JP2014529197A5 - - Google Patents
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- Publication number
- JP2014529197A5 JP2014529197A5 JP2014533400A JP2014533400A JP2014529197A5 JP 2014529197 A5 JP2014529197 A5 JP 2014529197A5 JP 2014533400 A JP2014533400 A JP 2014533400A JP 2014533400 A JP2014533400 A JP 2014533400A JP 2014529197 A5 JP2014529197 A5 JP 2014529197A5
- Authority
- JP
- Japan
- Prior art keywords
- electrostatic chuck
- electrodes
- grooves
- ceramic plate
- radial
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161542068P | 2011-09-30 | 2011-09-30 | |
| US61/542,068 | 2011-09-30 | ||
| PCT/US2012/057945 WO2013049586A1 (en) | 2011-09-30 | 2012-09-28 | Electrostatic chuck |
| US13/630,136 | 2012-09-28 | ||
| US13/630,136 US9608549B2 (en) | 2011-09-30 | 2012-09-28 | Electrostatic chuck |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014529197A JP2014529197A (ja) | 2014-10-30 |
| JP2014529197A5 true JP2014529197A5 (https=) | 2015-11-12 |
| JP6109832B2 JP6109832B2 (ja) | 2017-04-05 |
Family
ID=47996438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014533400A Active JP6109832B2 (ja) | 2011-09-30 | 2012-09-28 | 静電チャック |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9608549B2 (https=) |
| JP (1) | JP6109832B2 (https=) |
| KR (1) | KR102110108B1 (https=) |
| CN (1) | CN103843128B (https=) |
| WO (1) | WO2013049586A1 (https=) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8832916B2 (en) * | 2011-07-12 | 2014-09-16 | Lam Research Corporation | Methods of dechucking and system thereof |
| US9404176B2 (en) | 2012-06-05 | 2016-08-02 | Applied Materials, Inc. | Substrate support with radio frequency (RF) return path |
| JP5975755B2 (ja) * | 2012-06-28 | 2016-08-23 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置およびプラズマ処理方法 |
| US10727092B2 (en) * | 2012-10-17 | 2020-07-28 | Applied Materials, Inc. | Heated substrate support ring |
| US9101038B2 (en) | 2013-12-20 | 2015-08-04 | Lam Research Corporation | Electrostatic chuck including declamping electrode and method of declamping |
| US10008404B2 (en) | 2014-10-17 | 2018-06-26 | Applied Materials, Inc. | Electrostatic chuck assembly for high temperature processes |
| US10002782B2 (en) | 2014-10-17 | 2018-06-19 | Lam Research Corporation | ESC assembly including an electrically conductive gasket for uniform RF power delivery therethrough |
| KR101910727B1 (ko) * | 2015-01-20 | 2018-10-22 | 엔지케이 인슐레이터 엘티디 | 웨이퍼 지지 구조체 |
| US10008399B2 (en) * | 2015-05-19 | 2018-06-26 | Applied Materials, Inc. | Electrostatic puck assembly with metal bonded backing plate for high temperature processes |
| CN104900576A (zh) * | 2015-05-27 | 2015-09-09 | 上海华力微电子有限公司 | 一种静电吸盘静电吸力分布的调节方法 |
| JP6634315B2 (ja) * | 2016-03-03 | 2020-01-22 | 日本特殊陶業株式会社 | 保持装置および保持装置の製造方法 |
| US10249526B2 (en) | 2016-03-04 | 2019-04-02 | Applied Materials, Inc. | Substrate support assembly for high temperature processes |
| US10770270B2 (en) | 2016-06-07 | 2020-09-08 | Applied Materials, Inc. | High power electrostatic chuck with aperture-reducing plug in a gas hole |
| US11114327B2 (en) * | 2017-08-29 | 2021-09-07 | Applied Materials, Inc. | ESC substrate support with chucking force control |
| TWI673797B (zh) * | 2017-09-06 | 2019-10-01 | 台灣積體電路製造股份有限公司 | 製程零件、半導體製造設備及半導體製造方法 |
| US10688750B2 (en) * | 2017-10-03 | 2020-06-23 | Applied Materials, Inc. | Bonding structure of E chuck to aluminum base configuration |
| JP6504532B1 (ja) * | 2018-03-14 | 2019-04-24 | Toto株式会社 | 静電チャック |
| US10847402B2 (en) | 2018-04-02 | 2020-11-24 | Applied Materials, Inc. | Bond protection around porous plugs |
| US11456161B2 (en) | 2018-06-04 | 2022-09-27 | Applied Materials, Inc. | Substrate support pedestal |
| KR102460310B1 (ko) * | 2018-08-20 | 2022-10-28 | 주식회사 원익아이피에스 | 기판 지지대 및 기판 처리 장치 |
| EP3884513A4 (en) * | 2018-11-19 | 2022-08-03 | Entegris, Inc. | ELECTROSTATIC CHUCK WITH CHARGE DISCHARGE COATING |
| US11031273B2 (en) * | 2018-12-07 | 2021-06-08 | Applied Materials, Inc. | Physical vapor deposition (PVD) electrostatic chuck with improved thermal coupling for temperature sensitive processes |
| JP7387764B2 (ja) | 2019-05-24 | 2023-11-28 | アプライド マテリアルズ インコーポレイテッド | 結合層の保護が改善された基板支持キャリア |
| KR102681787B1 (ko) * | 2019-06-13 | 2024-07-05 | 주식회사 원익아이피에스 | 기판 지지대 및 기판 처리 장치 |
| KR102640172B1 (ko) | 2019-07-03 | 2024-02-23 | 삼성전자주식회사 | 기판 처리 장치 및 이의 구동 방법 |
| US11373893B2 (en) * | 2019-09-16 | 2022-06-28 | Applied Materials, Inc. | Cryogenic electrostatic chuck |
| KR20210089375A (ko) | 2020-01-08 | 2021-07-16 | 주식회사 미코세라믹스 | 정전척 |
| US11538708B2 (en) * | 2020-05-06 | 2022-12-27 | Sandisk Technologies Llc | Multi-zone plasma-enhanced chemical vapor deposition apparatus and methods for operating the same |
| US11551961B2 (en) | 2020-05-06 | 2023-01-10 | Sandisk Technologies Llc | Multi-zone plasma-enhanced chemical vapor deposition apparatus and methods for operating the same |
| JP7372271B2 (ja) * | 2021-01-06 | 2023-10-31 | 日本碍子株式会社 | 半導体製造装置用部材及びその製法 |
| JP7632969B2 (ja) * | 2021-03-23 | 2025-02-19 | 日本特殊陶業株式会社 | 電極埋設部材、および基板保持部材 |
| US12224192B2 (en) | 2022-11-10 | 2025-02-11 | Applied Materials, Inc. | Bowed substrate clamping method, apparatus, and system |
| WO2025165540A1 (en) * | 2024-01-31 | 2025-08-07 | Lam Research Corporation | Electrostatic chuck with polarity swapping and/or polarity balancing for wafer bow control and nonuniformity improvement |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05275520A (ja) * | 1992-03-26 | 1993-10-22 | Fujitsu Ltd | 静電吸着装置及びプラズマ処理装置 |
| JPH06143075A (ja) * | 1992-11-02 | 1994-05-24 | Nippon Steel Corp | 静電吸着装置 |
| JPH06204325A (ja) * | 1992-12-28 | 1994-07-22 | Hitachi Ltd | 静電吸着装置およびその吸着方法 |
| US6141203A (en) * | 1994-03-03 | 2000-10-31 | Sherman; Arthur | Electrostatic chuck |
| JP3082624B2 (ja) * | 1994-12-28 | 2000-08-28 | 住友金属工業株式会社 | 静電チャックの使用方法 |
| JPH09167794A (ja) | 1995-12-15 | 1997-06-24 | Sony Corp | 静電チャックおよびプラズマ処理方法 |
| US6108189A (en) * | 1996-04-26 | 2000-08-22 | Applied Materials, Inc. | Electrostatic chuck having improved gas conduits |
| US6308654B1 (en) * | 1996-10-18 | 2001-10-30 | Applied Materials, Inc. | Inductively coupled parallel-plate plasma reactor with a conical dome |
| US6034863A (en) * | 1997-11-12 | 2000-03-07 | Applied Materials, Inc. | Apparatus for retaining a workpiece in a process chamber within a semiconductor wafer processing system |
| JP2001021281A (ja) | 1999-07-09 | 2001-01-26 | Mitsubishi Electric Corp | 均熱装置 |
| JP2001102435A (ja) * | 1999-07-28 | 2001-04-13 | Tokyo Electron Ltd | 載置台構造及び処理装置 |
| KR20010111058A (ko) | 2000-06-09 | 2001-12-15 | 조셉 제이. 스위니 | 전체 영역 온도 제어 정전기 척 및 그 제조방법 |
| US6853953B2 (en) * | 2001-08-07 | 2005-02-08 | Tokyo Electron Limited | Method for characterizing the performance of an electrostatic chuck |
| JP2003142569A (ja) * | 2001-10-31 | 2003-05-16 | Applied Materials Inc | 静電チャックおよびチャック方法 |
| KR100511854B1 (ko) | 2002-06-18 | 2005-09-02 | 아네르바 가부시키가이샤 | 정전 흡착 장치 |
| AU2003248610A1 (en) * | 2003-07-14 | 2005-01-28 | Systems On Silicon Manufacturing Co. Pte. Ltd. | Perforated plate for wafer chuck |
| JP2005136104A (ja) * | 2003-10-29 | 2005-05-26 | Ngk Spark Plug Co Ltd | 静電チャック |
| JP2005136025A (ja) * | 2003-10-29 | 2005-05-26 | Trecenti Technologies Inc | 半導体製造装置、半導体装置の製造方法及びウエハステージ |
| US7697260B2 (en) * | 2004-03-31 | 2010-04-13 | Applied Materials, Inc. | Detachable electrostatic chuck |
| JP4704087B2 (ja) * | 2005-03-31 | 2011-06-15 | 東京エレクトロン株式会社 | プラズマ処理装置およびプラズマ処理方法 |
| US7692916B2 (en) * | 2005-03-31 | 2010-04-06 | Tokyo Electron Limited | Capacitive coupling plasma processing apparatus and method |
| JP2007067037A (ja) * | 2005-08-30 | 2007-03-15 | Hitachi High-Technologies Corp | 真空処理装置 |
| US8284538B2 (en) | 2006-08-10 | 2012-10-09 | Tokyo Electron Limited | Electrostatic chuck device |
| JP2008198739A (ja) * | 2007-02-09 | 2008-08-28 | Tokyo Electron Ltd | 載置台構造、これを用いた処理装置及びこの装置の使用方法 |
| JP2008228188A (ja) | 2007-03-15 | 2008-09-25 | Funai Electric Co Ltd | 無線通信システム |
| KR20090024866A (ko) * | 2007-09-05 | 2009-03-10 | 주식회사 코미코 | 기판 지지유닛 및 이를 갖는 기판 가공 장치 |
| JP5198226B2 (ja) | 2008-11-20 | 2013-05-15 | 東京エレクトロン株式会社 | 基板載置台および基板処理装置 |
| CN101872713B (zh) * | 2009-04-24 | 2012-03-28 | 中微半导体设备(上海)有限公司 | 静电夹盘装置、等离子处理装置和制造静电夹盘装置的方法 |
-
2012
- 2012-09-28 KR KR1020147010453A patent/KR102110108B1/ko active Active
- 2012-09-28 JP JP2014533400A patent/JP6109832B2/ja active Active
- 2012-09-28 CN CN201280047894.9A patent/CN103843128B/zh active Active
- 2012-09-28 US US13/630,136 patent/US9608549B2/en active Active
- 2012-09-28 WO PCT/US2012/057945 patent/WO2013049586A1/en not_active Ceased
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