TW201318779A - 清潔基板之刷具 - Google Patents

清潔基板之刷具 Download PDF

Info

Publication number
TW201318779A
TW201318779A TW101135344A TW101135344A TW201318779A TW 201318779 A TW201318779 A TW 201318779A TW 101135344 A TW101135344 A TW 101135344A TW 101135344 A TW101135344 A TW 101135344A TW 201318779 A TW201318779 A TW 201318779A
Authority
TW
Taiwan
Prior art keywords
brush
substrates
cylindrical base
substrate
nodules
Prior art date
Application number
TW101135344A
Other languages
English (en)
Chinese (zh)
Inventor
欽坦 派特爾
Original Assignee
安堤格里斯公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 安堤格里斯公司 filed Critical 安堤格里斯公司
Publication of TW201318779A publication Critical patent/TW201318779A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
    • H10P70/277—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a planarisation of conductive layers

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Rolls And Other Rotary Bodies (AREA)
  • Cleaning In General (AREA)
TW101135344A 2011-09-26 2012-09-26 清潔基板之刷具 TW201318779A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161539342P 2011-09-26 2011-09-26

Publications (1)

Publication Number Publication Date
TW201318779A true TW201318779A (zh) 2013-05-16

Family

ID=47996722

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101135344A TW201318779A (zh) 2011-09-26 2012-09-26 清潔基板之刷具

Country Status (6)

Country Link
US (1) US20140230170A1 (enExample)
JP (1) JP2014534615A (enExample)
KR (1) KR20140069043A (enExample)
CN (1) CN103918063A (enExample)
TW (1) TW201318779A (enExample)
WO (1) WO2013049207A2 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10504753B2 (en) 2013-12-13 2019-12-10 Taiwan Semiconductor Manufacturing Co., Ltd. Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method
WO2015127301A1 (en) 2014-02-20 2015-08-27 Entegris, Inc. Nodule ratios for targeted enhanced cleaning performance
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
KR20240015167A (ko) 2014-10-17 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
JP6316730B2 (ja) 2014-10-31 2018-04-25 株式会社荏原製作所 ロール部材、ペンシル部材、及びそれらの少なくともいずれか一方を含む基板処理装置
KR102389613B1 (ko) 2015-05-06 2022-04-22 삼성전자주식회사 기판 세정 장치
CN113103145B (zh) 2015-10-30 2023-04-11 应用材料公司 形成具有期望ζ电位的抛光制品的设备与方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
JP6643942B2 (ja) * 2016-04-12 2020-02-12 株式会社荏原製作所 洗浄部材、基板洗浄装置及び基板処理装置
US11923208B2 (en) 2017-05-19 2024-03-05 Illinois Tool Works Inc. Methods and apparatuses for chemical delivery for brush conditioning
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
US11694910B2 (en) * 2019-09-10 2023-07-04 Illinois Tool Works Inc. Brush with non-constant nodule density
US11470956B2 (en) 2020-03-06 2022-10-18 Applied Materials, Inc. Brush, method of forming a brush, and structure embodied in a machine readable medium used in a design process
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
JP2022134658A (ja) * 2021-03-03 2022-09-15 アイオン株式会社 ブラシローラ
US20230386868A1 (en) * 2022-05-31 2023-11-30 Entegris, Inc. Cleaning brush for semiconductor fabrication process
JP2024047416A (ja) * 2022-09-26 2024-04-05 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄ブラシおよび基板洗浄装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS596974A (ja) * 1982-07-05 1984-01-14 カネボウ株式会社 洗浄方法
US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
JP4554011B2 (ja) * 1999-08-10 2010-09-29 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
US6467120B1 (en) * 1999-09-08 2002-10-22 International Business Machines Corporation Wafer cleaning brush profile modification
JP2001358110A (ja) * 2000-06-13 2001-12-26 Hitachi Ltd スクラブ洗浄装置およびそれを用いた半導体装置の製造方法
JP2003051481A (ja) * 2001-08-07 2003-02-21 Hitachi Ltd 半導体集積回路装置の製造方法
WO2005016599A1 (en) * 2003-08-08 2005-02-24 Mykrolys Corporation Methods and materials for making a monolithic porous pad cast onto a rotatable base
US7469443B2 (en) * 2005-01-10 2008-12-30 Intel Corporation Brush for cleaning wafer
JP2008119621A (ja) * 2006-11-14 2008-05-29 Matsushita Electric Ind Co Ltd 洗浄用ローラブラシ
JP2009117765A (ja) * 2007-11-09 2009-05-28 Aion Kk 洗浄用スポンジローラ
WO2010001761A1 (ja) * 2008-06-30 2010-01-07 アイオン株式会社 洗浄用スポンジローラ
USD682497S1 (en) * 2010-12-21 2013-05-14 Entegris, Inc. Substrate cleaning brush

Also Published As

Publication number Publication date
KR20140069043A (ko) 2014-06-09
CN103918063A (zh) 2014-07-09
US20140230170A1 (en) 2014-08-21
WO2013049207A3 (en) 2013-07-11
WO2013049207A2 (en) 2013-04-04
JP2014534615A (ja) 2014-12-18

Similar Documents

Publication Publication Date Title
TW201318779A (zh) 清潔基板之刷具
TWI645914B (zh) 用於基板之化學機械研磨之後段清潔該等基板之刷具、用於對半導體晶圓之表面進行化學機械研磨後段清潔之方法、及用於對晶圓進行化學機械研磨後段清潔之圓柱形泡沫滾筒
JP4689240B2 (ja) スラリー消費を減らすための溝構造を有する研磨パッド
US7267610B1 (en) CMP pad having unevenly spaced grooves
JP4568015B2 (ja) 最適化された溝を有する研磨パッド及び同パッドを形成する方法
CN100366391C (zh) 具有取决于工艺的槽结构的化学机械抛光基台
US8062103B2 (en) High-rate groove pattern
JP4820555B2 (ja) 溝付き研磨パッド及び方法
US8057282B2 (en) High-rate polishing method
CN101134292A (zh) 具有重叠的固定面积螺旋凹槽的化学机械抛光垫
US6852016B2 (en) End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpieces
JP4689241B2 (ja) スラリー利用度を高める溝を有する研磨パッド
TWI670763B (zh) 一種用於在一化學機械研磨製程之後清潔晶圓之刷具與方法
KR101184628B1 (ko) 연마 동안 후류의 혼합을 촉진시키도록 배열된 홈을 갖는연마 패드
JP2006167908A (ja) 重複する段差溝構造を有するｃｍｐパッド
US20250353138A1 (en) Chemical-mechanical planarization pad and methods of use
US9272390B2 (en) Pad conditioning tool having sapphire dressing particles
US20200203191A1 (en) Roller for cleaning wafer and cleaning apparatus having the same
US5961377A (en) Chemical mechanical polishing systems including brushes and related methods
FR2880570A1 (fr) Tampon de polissage chimique-physique ayant une configuration de segment de rainure alternee radialement
KR101150849B1 (ko) 웨이퍼 캐리어 및 이를 채용한 웨이퍼 양면 연마장치
US20200230656A1 (en) Device of Cleaning Brush
US12341015B2 (en) Apparatus for polishing a wafer and method for fabricating a semiconductor device using the same
CN209610263U (zh) 清洁刷结构
TW202237283A (zh) 刷輥