JP2014521834A - 無電解ニッケルめっき浴組成物 - Google Patents
無電解ニッケルめっき浴組成物 Download PDFInfo
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- JP2014521834A JP2014521834A JP2014522015A JP2014522015A JP2014521834A JP 2014521834 A JP2014521834 A JP 2014521834A JP 2014522015 A JP2014522015 A JP 2014522015A JP 2014522015 A JP2014522015 A JP 2014522015A JP 2014521834 A JP2014521834 A JP 2014521834A
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- Prior art keywords
- plating bath
- range
- aqueous plating
- nickel
- plating
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- 238000007747 plating Methods 0.000 title claims abstract description 82
- 239000000203 mixture Substances 0.000 title claims abstract description 27
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title description 21
- 229910052759 nickel Inorganic materials 0.000 title description 10
- 229910001096 P alloy Inorganic materials 0.000 claims abstract description 22
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000003381 stabilizer Substances 0.000 claims abstract description 21
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 8
- 239000011574 phosphorus Substances 0.000 claims abstract description 8
- 238000000151 deposition Methods 0.000 claims abstract 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 15
- 229910052708 sodium Inorganic materials 0.000 claims description 15
- 239000011734 sodium Substances 0.000 claims description 15
- 239000008139 complexing agent Substances 0.000 claims description 14
- 229910052739 hydrogen Inorganic materials 0.000 claims description 13
- 239000001257 hydrogen Substances 0.000 claims description 13
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 13
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 12
- 229910052700 potassium Inorganic materials 0.000 claims description 12
- 239000011591 potassium Substances 0.000 claims description 12
- 150000002500 ions Chemical class 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 11
- 238000007772 electroless plating Methods 0.000 claims description 10
- 150000001735 carboxylic acids Chemical class 0.000 claims description 8
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 7
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 7
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 7
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 7
- 229910052744 lithium Inorganic materials 0.000 claims description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 7
- 229910001453 nickel ion Inorganic materials 0.000 claims description 7
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 7
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 claims description 6
- -1 hypophosphite compound Chemical class 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- 229910001385 heavy metal Inorganic materials 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims description 3
- 229910052793 cadmium Inorganic materials 0.000 claims description 3
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 3
- 229920000768 polyamine Polymers 0.000 claims description 3
- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims description 3
- 229910052716 thallium Inorganic materials 0.000 claims description 3
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 claims description 3
- GJYJYFHBOBUTBY-UHFFFAOYSA-N alpha-camphorene Chemical compound CC(C)=CCCC(=C)C1CCC(CCC=C(C)C)=CC1 GJYJYFHBOBUTBY-UHFFFAOYSA-N 0.000 claims description 2
- 229910001380 potassium hypophosphite Inorganic materials 0.000 claims description 2
- CRGPNLUFHHUKCM-UHFFFAOYSA-M potassium phosphinate Chemical compound [K+].[O-]P=O CRGPNLUFHHUKCM-UHFFFAOYSA-M 0.000 claims description 2
- 150000003460 sulfonic acids Chemical class 0.000 claims description 2
- 229910052787 antimony Inorganic materials 0.000 claims 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 claims 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 abstract 1
- 229910052717 sulfur Inorganic materials 0.000 abstract 1
- 239000011593 sulfur Substances 0.000 abstract 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 12
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 10
- 239000003638 chemical reducing agent Substances 0.000 description 6
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 6
- BJEPYKJPYRNKOW-UHFFFAOYSA-N malic acid Chemical compound OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 5
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 5
- 235000011114 ammonium hydroxide Nutrition 0.000 description 5
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 4
- 238000013019 agitation Methods 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 150000001991 dicarboxylic acids Chemical class 0.000 description 4
- 150000002763 monocarboxylic acids Chemical class 0.000 description 4
- 239000000080 wetting agent Substances 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000006172 buffering agent Substances 0.000 description 3
- 235000014655 lactic acid Nutrition 0.000 description 3
- 235000011090 malic acid Nutrition 0.000 description 3
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical group O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 3
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 3
- 150000003628 tricarboxylic acids Chemical class 0.000 description 3
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 2
- OBDVFOBWBHMJDG-UHFFFAOYSA-N 3-mercapto-1-propanesulfonic acid Chemical compound OS(=O)(=O)CCCS OBDVFOBWBHMJDG-UHFFFAOYSA-N 0.000 description 2
- QNAYBMKLOCPYGJ-UHFFFAOYSA-N Alanine Chemical compound CC([NH3+])C([O-])=O QNAYBMKLOCPYGJ-UHFFFAOYSA-N 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 239000001099 ammonium carbonate Substances 0.000 description 2
- 150000003863 ammonium salts Chemical class 0.000 description 2
- 229910001439 antimony ion Inorganic materials 0.000 description 2
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000004310 lactic acid Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000001630 malic acid Substances 0.000 description 2
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 2
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical compound OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- CKLJMWTZIZZHCS-UHFFFAOYSA-N D-OH-Asp Natural products OC(=O)C(N)CC(O)=O CKLJMWTZIZZHCS-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- CKLJMWTZIZZHCS-REOHCLBHSA-N L-aspartic acid Chemical compound OC(=O)[C@@H](N)CC(O)=O CKLJMWTZIZZHCS-REOHCLBHSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- 229960000583 acetic acid Drugs 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 235000012538 ammonium bicarbonate Nutrition 0.000 description 1
- 235000012501 ammonium carbonate Nutrition 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 230000000711 cancerogenic effect Effects 0.000 description 1
- 231100000357 carcinogen Toxicity 0.000 description 1
- 239000003183 carcinogenic agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- HCPOCMMGKBZWSJ-UHFFFAOYSA-N ethyl 3-hydrazinyl-3-oxopropanoate Chemical compound CCOC(=O)CC(=O)NN HCPOCMMGKBZWSJ-UHFFFAOYSA-N 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 229960002449 glycine Drugs 0.000 description 1
- 235000013905 glycine and its sodium salt Nutrition 0.000 description 1
- 229960004275 glycolic acid Drugs 0.000 description 1
- GQZXNSPRSGFJLY-UHFFFAOYSA-N hydroxyphosphanone Chemical compound OP=O GQZXNSPRSGFJLY-UHFFFAOYSA-N 0.000 description 1
- 229940005631 hypophosphite ion Drugs 0.000 description 1
- 238000011534 incubation Methods 0.000 description 1
- 229910001410 inorganic ion Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- LHUAYJZGTZYKSW-UHFFFAOYSA-M sodium;1-sulfanylpropane-1-sulfonate Chemical compound [Na+].CCC(S)S([O-])(=O)=O LHUAYJZGTZYKSW-UHFFFAOYSA-M 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
Abstract
Description
本発明は、ニッケルリン合金の無電解めっきのための水性めっき浴組成物に関する。
ニッケルリン合金の無電解めっきは種々の産業に使用されている。得られた堆積物は、例えば、耐摩耗性コーティング及びバリア層として使用されている。
a)重金属イオン、例えば、カドミウム、タリウム、鉛及びアンチモンイオンなど毒性挙動及び
b)2種以上の安定剤が無電解ニッケルめっき浴中に存在する場合、かかるめっき浴の使用中の安定剤の混合物の制御が複雑であること
である。
従って、本発明の課題は、有毒な重金属イオンベースの安定剤を含まないニッケルリン合金の無電解めっきのための浴組成物を提供することである。
これらの課題は、ニッケルリン合金の無電解めっき用の水性めっき浴組成物であって、
(i)ニッケルイオンの水溶性源
(ii)次亜リン酸化合物
(iii)少なくとも1種の錯化剤及び
(iv)以下の式(1)及び(2)
R1は、水素、メチル、エチル、プロピル、ブチル、リチウム、ナトリウム、カリウム及びアンモニウムからなる群から選択され、
nは1〜6の範囲であり、
R2は、水素、メチル、エチル、プロピル、ブチル、リチウム、ナトリウム、カリウム及びアンモニウムからなる群から選択され、
R3は、水素、メチル、エチル、プロピル、ブチル、リチウム、ナトリウム、カリウム及びアンモニウムからなる群から選択され、且つ
mは1〜6の範囲である)
による化合物からなる群から選択される安定剤
を含み、且つ
3.5〜6.5の範囲のpH値を有する、前記めっき浴組成物によって解決される。
本発明による水性めっき浴組成物は、ニッケルイオンの水溶性源、例えば、硫酸ニッケル、還元剤、例えば、次亜リン酸ナトリウム、少なくとも1種の錯化剤及び式(1)及び(2)による化合物から選択される安定剤を含む。
R1は、水素、メチル、エチル、プロピル、ブチル、リチウム、ナトリウム、カリウム及びアンモニウムからなる群から選択され、
nは1〜6の範囲であり
R2は、水素、メチル、エチル、プロピル、ブチル、リチウム、ナトリウム、カリウム及びアンモニウムからなる群から選択され、
R3は、水素、メチル、エチル、プロピル、ブチル、リチウム、ナトリウム、カリウム及びアンモニウムからなる群から選択され、且つ
mは1〜6の範囲である)
による化合物から選択される。
本発明は、ここで以下の非限定例を参照することにより例示される。
硫酸ニッケルとして6g/lのニッケルイオンを含む無電解ニッケルめっき浴、還元剤としての次亜リン酸、錯化剤としての乳酸及びリンゴ酸の混合物(全体濃度:150ミリモル/l)及び安定化添加剤としての鉛イオンを試験した。このめっき浴のpH値は4.8であった。めっきの結果を以下の表1にまとめる。
実施例1の場合に記載されたのと同じめっき浴を使用した。鉛イオンの代わりに、0.6g/lの式(1)(式中、R1=水素、R2=ナトリウム及びn=3)による安定剤(600ppm、US2006/0264043A1号に開示される)を、前記めっき浴に添加した。このめっき浴組成物のpH値をアンモニア水溶液を用いて9.25に調整した。めっき浴温度は物質の存在下で85℃に維持した。
実施例1の場合に記載されたのと同じめっき浴を使用した。鉛イオンの代わりに、0.6g/lの式(1)(式中、R1=水素、R2=ナトリウム及びn=3)による安定剤(600ppm、US2006/0264043A1号に開示される)を、前記めっき浴に添加した。このめっき浴組成物のpH値を、アンモニア水溶液を用いて4.8に調整した。めっき浴温度は物質の存在下で85℃に維持した。
実施例1の場合に記載されたのと同じめっき浴を使用した。鉛イオンの代わりに、0.6g/lのチオ尿素(600ppm、US2006/0264043A1号に開示される)を、安定剤として前記めっき浴に添加した。このめっき浴組成物のpH値を、アンモニア水溶液を用いて9.25に調整した。めっき浴温度は物質の存在下で85℃に維持した。
実施例1の場合に記載されたのと同じめっき浴を使用した。鉛イオンの代わりに、0.6g/lのチオ尿素(600ppm、US2006/0264043A1号に開示される)を、安定剤として前記めっき浴に添加した。このめっき浴組成物のpH値を、アンモニア水溶液を用いて4.8に調整した。めっき浴温度は物質の存在下で85℃に維持した。
実施例1の場合に記載されたのと同じめっき浴を使用した。鉛イオンの代わりに、式(1)(式中、R1=水素、R2=ナトリウム及びn=3)による安定剤を、前記めっき浴に添加した。このめっき浴のpH値は4.8であった。めっきの結果を以下の表2にまとめる。
Claims (9)
- ニッケルイオンの濃度が1〜18g/lの範囲である、請求項1に記載の水性めっき浴。
- 次亜リン酸化合物が亜リン酸、次亜リン酸ナトリウム、次亜リン酸カリウム及び次亜リン酸アンモニウムを含む群から選択される、請求項1又は2に記載の水性めっき浴組成物。
- 次亜リン酸化合物の濃度が2〜60g/lの範囲である、請求項1から3までのいずれか1項に記載の水性めっき浴。
- 少なくとも1種の錯化剤の濃度が1〜200g/lの範囲である、請求項1から4までのいずれか1項に記載の水性めっき浴。
- 式(1)及び(2)による安定剤の濃度が1〜100ppmの範囲である、請求項1から5までのいずれか1項に記載の水性めっき浴。
- めっき浴組成物が、カドミウム、タリウム、鉛及びアンチモンから選択される重金属イオンを本質的に含まない、請求項1から6までのいずれか1項に記載の水性めっき浴。
- 4〜6の範囲のpH値を有する、請求項1から7までのいずれか1項に記載の水性めっき浴。
- 5〜12質量%の範囲のリン濃度を有するニッケルリン合金の堆積方法であって、
(i)基板を提供する工程
(ii)前記基板と請求項1から8までのいずれか1項に記載の水性めっき浴とを接触させる工程
を含む、前記堆積方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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EP11175295.2 | 2011-07-26 | ||
EP11175295A EP2551375A1 (en) | 2011-07-26 | 2011-07-26 | Electroless nickel plating bath composition |
PCT/EP2012/062967 WO2013013941A1 (en) | 2011-07-26 | 2012-07-04 | Electroless nickel plating bath composition |
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JP2014521834A true JP2014521834A (ja) | 2014-08-28 |
JP6053785B2 JP6053785B2 (ja) | 2016-12-27 |
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JP2014522015A Active JP6053785B2 (ja) | 2011-07-26 | 2012-07-04 | 無電解ニッケルめっき浴組成物 |
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Country | Link |
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US (1) | US20140150689A1 (ja) |
EP (2) | EP2551375A1 (ja) |
JP (1) | JP6053785B2 (ja) |
KR (1) | KR101936977B1 (ja) |
CN (1) | CN103946420B (ja) |
TW (1) | TWI555878B (ja) |
WO (1) | WO2013013941A1 (ja) |
Families Citing this family (6)
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EP2551375A1 (en) | 2011-07-26 | 2013-01-30 | Atotech Deutschland GmbH | Electroless nickel plating bath composition |
US11685999B2 (en) | 2014-06-02 | 2023-06-27 | Macdermid Acumen, Inc. | Aqueous electroless nickel plating bath and method of using the same |
CN104152877B (zh) * | 2014-07-17 | 2017-02-15 | 广东致卓精密金属科技有限公司 | 一种化学镀镍液 |
EP3034650B1 (en) | 2014-12-16 | 2017-06-21 | ATOTECH Deutschland GmbH | Plating bath compositions for electroless plating of metals and metal alloys |
CN107429399B (zh) | 2015-03-20 | 2020-02-07 | 埃托特克德国有限公司 | 用于硅基材的活化方法 |
EP3190208B1 (en) * | 2016-01-06 | 2018-09-12 | ATOTECH Deutschland GmbH | Electroless nickel plating baths comprising aminonitriles and a method for deposition of nickel and nickel alloys |
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US20060264043A1 (en) * | 2005-03-18 | 2006-11-23 | Stewart Michael P | Electroless deposition process on a silicon contact |
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JPS502861B1 (ja) * | 1970-05-09 | 1975-01-29 | ||
CH620710A5 (en) * | 1975-10-06 | 1980-12-15 | Fedor Petrovich Potapov | Process for chemical nickel-plating of workpieces having a catalytic surface, and installation for carrying out the process |
US4150180A (en) * | 1975-12-08 | 1979-04-17 | Potapov Fedor P | Method for chemical nickel-plating of parts having a catalytic surface employing a vessel having an upper heated zone and a lower cooled zone |
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TW390915B (en) * | 1995-10-23 | 2000-05-21 | Uyemura C & Co Ltd | Electroless nickel plating solution and method |
JP3594894B2 (ja) * | 2000-02-01 | 2004-12-02 | 新光電気工業株式会社 | ビアフィリングめっき方法 |
DE10327374B4 (de) | 2003-06-18 | 2006-07-06 | Raschig Gmbh | Verwendung von propansulfonierten und 2-Hydroxy-propansulfonierten Alkylaminaloxylaten als Hilfsmittel zur elektrolytischen Abscheidung von metallischen Schichten und galvanische Bäder enthaltend diese |
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JP4731851B2 (ja) | 2004-07-28 | 2011-07-27 | キヤノン株式会社 | 画像転送システム |
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TWI348499B (en) * | 2006-07-07 | 2011-09-11 | Rohm & Haas Elect Mat | Electroless copper and redox couples |
DE602008000878D1 (de) * | 2008-07-15 | 2010-05-06 | Atotech Deutschland Gmbh | Lösung und Verfahren zur elektrochemischen Abscheidung eines Metalls auf ein Substrat |
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EP2199315B1 (en) | 2008-12-19 | 2013-12-11 | Basf Se | Composition for metal electroplating comprising leveling agent |
EP2551375A1 (en) | 2011-07-26 | 2013-01-30 | Atotech Deutschland GmbH | Electroless nickel plating bath composition |
-
2011
- 2011-07-26 EP EP11175295A patent/EP2551375A1/en not_active Withdrawn
-
2012
- 2012-07-04 US US14/131,949 patent/US20140150689A1/en not_active Abandoned
- 2012-07-04 KR KR1020147001368A patent/KR101936977B1/ko active IP Right Grant
- 2012-07-04 EP EP12743909.9A patent/EP2737107B1/en active Active
- 2012-07-04 WO PCT/EP2012/062967 patent/WO2013013941A1/en active Application Filing
- 2012-07-04 JP JP2014522015A patent/JP6053785B2/ja active Active
- 2012-07-04 CN CN201280036718.5A patent/CN103946420B/zh active Active
- 2012-07-26 TW TW101127003A patent/TWI555878B/zh active
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JPS6141774A (ja) * | 1984-03-05 | 1986-02-28 | オ−エムアイ・インタ−ナシヨナル コ−ポレ−シヨン | 水性・無電解ニツケル改良浴及び方法 |
US20060264043A1 (en) * | 2005-03-18 | 2006-11-23 | Stewart Michael P | Electroless deposition process on a silicon contact |
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KR20140041762A (ko) | 2014-04-04 |
EP2737107A1 (en) | 2014-06-04 |
TW201309844A (zh) | 2013-03-01 |
WO2013013941A1 (en) | 2013-01-31 |
CN103946420A (zh) | 2014-07-23 |
US20140150689A1 (en) | 2014-06-05 |
EP2737107B1 (en) | 2015-09-09 |
EP2551375A1 (en) | 2013-01-30 |
KR101936977B1 (ko) | 2019-01-09 |
TWI555878B (zh) | 2016-11-01 |
CN103946420B (zh) | 2015-11-25 |
JP6053785B2 (ja) | 2016-12-27 |
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