JP2014507799A5 - - Google Patents
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- Publication number
- JP2014507799A5 JP2014507799A5 JP2013549488A JP2013549488A JP2014507799A5 JP 2014507799 A5 JP2014507799 A5 JP 2014507799A5 JP 2013549488 A JP2013549488 A JP 2013549488A JP 2013549488 A JP2013549488 A JP 2013549488A JP 2014507799 A5 JP2014507799 A5 JP 2014507799A5
- Authority
- JP
- Japan
- Prior art keywords
- composition
- film
- forming metal
- oxyethylene
- independently
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims 10
- 229910052751 metal Inorganic materials 0.000 claims 10
- -1 nitrogen heteroaromatic compound Chemical class 0.000 claims 7
- 229910052757 nitrogen Inorganic materials 0.000 claims 6
- 238000005498 polishing Methods 0.000 claims 6
- 239000003795 chemical substances by application Substances 0.000 claims 4
- 150000003839 salts Chemical class 0.000 claims 4
- 239000000126 substance Substances 0.000 claims 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 3
- ULRPISSMEBPJLN-UHFFFAOYSA-N 2h-tetrazol-5-amine Chemical compound NC1=NN=NN1 ULRPISSMEBPJLN-UHFFFAOYSA-N 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims 2
- 229910019142 PO4 Inorganic materials 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 239000008365 aqueous carrier Substances 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 239000010419 fine particle Substances 0.000 claims 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 2
- 239000010452 phosphate Substances 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000004471 Glycine Substances 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 239000008139 complexing agent Substances 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 235000006408 oxalic acid Nutrition 0.000 claims 1
- HBROZNQEVUILML-UHFFFAOYSA-N salicylhydroxamic acid Chemical compound ONC(=O)C1=CC=CC=C1O HBROZNQEVUILML-UHFFFAOYSA-N 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/004,113 US8435421B2 (en) | 2007-11-27 | 2011-01-11 | Metal-passivating CMP compositions and methods |
| US13/004,113 | 2011-01-11 | ||
| PCT/US2012/020737 WO2012096931A2 (en) | 2011-01-11 | 2012-01-10 | Metal-passivating cmp compositions and methods |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014507799A JP2014507799A (ja) | 2014-03-27 |
| JP2014507799A5 true JP2014507799A5 (enExample) | 2015-03-05 |
| JP5992925B2 JP5992925B2 (ja) | 2016-09-14 |
Family
ID=46507631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013549488A Active JP5992925B2 (ja) | 2011-01-11 | 2012-01-10 | 金属を不動態化する化学機械研磨用組成物及び方法 |
Country Status (9)
| Country | Link |
|---|---|
| EP (1) | EP2663604B1 (enExample) |
| JP (1) | JP5992925B2 (enExample) |
| KR (2) | KR102077618B1 (enExample) |
| CN (1) | CN103298903B (enExample) |
| IL (1) | IL227384A (enExample) |
| MY (1) | MY163010A (enExample) |
| SG (1) | SG191909A1 (enExample) |
| TW (1) | TWI462981B (enExample) |
| WO (1) | WO2012096931A2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3323142B1 (en) * | 2015-07-13 | 2024-08-28 | CMC Materials LLC | Methods and compositions for processing dielectric substrate |
| EP3344716A4 (en) * | 2015-09-03 | 2019-04-10 | Cabot Microelectronics Corporation | METHODS AND COMPOSITIONS FOR TREATING DIELECTRIC SUBSTRATE |
| JP6901297B2 (ja) | 2017-03-22 | 2021-07-14 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6623355B2 (en) * | 2000-11-07 | 2003-09-23 | Micell Technologies, Inc. | Methods, apparatus and slurries for chemical mechanical planarization |
| US6866792B2 (en) * | 2001-12-12 | 2005-03-15 | Ekc Technology, Inc. | Compositions for chemical mechanical planarization of copper |
| GB2393447B (en) * | 2002-08-07 | 2006-04-19 | Kao Corp | Polishing composition |
| US7071105B2 (en) * | 2003-02-03 | 2006-07-04 | Cabot Microelectronics Corporation | Method of polishing a silicon-containing dielectric |
| TWI347969B (en) * | 2003-09-30 | 2011-09-01 | Fujimi Inc | Polishing composition |
| JP4667013B2 (ja) * | 2003-11-14 | 2011-04-06 | 昭和電工株式会社 | 研磨組成物および研磨方法 |
| US20060063687A1 (en) * | 2004-09-17 | 2006-03-23 | Minsek David W | Composition and process for ashless removal of post-etch photoresist and/or bottom anti-reflective material on a substrate |
| WO2007019342A2 (en) * | 2005-08-05 | 2007-02-15 | Advanced Technology Materials, Inc. | High throughput chemical mechanical polishing composition for metal film planarization |
| US20070037491A1 (en) * | 2005-08-12 | 2007-02-15 | Yuzhuo Li | Chemically modified chemical mechanical polishing pad, process of making a modified chemical mechanical polishing pad and method of chemical mechanical polishing |
| JP2008192930A (ja) * | 2007-02-06 | 2008-08-21 | Fujifilm Corp | 金属研磨用組成物及びそれを用いた化学的機械的研磨方法 |
| US7931714B2 (en) * | 2007-10-08 | 2011-04-26 | Uwiz Technology Co., Ltd. | Composition useful to chemical mechanical planarization of metal |
| JP5277640B2 (ja) * | 2007-10-17 | 2013-08-28 | 日立化成株式会社 | Ｃｍｐ用研磨液及び研磨方法 |
| US7955520B2 (en) * | 2007-11-27 | 2011-06-07 | Cabot Microelectronics Corporation | Copper-passivating CMP compositions and methods |
| US8337716B2 (en) * | 2008-01-23 | 2012-12-25 | Uwiz Technology Co., Ltd. | Sarcosine compound used as corrosion inhibitor |
| US8247327B2 (en) * | 2008-07-30 | 2012-08-21 | Cabot Microelectronics Corporation | Methods and compositions for polishing silicon-containing substrates |
| CN101747841A (zh) * | 2008-12-05 | 2010-06-23 | 安集微电子（上海）有限公司 | 一种化学机械抛光液 |
| TWI454561B (zh) * | 2008-12-30 | 2014-10-01 | Uwiz Technology Co Ltd | A polishing composition for planarizing the metal layer |
| CN101928520B (zh) * | 2009-06-19 | 2014-03-12 | 盟智科技股份有限公司 | 用于平坦化金属层的研磨组成物 |
| JP2012069785A (ja) * | 2010-09-24 | 2012-04-05 | Fujimi Inc | 研磨用組成物および研磨方法 |
-
2012
- 2012-01-10 KR KR1020137021062A patent/KR102077618B1/ko active Active
- 2012-01-10 KR KR1020187031790A patent/KR102017133B1/ko active Active
- 2012-01-10 EP EP12734493.5A patent/EP2663604B1/en active Active
- 2012-01-10 SG SG2013052816A patent/SG191909A1/en unknown
- 2012-01-10 CN CN201280005131.8A patent/CN103298903B/zh active Active
- 2012-01-10 MY MYPI2013002601A patent/MY163010A/en unknown
- 2012-01-10 WO PCT/US2012/020737 patent/WO2012096931A2/en not_active Ceased
- 2012-01-10 JP JP2013549488A patent/JP5992925B2/ja active Active
- 2012-01-11 TW TW101101131A patent/TWI462981B/zh active
-
2013
- 2013-07-08 IL IL227384A patent/IL227384A/en active IP Right Grant
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