method

Publications (1)

Publication Number Publication Date
KR20140069043A true KR20140069043A (ko) 2014-06-09

Family

ID=47996722

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147008038A Withdrawn KR20140069043A (ko) 2011-09-26 2012-09-26 포스트-cmp 세정 장치 및 방법

Country Status (6)

Country Link
US (1) US20140230170A1 (enExample)
JP (1) JP2014534615A (enExample)
KR (1) KR20140069043A (enExample)
CN (1) CN103918063A (enExample)
TW (1) TW201318779A (enExample)
WO (1) WO2013049207A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160052343A (ko) * 2014-10-31 2016-05-12 가부시키가이샤 에바라 세이사꾸쇼 롤 부재, 펜슬 부재 및 그들 중 적어도 어느 한쪽을 포함하는 기판 처리 장치

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Publication number Priority date Publication date Assignee Title
US10504753B2 (en) * 2013-12-13 2019-12-10 Taiwan Semiconductor Manufacturing Co., Ltd. Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method
US10790167B2 (en) 2014-02-20 2020-09-29 Entegris, Inc. Nodule ratios for targeted enhanced cleaning performance
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
KR102295988B1 (ko) 2014-10-17 2021-09-01 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
KR102389613B1 (ko) 2015-05-06 2022-04-22 삼성전자주식회사 기판 세정 장치
CN113103145B (zh) 2015-10-30 2023-04-11 应用材料公司 形成具有期望ζ电位的抛光制品的设备与方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
JP6643942B2 (ja) * 2016-04-12 2020-02-12 株式会社荏原製作所 洗浄部材、基板洗浄装置及び基板処理装置
US11923208B2 (en) * 2017-05-19 2024-03-05 Illinois Tool Works Inc. Methods and apparatuses for chemical delivery for brush conditioning
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
WO2020050932A1 (en) 2018-09-04 2020-03-12 Applied Materials, Inc. Formulations for advanced polishing pads
US11694910B2 (en) * 2019-09-10 2023-07-04 Illinois Tool Works Inc. Brush with non-constant nodule density
US11470956B2 (en) 2020-03-06 2022-10-18 Applied Materials, Inc. Brush, method of forming a brush, and structure embodied in a machine readable medium used in a design process
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
JP2022134658A (ja) * 2021-03-03 2022-09-15 アイオン株式会社 ブラシローラ
JP7714819B2 (ja) * 2022-05-31 2025-07-29 インテグリス・インコーポレーテッド 半導体作製プロセスのための洗浄ブラシ
JP2024047416A (ja) * 2022-09-26 2024-04-05 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄ブラシおよび基板洗浄装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS596974A (ja) * 1982-07-05 1984-01-14 カネボウ株式会社 洗浄方法
US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
JP4554011B2 (ja) * 1999-08-10 2010-09-29 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
US6467120B1 (en) * 1999-09-08 2002-10-22 International Business Machines Corporation Wafer cleaning brush profile modification
JP2001358110A (ja) * 2000-06-13 2001-12-26 Hitachi Ltd スクラブ洗浄装置およびそれを用いた半導体装置の製造方法
JP2003051481A (ja) * 2001-08-07 2003-02-21 Hitachi Ltd 半導体集積回路装置の製造方法
CN1863645B (zh) * 2003-08-08 2011-11-30 安格斯公司 用于制作浇注在可旋转基体上的整体式多孔垫的方法和材料
US7469443B2 (en) * 2005-01-10 2008-12-30 Intel Corporation Brush for cleaning wafer
JP2008119621A (ja) * 2006-11-14 2008-05-29 Matsushita Electric Ind Co Ltd 洗浄用ローラブラシ
JP2009117765A (ja) * 2007-11-09 2009-05-28 Aion Kk 洗浄用スポンジローラ
KR101579572B1 (ko) * 2008-06-30 2015-12-22 아이온 가부시키가이샤 세정용 스폰지 롤러
USD682497S1 (en) * 2010-12-21 2013-05-14 Entegris, Inc. Substrate cleaning brush

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160052343A (ko) * 2014-10-31 2016-05-12 가부시키가이샤 에바라 세이사꾸쇼 롤 부재, 펜슬 부재 및 그들 중 적어도 어느 한쪽을 포함하는 기판 처리 장치
US11642704B2 (en) 2014-10-31 2023-05-09 Ebara Corporation Roll-type processing member, pencil-type processing member, and substrate processing apparatus including any one of these

Also Published As

Publication number Publication date
TW201318779A (zh) 2013-05-16
WO2013049207A3 (en) 2013-07-11
JP2014534615A (ja) 2014-12-18
US20140230170A1 (en) 2014-08-21
CN103918063A (zh) 2014-07-09
WO2013049207A2 (en) 2013-04-04

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