KR20140069043A - 포스트-cmp 세정 장치 및 방법 - Google Patents

포스트-cmp 세정 장치 및 방법 Download PDF

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Publication number
KR20140069043A
KR20140069043A KR1020147008038A KR20147008038A KR20140069043A KR 20140069043 A KR20140069043 A KR 20140069043A KR 1020147008038 A KR1020147008038 A KR 1020147008038A KR 20147008038 A KR20147008038 A KR 20147008038A KR 20140069043 A KR20140069043 A KR 20140069043A
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KR
South Korea
Prior art keywords
nodules
brush
cylindrical base
cylindrical
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020147008038A
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English (en)
Korean (ko)
Inventor
친탄 파텔
Original Assignee
인티그리스, 인코포레이티드
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Filing date
Publication date
Application filed by 인티그리스, 인코포레이티드 filed Critical 인티그리스, 인코포레이티드
Publication of KR20140069043A publication Critical patent/KR20140069043A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
    • H10P70/277—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a planarisation of conductive layers

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Rolls And Other Rotary Bodies (AREA)
  • Cleaning In General (AREA)
KR1020147008038A 2011-09-26 2012-09-26 포스트-cmp 세정 장치 및 방법 Withdrawn KR20140069043A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161539342P 2011-09-26 2011-09-26
US61/539,342 2011-09-26
PCT/US2012/057337 WO2013049207A2 (en) 2011-09-26 2012-09-26 Post-cmp cleaning apparatus and method

Publications (1)

Publication Number Publication Date
KR20140069043A true KR20140069043A (ko) 2014-06-09

Family

ID=47996722

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147008038A Withdrawn KR20140069043A (ko) 2011-09-26 2012-09-26 포스트-cmp 세정 장치 및 방법

Country Status (6)

Country Link
US (1) US20140230170A1 (enExample)
JP (1) JP2014534615A (enExample)
KR (1) KR20140069043A (enExample)
CN (1) CN103918063A (enExample)
TW (1) TW201318779A (enExample)
WO (1) WO2013049207A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160052343A (ko) * 2014-10-31 2016-05-12 가부시키가이샤 에바라 세이사꾸쇼 롤 부재, 펜슬 부재 및 그들 중 적어도 어느 한쪽을 포함하는 기판 처리 장치

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US10504753B2 (en) * 2013-12-13 2019-12-10 Taiwan Semiconductor Manufacturing Co., Ltd. Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method
JP6843621B2 (ja) 2014-02-20 2021-03-17 インテグリス・インコーポレーテッド 目標とする高い洗浄性能を得るためのこぶの比率
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
WO2016060712A1 (en) 2014-10-17 2016-04-21 Applied Materials, Inc. Cmp pad construction with composite material properties using additive manufacturing processes
KR102389613B1 (ko) 2015-05-06 2022-04-22 삼성전자주식회사 기판 세정 장치
US10618141B2 (en) 2015-10-30 2020-04-14 Applied Materials, Inc. Apparatus for forming a polishing article that has a desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
JP6643942B2 (ja) * 2016-04-12 2020-02-12 株式会社荏原製作所 洗浄部材、基板洗浄装置及び基板処理装置
US11923208B2 (en) * 2017-05-19 2024-03-05 Illinois Tool Works Inc. Methods and apparatuses for chemical delivery for brush conditioning
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US11694910B2 (en) * 2019-09-10 2023-07-04 Illinois Tool Works Inc. Brush with non-constant nodule density
US11470956B2 (en) 2020-03-06 2022-10-18 Applied Materials, Inc. Brush, method of forming a brush, and structure embodied in a machine readable medium used in a design process
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
JP2022134658A (ja) * 2021-03-03 2022-09-15 アイオン株式会社 ブラシローラ
CN122294877A (zh) * 2022-05-31 2026-06-26 恩特格里斯公司 用于半导体制造工艺的清洁刷
JP7897097B2 (ja) * 2022-09-26 2026-07-29 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄ブラシおよび基板洗浄装置

Family Cites Families (12)

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Publication number Priority date Publication date Assignee Title
JPS596974A (ja) * 1982-07-05 1984-01-14 カネボウ株式会社 洗浄方法
US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
JP4554011B2 (ja) * 1999-08-10 2010-09-29 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
US6467120B1 (en) * 1999-09-08 2002-10-22 International Business Machines Corporation Wafer cleaning brush profile modification
JP2001358110A (ja) * 2000-06-13 2001-12-26 Hitachi Ltd スクラブ洗浄装置およびそれを用いた半導体装置の製造方法
JP2003051481A (ja) * 2001-08-07 2003-02-21 Hitachi Ltd 半導体集積回路装置の製造方法
JP4965253B2 (ja) * 2003-08-08 2012-07-04 インテグリス・インコーポレーテッド 回転可能ベース上に鋳造されるモノリシック多孔性パッドを作製する方法および材料
US7469443B2 (en) * 2005-01-10 2008-12-30 Intel Corporation Brush for cleaning wafer
JP2008119621A (ja) * 2006-11-14 2008-05-29 Matsushita Electric Ind Co Ltd 洗浄用ローラブラシ
JP2009117765A (ja) * 2007-11-09 2009-05-28 Aion Kk 洗浄用スポンジローラ
US8555458B2 (en) * 2008-06-30 2013-10-15 Aion Co., Ltd Cleaning sponge roller
USD682497S1 (en) * 2010-12-21 2013-05-14 Entegris, Inc. Substrate cleaning brush

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160052343A (ko) * 2014-10-31 2016-05-12 가부시키가이샤 에바라 세이사꾸쇼 롤 부재, 펜슬 부재 및 그들 중 적어도 어느 한쪽을 포함하는 기판 처리 장치
US11642704B2 (en) 2014-10-31 2023-05-09 Ebara Corporation Roll-type processing member, pencil-type processing member, and substrate processing apparatus including any one of these

Also Published As

Publication number Publication date
TW201318779A (zh) 2013-05-16
JP2014534615A (ja) 2014-12-18
CN103918063A (zh) 2014-07-09
WO2013049207A3 (en) 2013-07-11
US20140230170A1 (en) 2014-08-21
WO2013049207A2 (en) 2013-04-04

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