JP2014512693A5 - - Google Patents
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- JP2014512693A5 JP2014512693A5 JP2014506519A JP2014506519A JP2014512693A5 JP 2014512693 A5 JP2014512693 A5 JP 2014512693A5 JP 2014506519 A JP2014506519 A JP 2014506519A JP 2014506519 A JP2014506519 A JP 2014506519A JP 2014512693 A5 JP2014512693 A5 JP 2014512693A5
- Authority
- JP
- Japan
- Prior art keywords
- spectrum
- spectra
- different
- instructions
- transmission curves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001228 spectrum Methods 0.000 claims 63
- 230000005540 biological transmission Effects 0.000 claims 29
- 238000000034 method Methods 0.000 claims 11
- 238000005498 polishing Methods 0.000 claims 11
- 239000000758 substrate Substances 0.000 claims 9
- 238000004590 computer program Methods 0.000 claims 8
- 230000003287 optical effect Effects 0.000 claims 8
- 238000011065 in-situ storage Methods 0.000 claims 4
- 238000002834 transmittance Methods 0.000 claims 4
- 238000005259 measurement Methods 0.000 claims 3
- 238000003860 storage Methods 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
- 230000003595 spectral effect Effects 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/091,965 US8547538B2 (en) | 2011-04-21 | 2011-04-21 | Construction of reference spectra with variations in environmental effects |
| US13/091,965 | 2011-04-21 | ||
| PCT/US2012/034109 WO2012145418A2 (en) | 2011-04-21 | 2012-04-18 | Construction of reference spectra with variations in environmental effects |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014512693A JP2014512693A (ja) | 2014-05-22 |
| JP2014512693A5 true JP2014512693A5 (https=) | 2015-06-11 |
| JP6017538B2 JP6017538B2 (ja) | 2016-11-02 |
Family
ID=47021106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014506519A Active JP6017538B2 (ja) | 2011-04-21 | 2012-04-18 | 環境の影響の変動を伴う基準スペクトルの構築 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8547538B2 (https=) |
| JP (1) | JP6017538B2 (https=) |
| KR (1) | KR101930111B1 (https=) |
| TW (1) | TWI465314B (https=) |
| WO (1) | WO2012145418A2 (https=) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8747189B2 (en) * | 2011-04-26 | 2014-06-10 | Applied Materials, Inc. | Method of controlling polishing |
| TWI641921B (zh) * | 2011-08-01 | 2018-11-21 | Nova Measuring Instruments Ltd. | 用以檢驗圖案化結構量測的監測系統及方法 |
| EP2834619A1 (en) * | 2012-04-05 | 2015-02-11 | Renishaw Diagnostics Limited | A method for calibrating spectroscopy apparatus and equipment for use in the method |
| US9248544B2 (en) * | 2012-07-18 | 2016-02-02 | Applied Materials, Inc. | Endpoint detection during polishing using integrated differential intensity |
| US9056383B2 (en) | 2013-02-26 | 2015-06-16 | Applied Materials, Inc. | Path for probe of spectrographic metrology system |
| US20140242881A1 (en) * | 2013-02-27 | 2014-08-28 | Applied Materials, Inc. | Feed forward parameter values for use in theoretically generating spectra |
| TWI487888B (zh) * | 2013-09-30 | 2015-06-11 | Ind Tech Res Inst | 掃描式光柵光譜儀 |
| KR102497215B1 (ko) | 2016-05-16 | 2023-02-07 | 삼성전자 주식회사 | 계측 설비의 스펙트럼 보정방법, 및 그 스펙트럼 보정방법을 기반으로 하는 소자의 계측방법과 제조방법 |
| CN109844923B (zh) * | 2016-10-10 | 2023-07-11 | 应用材料公司 | 用于化学机械抛光的实时轮廓控制 |
| KR102580487B1 (ko) * | 2018-06-18 | 2023-09-21 | 주식회사 케이씨텍 | 패드 모니터링 장치 및 이를 포함하는 패드 모니터링 시스템, 패드 모니터링 방법 |
| JP7532262B2 (ja) | 2018-06-28 | 2024-08-13 | アプライド マテリアルズ インコーポレイテッド | 分光画像モニタリングのための機械学習システム向けのトレーニングスペクトルの生成 |
| US10886155B2 (en) * | 2019-01-16 | 2021-01-05 | Applied Materials, Inc. | Optical stack deposition and on-board metrology |
| WO2021101993A1 (en) * | 2019-11-21 | 2021-05-27 | Lam Research Corporation | Detection and location of anomalous plasma events in fabrication chambers |
| JP7469032B2 (ja) * | 2019-12-10 | 2024-04-16 | 株式会社荏原製作所 | 研磨方法および研磨装置 |
| US11544838B2 (en) * | 2020-03-21 | 2023-01-03 | Kla Corporation | Systems and methods of high-resolution review for semiconductor inspection in backend and wafer level packaging |
| EP4215312A4 (en) * | 2020-09-15 | 2024-10-16 | National University Corporation Nagaoka University of Technology | Polishing state analysis prediction program, storage device, cathode luminescence device, and polishing state analysis prediction method |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01206236A (ja) * | 1988-02-15 | 1989-08-18 | Hitachi Ltd | 石英材質判別装置 |
| US6361646B1 (en) * | 1998-06-08 | 2002-03-26 | Speedfam-Ipec Corporation | Method and apparatus for endpoint detection for chemical mechanical polishing |
| WO2000057127A1 (en) | 1999-03-22 | 2000-09-28 | Sensys Instruments Corporation | Method and apparatus for wafer metrology |
| US6334807B1 (en) * | 1999-04-30 | 2002-01-01 | International Business Machines Corporation | Chemical mechanical polishing in-situ end point system |
| US6707540B1 (en) | 1999-12-23 | 2004-03-16 | Kla-Tencor Corporation | In-situ metalization monitoring using eddy current and optical measurements |
| TW534854B (en) * | 2000-08-31 | 2003-06-01 | Motorola Inc | Method and apparatus for measuring a polishing condition |
| JP3804064B2 (ja) * | 2001-12-04 | 2006-08-02 | 株式会社東京精密 | ウェーハ研磨装置の研磨終点検出方法及び装置 |
| TW590850B (en) * | 2001-12-28 | 2004-06-11 | Macronix Int Co Ltd | Method of determining the endpoint of a chemical mechanical polishing process |
| JP2004055995A (ja) * | 2002-07-23 | 2004-02-19 | Seiko Epson Corp | Ｃｍｐ装置、ｃｍｐ研磨方法、半導体装置及びその製造方法 |
| JP4542324B2 (ja) | 2002-10-17 | 2010-09-15 | 株式会社荏原製作所 | 研磨状態監視装置及びポリッシング装置 |
| TWI235234B (en) * | 2003-07-11 | 2005-07-01 | Air Liquide | Method and apparatus for monitoring of slurry consistency |
| KR100644390B1 (ko) | 2005-07-20 | 2006-11-10 | 삼성전자주식회사 | 박막 두께 측정방법 및 이를 수행하기 위한 장치 |
| WO2007024807A2 (en) * | 2005-08-22 | 2007-03-01 | Applied Materials, Inc. | Apparatus and methods for spectrum based monitoring of chemical mechanical polishing |
| US8392012B2 (en) | 2008-10-27 | 2013-03-05 | Applied Materials, Inc. | Multiple libraries for spectrographic monitoring of zones of a substrate during processing |
| US7409260B2 (en) | 2005-08-22 | 2008-08-05 | Applied Materials, Inc. | Substrate thickness measuring during polishing |
| EP1969353A1 (en) * | 2005-12-12 | 2008-09-17 | Platform Development&Investment Ltd. | Assessment of diamond color |
| US7494929B2 (en) | 2006-04-27 | 2009-02-24 | Applied Materials, Inc. | Automatic gain control |
| JP5006883B2 (ja) * | 2006-10-06 | 2012-08-22 | 株式会社荏原製作所 | 加工終点検知方法および加工装置 |
| KR101504508B1 (ko) * | 2007-02-23 | 2015-03-20 | 어플라이드 머티어리얼스, 인코포레이티드 | 연마 엔드포인트들을 결정하기 위한 스펙트럼 사용 |
| JP2009088486A (ja) * | 2007-08-29 | 2009-04-23 | Applied Materials Inc | 高スループット低形状銅ｃｍｐ処理 |
| JP5367246B2 (ja) * | 2007-09-28 | 2013-12-11 | Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 | 半導体ウェーハの研磨装置及び研磨方法 |
| US20090275265A1 (en) * | 2008-05-02 | 2009-11-05 | Applied Materials, Inc. | Endpoint detection in chemical mechanical polishing using multiple spectra |
| JP2010014642A (ja) * | 2008-07-07 | 2010-01-21 | Sony Corp | 光強度測定方法及び光強度測定装置 |
| JP5774482B2 (ja) * | 2008-10-27 | 2015-09-09 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 処理中の基板の分光モニタリングにおける適合度 |
| US20100103422A1 (en) | 2008-10-27 | 2010-04-29 | Applied Materials, Inc. | Goodness of fit in spectrographic monitoring of a substrate during processing |
| US20100114532A1 (en) | 2008-11-03 | 2010-05-06 | Applied Materials, Inc. | Weighted spectrographic monitoring of a substrate during processing |
| US8292693B2 (en) * | 2008-11-26 | 2012-10-23 | Applied Materials, Inc. | Using optical metrology for wafer to wafer feed back process control |
-
2011
- 2011-04-21 US US13/091,965 patent/US8547538B2/en not_active Expired - Fee Related
-
2012
- 2012-04-18 WO PCT/US2012/034109 patent/WO2012145418A2/en not_active Ceased
- 2012-04-18 JP JP2014506519A patent/JP6017538B2/ja active Active
- 2012-04-18 KR KR1020137030987A patent/KR101930111B1/ko active Active
- 2012-04-19 TW TW101113988A patent/TWI465314B/zh active