KR20140069043A - 포스트-cmp 세정 장치 및 방법 - Google Patents

포스트-cmp 세정 장치 및 방법 Download PDF

Info

Publication number
KR20140069043A
KR20140069043A KR1020147008038A KR20147008038A KR20140069043A KR 20140069043 A KR20140069043 A KR 20140069043A KR 1020147008038 A KR1020147008038 A KR 1020147008038A KR 20147008038 A KR20147008038 A KR 20147008038A KR 20140069043 A KR20140069043 A KR 20140069043A
Authority
KR
South Korea
Prior art keywords
nodules
brush
cylindrical base
cylindrical
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020147008038A
Other languages
English (en)
Korean (ko)
Inventor
친탄 파텔
Original Assignee
인티그리스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 인티그리스, 인코포레이티드 filed Critical 인티그리스, 인코포레이티드
Publication of KR20140069043A publication Critical patent/KR20140069043A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning In General (AREA)
  • Rolls And Other Rotary Bodies (AREA)
KR1020147008038A 2011-09-26 2012-09-26 포스트-cmp 세정 장치 및 방법 Withdrawn KR20140069043A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161539342P 2011-09-26 2011-09-26
US61/539,342 2011-09-26
PCT/US2012/057337 WO2013049207A2 (en) 2011-09-26 2012-09-26 Post-cmp cleaning apparatus and method

Publications (1)

Publication Number Publication Date
KR20140069043A true KR20140069043A (ko) 2014-06-09

Family

ID=47996722

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147008038A Withdrawn KR20140069043A (ko) 2011-09-26 2012-09-26 포스트-cmp 세정 장치 및 방법

Country Status (6)

Country Link
US (1) US20140230170A1 (enExample)
JP (1) JP2014534615A (enExample)
KR (1) KR20140069043A (enExample)
CN (1) CN103918063A (enExample)
TW (1) TW201318779A (enExample)
WO (1) WO2013049207A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160052343A (ko) * 2014-10-31 2016-05-12 가부시키가이샤 에바라 세이사꾸쇼 롤 부재, 펜슬 부재 및 그들 중 적어도 어느 한쪽을 포함하는 기판 처리 장치

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10504753B2 (en) * 2013-12-13 2019-12-10 Taiwan Semiconductor Manufacturing Co., Ltd. Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method
JP6843621B2 (ja) 2014-02-20 2021-03-17 インテグリス・インコーポレーテッド 目標とする高い洗浄性能を得るためのこぶの比率
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
SG10202002601QA (en) 2014-10-17 2020-05-28 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
KR102389613B1 (ko) 2015-05-06 2022-04-22 삼성전자주식회사 기판 세정 장치
WO2017074773A1 (en) 2015-10-30 2017-05-04 Applied Materials, Inc. An apparatus and method of forming a polishing article that has a desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
JP6643942B2 (ja) * 2016-04-12 2020-02-12 株式会社荏原製作所 洗浄部材、基板洗浄装置及び基板処理装置
US11923208B2 (en) 2017-05-19 2024-03-05 Illinois Tool Works Inc. Methods and apparatuses for chemical delivery for brush conditioning
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
US11694910B2 (en) * 2019-09-10 2023-07-04 Illinois Tool Works Inc. Brush with non-constant nodule density
US11470956B2 (en) 2020-03-06 2022-10-18 Applied Materials, Inc. Brush, method of forming a brush, and structure embodied in a machine readable medium used in a design process
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
JP2022134658A (ja) * 2021-03-03 2022-09-15 アイオン株式会社 ブラシローラ
EP4533528A4 (en) * 2022-05-31 2025-08-20 Entegris Inc Cleaning brush for semiconductor fabrication process
JP2024047416A (ja) * 2022-09-26 2024-04-05 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄ブラシおよび基板洗浄装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS596974A (ja) * 1982-07-05 1984-01-14 カネボウ株式会社 洗浄方法
US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
JP4554011B2 (ja) * 1999-08-10 2010-09-29 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
US6467120B1 (en) * 1999-09-08 2002-10-22 International Business Machines Corporation Wafer cleaning brush profile modification
JP2001358110A (ja) * 2000-06-13 2001-12-26 Hitachi Ltd スクラブ洗浄装置およびそれを用いた半導体装置の製造方法
JP2003051481A (ja) * 2001-08-07 2003-02-21 Hitachi Ltd 半導体集積回路装置の製造方法
EP1680260B1 (en) * 2003-08-08 2014-04-30 Entegris, Inc. Methods and materials for making a monolithic porous pad cast onto a rotatable base
US7469443B2 (en) * 2005-01-10 2008-12-30 Intel Corporation Brush for cleaning wafer
JP2008119621A (ja) * 2006-11-14 2008-05-29 Matsushita Electric Ind Co Ltd 洗浄用ローラブラシ
JP2009117765A (ja) * 2007-11-09 2009-05-28 Aion Kk 洗浄用スポンジローラ
WO2010001761A1 (ja) * 2008-06-30 2010-01-07 アイオン株式会社 洗浄用スポンジローラ
USD682497S1 (en) * 2010-12-21 2013-05-14 Entegris, Inc. Substrate cleaning brush

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160052343A (ko) * 2014-10-31 2016-05-12 가부시키가이샤 에바라 세이사꾸쇼 롤 부재, 펜슬 부재 및 그들 중 적어도 어느 한쪽을 포함하는 기판 처리 장치
US11642704B2 (en) 2014-10-31 2023-05-09 Ebara Corporation Roll-type processing member, pencil-type processing member, and substrate processing apparatus including any one of these

Also Published As

Publication number Publication date
WO2013049207A3 (en) 2013-07-11
JP2014534615A (ja) 2014-12-18
TW201318779A (zh) 2013-05-16
US20140230170A1 (en) 2014-08-21
WO2013049207A2 (en) 2013-04-04
CN103918063A (zh) 2014-07-09

Similar Documents

Publication Publication Date Title
KR20140069043A (ko) 포스트-cmp 세정 장치 및 방법
JP5977175B2 (ja) Ｃｍｐ後の洗浄ブラシ
CN100366391C (zh) 具有取决于工艺的槽结构的化学机械抛光基台
US7648410B2 (en) Polishing pad and chemical mechanical polishing apparatus
US6467120B1 (en) Wafer cleaning brush profile modification
US7029375B2 (en) Retaining ring structure for edge control during chemical-mechanical polishing
CN100419965C (zh) 具有重叠阶梯状凹槽排列的化学机械抛光垫
WO2003061904B1 (en) Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution
WO2015057432A1 (en) Cmp polishing pad having edge exclusion region of offset concentric groove pattern
KR101929739B1 (ko) 브러시 코어 및 브러시 구동 방법
KR20170077210A (ko) 기판 세정 롤, 기판 세정 장치, 및 기판 세정 방법
JP2008311481A (ja) 基板洗浄方法、基板洗浄装置及び半導体製造方法
US7185384B2 (en) Wafer cleaning brush
US10504753B2 (en) Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method
WO2006026271A1 (en) An optimized grooving structure for a cmp polishing pad
US20250353138A1 (en) Chemical-mechanical planarization pad and methods of use
US20090042494A1 (en) Pad conditioner of semiconductor wafer polishing apparatus and manufacturing method thereof
WO2003057405A1 (en) Grooved rollers for a linear chemical mechanical planarization system
JP2004056110A (ja) 段部を有したリテーナリングを備えた化学的機械研磨装置および該研磨装置の使用方法
US6101656A (en) Wafer cleaning device
KR20060116488A (ko) 반도체 웨이퍼용 세정 브러쉬
KR20240067453A (ko) 웨이퍼 세정용 브러시
KR20090023778A (ko) Ｃｍｐ 패드 컨디셔닝 디스크
KR200195122Y1 (ko) 반도체 웨이퍼 연마 패드
KR20240113152A (ko) 웨이퍼 세정용 브러시

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20140326

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid