WO2013013941A1 - Electroless nickel plating bath composition - Google Patents

Electroless nickel plating bath composition Download PDF

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Publication number
WO2013013941A1
WO2013013941A1 PCT/EP2012/062967 EP2012062967W WO2013013941A1 WO 2013013941 A1 WO2013013941 A1 WO 2013013941A1 EP 2012062967 W EP2012062967 W EP 2012062967W WO 2013013941 A1 WO2013013941 A1 WO 2013013941A1
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Prior art keywords
plating bath
nickel
ranges
concentration
aqueous plating
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PCT/EP2012/062967
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French (fr)
Inventor
Boris Alexander Janssen
Holger BERA
Sebastian Weißbrod
Britta Schafsteller
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Atotech Deutschland Gmbh
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Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Priority to KR1020147001368A priority Critical patent/KR101936977B1/en
Priority to EP12743909.9A priority patent/EP2737107B1/en
Priority to US14/131,949 priority patent/US20140150689A1/en
Priority to JP2014522015A priority patent/JP6053785B2/en
Priority to CN201280036718.5A priority patent/CN103946420B/en
Publication of WO2013013941A1 publication Critical patent/WO2013013941A1/en

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Definitions

  • the present invention relates to an aqueous plating bath composition for the electroless deposition of nickel phosphorous alloys.
  • Electroless plating of nickel-phosphorous alloys is used in various industries.
  • the deposits derived are used e.g. as wear resistant coatings and barrier layers.
  • Such plating bath compositions generally comprise a source of nickel ions, a hypophosphite compound as the reducing agent, at least one complexing agent and at least one stabilizing agent.
  • the at least one stabilizing agent present is required in order to provide a sufficient bath lifetime, a reasonable deposition rate and to control the phosphorous content in the as deposited nickel phosphorous alloy.
  • plating baths for deposition of nickel-phosphorous alloys known in the art comprise more than one stabilizing agent.
  • Common stabilizing agents are selected from heavy metal ions such as cadmium, thallium, bismuth, lead and antimony ions, inorganic ions such as SCN " and various organic compounds such as thiourea.
  • the patent document US 2,830,014 discloses plating bath compositions for electroplating of nickel which comprise thioalkane sulfonic acids or salts thereof such as mercaptopropane-1 -sodium sulfonate as brightening and ductility- improving agents.
  • the patent application US 2005/0013928 A1 discloses an electroless plating pre-treatment solution which comprises 3-mercaptopropanesulfonic acid.
  • the pre-treatment solution reduces the incubation time (time from the start of the supply of an electroless plating solution to the start of the plating reaction) of nickel plating from an electroless plating bath on a copper surface.
  • the patent application US 2006/024043 A1 discloses an alkaline aqueous plating bath for deposition of nickel phosphorous alloys which optionally comprises further additives such as thiourea and/or 3-mercapto-1 -propane sulfonic acid. Such plating bath compositions are not acceptable for industrial applications (see Examples 2 to 5). Furthermore, thiourea is a carcinogenic substance.
  • the main disadvantages of known stabilizing agents are a) the toxic behaviour of heavy metal ions such as cadmium, thallium, lead and antimony ions and b) in case more than one stabilizing agent is present in an electroless nickel plating bath, the control of the mixture of stabilizing agents during use of such a plating bath is complex.
  • an aqueous plating bath composition for electro- less plating of a nickel phosphorous alloy comprising
  • a stabilizing agent selected from the group consisting of compounds according to formulae (1 ) and (2):
  • R 1 is selected from the group consisting of hydrogen, methyl, ethyl, propyl, butyl, lithium, sodium, potassium and ammonium, n ranges from 1 to 6,
  • R 2 is selected from the group consisting of hydrogen, methyl, ethyl, propyl, butyl, lithium, sodium, potassium and ammonium,
  • R 3 is selected from the group consisting of hydrogen, methyl, ethyl, propyl, butyl, lithium, sodium, potassium and ammonium and m ranges from 1 to 6 and having a pH value in the range of 3.5 to 6.5. From such a plating bath composition, a nickel phosphorous alloy having a phosphorous content in the range of 5 to 2 wt.-% of phosphorous is derived by electroless plating.
  • the aqueous plating bath composition according to the present invention comprises a water soluble source of nickel ions such as nickel sulfate, a reducing agent such as sodium hypophosphite, at least one complexing agent and a stabilizing agent selected from compounds according to formulae (1 ) and (2).
  • the concentration of nickel ions ranges from 1 to 18 g/l, more preferably from 3 to 9 g/l.
  • the reducing agent is selected from hypophosphite compounds such as hypo- phosphorous acid or a bath soluble salt thereof such as sodium hypophosphite, potassium hypophosphite and ammonium hypophosphite.
  • the amount of the reducing agent employed in the plating bath ranges from 2 to 60 g/l, more preferably from 2 to 50 g/l and most preferably from 20 to 45 g/l. As a conventional practice the reducing agent is replenished during the reaction.
  • the complexing agents are employed in amounts of 1 to 200 g/l, more preferably from 5 to 75 g/l.
  • carboxylic acids, polyamines and sulfonic acids or mixtures thereof are selected as complexing agents.
  • Useful carboxylic acids include mono-, di-, tri- and tetra-carboxylic acids.
  • the carboxylic acids may be substituted with various substituent moieties such as hydroxy or amino groups and the acids may be introduced into the plating solutions as their sodium, potassium or ammonium salts.
  • Some complexing agents such as acetic acid, for example, may also act as a buffering agent, and the appropriate concentration of such additive components can be optimised for any plating solution in consideration of their dual functionality.
  • carboxylic acids which are useful as the complexing agents include: monocarboxylic acids such as acetic acid, hydroxyacetic acid, amino- acetic acid, 2-amino propanoic acid, 2-hydroxy propanoic acid, lactic acid; di- carboxylic acids such as succinic acid, amino succinic acid, hydroxy succinic acid, propanedioic acid, hydroxybutanedioic acid, tartaric acid, malic acid; tricarboxylic acids such as 2-hydroxy- ,2,3 propane tricarboxylic acid; and tetra- carboxylic acids such as ethylene diamine tetra acetic acid (EDTA).
  • monocarboxylic acids such as acetic acid, hydroxyacetic acid, amino- acetic acid, 2-amino propanoic acid, 2-hydroxy propanoic acid, lactic acid
  • di- carboxylic acids such as succinic acid, amino succinic acid, hydroxy succinic acid, propanedioic acid, hydroxy
  • the most preferred complexing agents are selected from the group consisting of mono-carboxylic acids and di-carboxylic acids. In one embodiment, mixtures of two or more of the above complexing agents are utilized.
  • the stabilizing agent is selected from compounds according to formulae (1 ) and
  • R is selected from the group consisting of hydrogen, methyl, ethyl, propyl, butyl, lithium, sodium, potassium and ammonium, n ranges from 1 to 6
  • R 2 is selected from the group consisting of hydrogen, methyl, ethyl propyl, butyl, lithium, sodium, potassium and ammonium,
  • R 3 is selected from the group consisting of hydrogen, methyl, ethyl propyl, butyl, lithium, sodium, potassium and ammonium and m ranges from 1 to 6. More preferably, R 1 is selected from the group consisting of hydrogen, sodium and potassium.
  • n ranges from 2 to 4.
  • R 2 is selected from the group consisting of hydrogen, sodium and potassium.
  • R 3 is selected from the group consisting of hydrogen, sodium and potassium.
  • m ranges from 2 to 4.
  • the concentration of the stabilizing agent according to formulae (1 ) and (2) in the plating bath composition preferably ranges from 1 to 100 ppm, more preferably from 2 to 50 ppm and most preferably from 3 to 30 ppm.
  • the pH may be periodically or continuously adjusted by adding bath-soluble and bath-compatible alkaline substances such as sodium, potassium or ammonium hydroxides, carbonates and bicar- bonates.
  • bath-soluble and bath-compatible alkaline substances such as sodium, potassium or ammonium hydroxides, carbonates and bicar- bonates.
  • the stability of the operating pH of the plating solutions can be improved by the addition of various buffer compounds such as acetic acid, propionic acid, boric acid, or the like, in amounts of up to 30 g/l, more preferably from 2 to 10 g/l.
  • the pH value of the aqueous plating bath according to the present invention preferably ranges from 3.5 to 6.5, more preferably from 4 to 6.
  • nickel plating solutions such as buffers and wetting agents. These materials are known in the art.
  • the nickel plating solutions optionally may employ one or more wetting agents of any of the various types heretofore known which are soluble and compatible with the other bath constituents.
  • wetting agents prevents or hinders pitting of the nickel phosphorous alloy deposit, and the wetting agents can be employed in amounts up to about 1 g/l.
  • the substrate to be plated is contacted with the plating bath at a temperature of at least 40°C up to 95 °C.
  • the electroless nickel plating baths according to the present invention are employed, in one embodiment, at a temperature of from 70°C to 95°C, and more often, at a temperature of from 80°C to 90°C.
  • the duration of contact of the electroless nickel plating bath with the substrate being plated is a function which is dependent on the desired thickness of the nickel phosphorus alloy. Typically, a contact time can range from 1 to 30 min.
  • the substrate to be coated with a nickel phosphorous alloy can be contacted with the plating bath according to the present invention by dipping the substrate into the plating bath or by spraying the plating bath onto the substrate.
  • mild agitation may be employed. Agitation may be a mild air agitation, mechanical agitation, bath cir- culation by pumping, rotation of a barrel plating, etc.
  • the plating solution may also be subjected to a periodic or continuous filtration treatment to reduce the level of contaminants therein. Replenishment of the constituents of the bath may also be performed, in some embodiments, on a periodic or continuous basis to maintain the concentration of constituents, and in particular, the concen- tration of nickel ions and hypophosphite ions, as well as the pH level within the desired limits.
  • An electroless nickel plating bath comprising 6 g/l nickel ions as nickel sulfate, hypophosphite as reducing agent, a mixture of lactic acid and malic acid as complexing agents (overall concentration: 150 mmol/l) and lead ions as stabiliz- ing additive was tested.
  • the pH value of this plating bath was 4.8.
  • the plating results are summarised in Table 1 .
  • the phosphorous concentration in the deposited nickel phosphorous alloys increases from 7.0 wt.-% at 1 MTO to 8.3 wt.-% at 3 MTO.
  • the stabilizing agent according to the present invention shows the desired properties in respect to the stable phosphorous concentration in the deposited nickel phosphorous alloy layers when using the plating bath. Furthermore, the plating rate is sufficient for industrial application.

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

The present invention relates to an aqueous plating bath composition for depositing a nickel phosphorous alloy having a phosphorous content in the range of to 12 wt.-%. The plating bath comprises a sulfur-containing organic stabilizing agent.

Description

Electroless Nickel Plating Bath Composition
Field of the Invention
The present invention relates to an aqueous plating bath composition for the electroless deposition of nickel phosphorous alloys.
Background of the Invention
Electroless plating of nickel-phosphorous alloys is used in various industries. The deposits derived are used e.g. as wear resistant coatings and barrier layers.
Such plating bath compositions generally comprise a source of nickel ions, a hypophosphite compound as the reducing agent, at least one complexing agent and at least one stabilizing agent.
The at least one stabilizing agent present is required in order to provide a sufficient bath lifetime, a reasonable deposition rate and to control the phosphorous content in the as deposited nickel phosphorous alloy. Often, plating baths for deposition of nickel-phosphorous alloys known in the art comprise more than one stabilizing agent.
Common stabilizing agents are selected from heavy metal ions such as cadmium, thallium, bismuth, lead and antimony ions, inorganic ions such as SCN" and various organic compounds such as thiourea.
The patent document US 2,830,014 discloses plating bath compositions for electroplating of nickel which comprise thioalkane sulfonic acids or salts thereof such as mercaptopropane-1 -sodium sulfonate as brightening and ductility- improving agents.
The patent application US 2005/0013928 A1 discloses an electroless plating pre-treatment solution which comprises 3-mercaptopropanesulfonic acid. The pre-treatment solution reduces the incubation time (time from the start of the supply of an electroless plating solution to the start of the plating reaction) of nickel plating from an electroless plating bath on a copper surface.
The patent application US 2006/024043 A1 discloses an alkaline aqueous plating bath for deposition of nickel phosphorous alloys which optionally comprises further additives such as thiourea and/or 3-mercapto-1 -propane sulfonic acid. Such plating bath compositions are not acceptable for industrial applications (see Examples 2 to 5). Furthermore, thiourea is a carcinogenic substance.
The main disadvantages of known stabilizing agents are a) the toxic behaviour of heavy metal ions such as cadmium, thallium, lead and antimony ions and b) in case more than one stabilizing agent is present in an electroless nickel plating bath, the control of the mixture of stabilizing agents during use of such a plating bath is complex.
Objective of the Invention
Therefore it is the objective of the present invention to provide a bath composition for electroless deposition of nickel phosphorous alloys which is free of toxic heavy metal ion based stabilizers.
It is a further objective of the present invention to provide a bath composition for electroless deposition of nickel phosphorous alloys which allows deposition of a nickel phosphorous alloy having a phosphorous concentration in the range of 5 to 12 wt.-%. Summary of the Invention
These objectives are solved by an aqueous plating bath composition for electro- less plating of a nickel phosphorous alloy, the plating bath comprising
(i) a water soluble source of nickel ions
(ii) a hypophosphite compound
(iii) at least one complexing agent and
(iv) a stabilizing agent selected from the group consisting of compounds according to formulae (1 ) and (2):
R1S— (CH2)n— SO3R2 (1 )
R3SO3-(CH2)m-S-S-(CH2)m-SO3R3 (2) wherein
R1 is selected from the group consisting of hydrogen, methyl, ethyl, propyl, butyl, lithium, sodium, potassium and ammonium, n ranges from 1 to 6,
R2 is selected from the group consisting of hydrogen, methyl, ethyl, propyl, butyl, lithium, sodium, potassium and ammonium,
R3 is selected from the group consisting of hydrogen, methyl, ethyl, propyl, butyl, lithium, sodium, potassium and ammonium and m ranges from 1 to 6 and having a pH value in the range of 3.5 to 6.5. From such a plating bath composition, a nickel phosphorous alloy having a phosphorous content in the range of 5 to 2 wt.-% of phosphorous is derived by electroless plating.
Detailed Description of the Invention
The aqueous plating bath composition according to the present invention comprises a water soluble source of nickel ions such as nickel sulfate, a reducing agent such as sodium hypophosphite, at least one complexing agent and a stabilizing agent selected from compounds according to formulae (1 ) and (2).
The concentration of nickel ions ranges from 1 to 18 g/l, more preferably from 3 to 9 g/l.
The reducing agent is selected from hypophosphite compounds such as hypo- phosphorous acid or a bath soluble salt thereof such as sodium hypophosphite, potassium hypophosphite and ammonium hypophosphite. The amount of the reducing agent employed in the plating bath ranges from 2 to 60 g/l, more preferably from 2 to 50 g/l and most preferably from 20 to 45 g/l. As a conventional practice the reducing agent is replenished during the reaction.
The complexing agents are employed in amounts of 1 to 200 g/l, more preferably from 5 to 75 g/l.
In one embodiment of the present invention, carboxylic acids, polyamines and sulfonic acids or mixtures thereof are selected as complexing agents. Useful carboxylic acids include mono-, di-, tri- and tetra-carboxylic acids. The carboxylic acids may be substituted with various substituent moieties such as hydroxy or amino groups and the acids may be introduced into the plating solutions as their sodium, potassium or ammonium salts. Some complexing agents such as acetic acid, for example, may also act as a buffering agent, and the appropriate concentration of such additive components can be optimised for any plating solution in consideration of their dual functionality. Examples of such carboxylic acids which are useful as the complexing agents include: monocarboxylic acids such as acetic acid, hydroxyacetic acid, amino- acetic acid, 2-amino propanoic acid, 2-hydroxy propanoic acid, lactic acid; di- carboxylic acids such as succinic acid, amino succinic acid, hydroxy succinic acid, propanedioic acid, hydroxybutanedioic acid, tartaric acid, malic acid; tricarboxylic acids such as 2-hydroxy- ,2,3 propane tricarboxylic acid; and tetra- carboxylic acids such as ethylene diamine tetra acetic acid (EDTA).
The most preferred complexing agents are selected from the group consisting of mono-carboxylic acids and di-carboxylic acids. In one embodiment, mixtures of two or more of the above complexing agents are utilized.
The stabilizing agent is selected from compounds according to formulae (1 ) and
(2):
R1S— (CH2)n— SO3R2 (1 )
R3SO3— (CH2)m— S— S— (CH2)m— SO3R3 (2) wherein
R is selected from the group consisting of hydrogen, methyl, ethyl, propyl, butyl, lithium, sodium, potassium and ammonium, n ranges from 1 to 6
R2 is selected from the group consisting of hydrogen, methyl, ethyl propyl, butyl, lithium, sodium, potassium and ammonium,
R3 is selected from the group consisting of hydrogen, methyl, ethyl propyl, butyl, lithium, sodium, potassium and ammonium and m ranges from 1 to 6. More preferably, R1 is selected from the group consisting of hydrogen, sodium and potassium.
More preferably, n ranges from 2 to 4.
More preferably, R2 is selected from the group consisting of hydrogen, sodium and potassium.
More preferably, R3 is selected from the group consisting of hydrogen, sodium and potassium.
More preferably, m ranges from 2 to 4.
The concentration of the stabilizing agent according to formulae (1 ) and (2) in the plating bath composition preferably ranges from 1 to 100 ppm, more preferably from 2 to 50 ppm and most preferably from 3 to 30 ppm.
Since the plating solution has a tendency to become more acidic during its operation due to the formation of H30+ ions, the pH may be periodically or continuously adjusted by adding bath-soluble and bath-compatible alkaline substances such as sodium, potassium or ammonium hydroxides, carbonates and bicar- bonates. The stability of the operating pH of the plating solutions can be improved by the addition of various buffer compounds such as acetic acid, propionic acid, boric acid, or the like, in amounts of up to 30 g/l, more preferably from 2 to 10 g/l.
The pH value of the aqueous plating bath according to the present invention preferably ranges from 3.5 to 6.5, more preferably from 4 to 6.
Other materials may be included in the nickel plating solutions such as buffers and wetting agents. These materials are known in the art.
The nickel plating solutions optionally may employ one or more wetting agents of any of the various types heretofore known which are soluble and compatible with the other bath constituents. In one embodiment, the use of such wetting agents prevents or hinders pitting of the nickel phosphorous alloy deposit, and the wetting agents can be employed in amounts up to about 1 g/l.
The substrate to be plated is contacted with the plating bath at a temperature of at least 40°C up to 95 °C. The electroless nickel plating baths according to the present invention are employed, in one embodiment, at a temperature of from 70°C to 95°C, and more often, at a temperature of from 80°C to 90°C.
The duration of contact of the electroless nickel plating bath with the substrate being plated is a function which is dependent on the desired thickness of the nickel phosphorus alloy. Typically, a contact time can range from 1 to 30 min. The substrate to be coated with a nickel phosphorous alloy can be contacted with the plating bath according to the present invention by dipping the substrate into the plating bath or by spraying the plating bath onto the substrate.
During the deposition of the nickel phosphorous alloy, mild agitation may be employed. Agitation may be a mild air agitation, mechanical agitation, bath cir- culation by pumping, rotation of a barrel plating, etc. The plating solution may also be subjected to a periodic or continuous filtration treatment to reduce the level of contaminants therein. Replenishment of the constituents of the bath may also be performed, in some embodiments, on a periodic or continuous basis to maintain the concentration of constituents, and in particular, the concen- tration of nickel ions and hypophosphite ions, as well as the pH level within the desired limits.
Examples
The invention will now be illustrated by reference to the following non-limiting examples. Example 1 (comparative)
An electroless nickel plating bath comprising 6 g/l nickel ions as nickel sulfate, hypophosphite as reducing agent, a mixture of lactic acid and malic acid as complexing agents (overall concentration: 150 mmol/l) and lead ions as stabiliz- ing additive was tested. The pH value of this plating bath was 4.8. The plating results are summarised in Table 1 .
Table 1 : plating results obtained for an electroless nickel plating bath known from prior art (MTO = metal turn over).
Sample MTO Lead concenP concentration in dePlating rate
No. tration / ppm posited layer / wt.-% / pm/h
1 1 0.9 7.0 1 1 .8
2 2 1 .2 7.7 1 1 .9
3 3 1 .3 8.3 1 1 .0
The phosphorous concentration in the deposited nickel phosphorous alloys increases from 7.0 wt.-% at 1 MTO to 8.3 wt.-% at 3 MTO.
Example 2 (comparative)
The same plating bath as described for example 1 was used. Instead of lead ions, 0.6 g/l of a stabilizing agent according to formula (1 ) with R1 = hydrogen, R2 = sodium and n = 3 (600 ppm, as disclosed in US 2006/0264043 A1 ) was added to said plating bath. The pH value of this plating bath composition was adjusted with an aqueous solution of ammonia to 9.25. The plating bath temperature was held at 85 °C in presence of the substrate.
No nickel phosphorous alloy layer was deposited onto the substrate. Accordingly, the plating rate of this plating bath is 0 pm/h.
Example 3 (comparative)
The same plating bath as described for example 1 was used. Instead of lead ions, 0.6 g/l of a stabilizing agent according to formula (1 ) with R1 = hydrogen, R2 = sodium and n = 3 (600 ppm, as disclosed in US 2006/0264043 A1 ) was added to said plating bath. The pH value of this plating bath composition was adjusted with an aqueous solution of ammonia to 4.8. The plating bath temperature was held at 85 °C in presence of the substrate. No nickel phosphorous alloy layer was deposited onto the substrate. Accordingly, the plating rate of this plating bath is 0 m/h.
Example 4 (comparative)
The same plating bath as described for example 1 was used. Instead of lead ions, 0.6 g/l of thiourea (600 ppm, as disclosed in US 2006/0264043 A1 ) were added to the plating bath as stabilizing agent. The pH value of this plating bath composition was adjusted with an aqueous solution of ammonia to 9.25. The plating bath temperature was held at 85 °C in presence of the substrate.
No nickel phosphorous alloy layer was deposited onto the substrate. Accordingly, the plating rate of this plating bath is 0 pm/h.
Example 5 (comparative)
The same plating bath as described for example 1 was used. Instead of lead ions, 0.6 g/l of thiourea (600 ppm, as disclosed in US 2006/0264043 A1 ) were added to the plating bath as stabilizing agent. The pH value of this plating bath composition was adjusted with an aqueous solution of ammonia to 4.8. The plating bath temperature was held at 85 °C in presence of the substrate.
No nickel phosphorous alloy layer was deposited onto the substrate. Accordingly, the plating rate of this plating bath is 0 pm/h.
Example 6 (present invention)
The same plating bath as described for example 1 was used. Instead of lead ions, a stabilizing agent according to formula (1 ) with R1 = hydrogen, R2 = sodium and n = 3 was added to said plating bath. The pH value of this plating bath was 4.8. The plating results are summarized in Table 2. Table 2: plating results obtained for an electroless nickel plating bath known from prior art (MTO = metal turn over).
Sample MTO Stabilising agent P concentration in dePlating rate
No. concentration posited layer / wt.-% / pm/h
/ ppm
1 1 5 8.2 12.3
2 2 5 7.9 12.3
3 3 5 8.2 1 1 .2
The stabilizing agent according to the present invention shows the desired properties in respect to the stable phosphorous concentration in the deposited nickel phosphorous alloy layers when using the plating bath. Furthermore, the plating rate is sufficient for industrial application.

Claims

C L A I M S
1 . An aqueous plating bath composition for electroless plating of a nickel phosphorous alloy, the plating bath comprising
(i) a water soluble source of nickel ions
(ii) a hypophosphite compound
(iii) at least one complexing agent selected from the group comprising carboxylic acids, polyamines, sulfonic acids and mixtures thereof and
(iv) a stabilizing agent selected from the group consisting of compounds according to formulae (1 ) and (2):
R1S— (CH2)n— SO3R2 (1 )
R3SO3-(CH2)m-S-S-(CH2)m-SO3R3 (2) wherein
R1 , R2 and R3 are independently selected from the group consisting of hydrogen, methyl, ethyl, propyl, butyl, lithium, sodium, potassium and ammonium, n ranges from 1 to 6 and m ranges from 1 to 6 and having a pH value in the range of 3.5 to 6.5.
2. The aqueous plating bath according to claim 1 wherein the concentration of nickel ions ranges from 1 to 8 g/l. The aqueous plating bath composition according to any of the foregoing claims wherein the hypophosphite compound is selected from the group comprising phosphorous acid, sodium hypophosphite, potassium hypophosphite and ammonium hypophosphite.
The aqueous plating bath according to any of the foregoing claims wherein the concentration of the hypophosphite compound ranges from 2 to 60 g/l.
The aqueous plating bath according to any of the foregoing claims wherein the concentration of the at least one complexing agent ranges from 1 to 200 g/l.
The aqueous plating bath according to any of the foregoing claims wherein the concentration of the stabilizing agent according to formulae (1 ) and (2) ranges from 1 to 100 ppm.
The aqueous plating bath according to any of the foregoing claims wherein the plating bath composition is essentially free of heavy metal ions selected from cadmium, thallium, lead and antimony.
The aqueous plating bath according to any of the foregoing claims having a pH value in the range of 4 to 6.
Method for depositing a nickel phosphorous alloy having a phosphorous concentration in the range of 5 to 12 wt.-%, the method comprising the steps of
(i) providing a substrate
(ii) contacting said substrate with an aqueous plating bath according to claims 1 to 8.
PCT/EP2012/062967 2011-07-26 2012-07-04 Electroless nickel plating bath composition WO2013013941A1 (en)

Priority Applications (5)

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KR1020147001368A KR101936977B1 (en) 2011-07-26 2012-07-04 Electroless nickel plating bath composition
EP12743909.9A EP2737107B1 (en) 2011-07-26 2012-07-04 Electroless nickel plating bath composition
US14/131,949 US20140150689A1 (en) 2011-07-26 2012-07-04 Electroless nickel plating bath composition
JP2014522015A JP6053785B2 (en) 2011-07-26 2012-07-04 Electroless nickel plating bath composition
CN201280036718.5A CN103946420B (en) 2011-07-26 2012-07-04 Electroless nickel plating bath compositions

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EP11175295A EP2551375A1 (en) 2011-07-26 2011-07-26 Electroless nickel plating bath composition
EP11175295.2 2011-07-26

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EP3034650A1 (en) 2014-12-16 2016-06-22 ATOTECH Deutschland GmbH Plating bath compositions for electroless plating of metals and metal alloys
WO2016150879A1 (en) 2015-03-20 2016-09-29 Atotech Deutschland Gmbh Activation method for silicon substrates
EP3190208A1 (en) 2016-01-06 2017-07-12 ATOTECH Deutschland GmbH Electroless nickel plating baths comprising aminonitriles and a method for deposition of nickel and nickel alloys

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Publication number Priority date Publication date Assignee Title
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US11685999B2 (en) 2014-06-02 2023-06-27 Macdermid Acumen, Inc. Aqueous electroless nickel plating bath and method of using the same
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