JP2012199531A5 - - Google Patents
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- Publication number
- JP2012199531A5 JP2012199531A5 JP2012046432A JP2012046432A JP2012199531A5 JP 2012199531 A5 JP2012199531 A5 JP 2012199531A5 JP 2012046432 A JP2012046432 A JP 2012046432A JP 2012046432 A JP2012046432 A JP 2012046432A JP 2012199531 A5 JP2012199531 A5 JP 2012199531A5
- Authority
- JP
- Japan
- Prior art keywords
- chemical mechanical
- mechanical polishing
- weight
- polishing composition
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/039,705 US8440097B2 (en) | 2011-03-03 | 2011-03-03 | Stable, concentratable, water soluble cellulose free chemical mechanical polishing composition |
| US13/039,705 | 2011-03-03 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012199531A JP2012199531A (ja) | 2012-10-18 |
| JP2012199531A5 true JP2012199531A5 (enExample) | 2015-04-09 |
| JP6118501B2 JP6118501B2 (ja) | 2017-04-19 |
Family
ID=46671507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012046432A Active JP6118501B2 (ja) | 2011-03-03 | 2012-03-02 | 安定した濃縮可能な水溶性セルロースフリーのケミカルメカニカル研磨組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8440097B2 (enExample) |
| JP (1) | JP6118501B2 (enExample) |
| KR (1) | KR101829639B1 (enExample) |
| CN (1) | CN102690609B (enExample) |
| DE (1) | DE102012004219A1 (enExample) |
| FR (1) | FR2972195B1 (enExample) |
| TW (1) | TWI602909B (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8435896B2 (en) * | 2011-03-03 | 2013-05-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Stable, concentratable chemical mechanical polishing composition and methods relating thereto |
| US8545715B1 (en) * | 2012-10-09 | 2013-10-01 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition and method |
| US20140308814A1 (en) * | 2013-04-15 | 2014-10-16 | Applied Materials, Inc | Chemical mechanical polishing methods and systems including pre-treatment phase and pre-treatment compositions |
| US9984895B1 (en) * | 2017-01-31 | 2018-05-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method for tungsten |
| CN110431209B (zh) * | 2017-03-14 | 2022-06-28 | 福吉米株式会社 | 研磨用组合物、其制造方法以及使用其的研磨方法及基板的制造方法 |
| WO2018217628A1 (en) | 2017-05-25 | 2018-11-29 | Fujifilm Planar Solutions, LLC | Chemical mechanical polishing slurry for cobalt applications |
| KR102570805B1 (ko) * | 2019-11-01 | 2023-08-24 | 삼성에스디아이 주식회사 | 텅스텐 패턴 웨이퍼 연마용 cmp 슬러리 조성물 및 이를 이용한 텅스텐 패턴 웨이퍼 연마 방법 |
| TWI896724B (zh) * | 2020-09-29 | 2025-09-11 | 日商福吉米股份有限公司 | 研磨用組成物及其製造方法、研磨方法以及基板的製造方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG99289A1 (en) | 1998-10-23 | 2003-10-27 | Ibm | Chemical-mechanical planarization of metallurgy |
| US6375693B1 (en) | 1999-05-07 | 2002-04-23 | International Business Machines Corporation | Chemical-mechanical planarization of barriers or liners for copper metallurgy |
| JP3551238B2 (ja) * | 1999-09-07 | 2004-08-04 | 三菱住友シリコン株式会社 | シリコンウェーハの研磨液及びこれを用いた研磨方法 |
| EP1385915A1 (en) | 2001-04-12 | 2004-02-04 | Rodel Holdings, Inc. | Polishing composition having a surfactant |
| US6632259B2 (en) | 2001-05-18 | 2003-10-14 | Rodel Holdings, Inc. | Chemical mechanical polishing compositions and methods relating thereto |
| JP4641155B2 (ja) * | 2004-06-03 | 2011-03-02 | 株式会社日本触媒 | 化学機械研磨用の研磨剤 |
| US7384871B2 (en) | 2004-07-01 | 2008-06-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing compositions and methods relating thereto |
| US7303993B2 (en) | 2004-07-01 | 2007-12-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing compositions and methods relating thereto |
| US20060000808A1 (en) * | 2004-07-01 | 2006-01-05 | Fuji Photo Film Co., Ltd. | Polishing solution of metal and chemical mechanical polishing method |
| US7086935B2 (en) | 2004-11-24 | 2006-08-08 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Cellulose-containing polishing compositions and methods relating thereto |
| US7824568B2 (en) | 2006-08-17 | 2010-11-02 | International Business Machines Corporation | Solution for forming polishing slurry, polishing slurry and related methods |
| JP2008091411A (ja) * | 2006-09-29 | 2008-04-17 | Fujifilm Corp | 金属用研磨液 |
| US20090032765A1 (en) * | 2007-08-03 | 2009-02-05 | Jinru Bian | Selective barrier polishing slurry |
| TW200920828A (en) * | 2007-09-20 | 2009-05-16 | Fujifilm Corp | Polishing slurry for metal and chemical mechanical polishing method |
| US20090215266A1 (en) | 2008-02-22 | 2009-08-27 | Thomas Terence M | Polishing Copper-Containing patterned wafers |
| US9633865B2 (en) * | 2008-02-22 | 2017-04-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Low-stain polishing composition |
| JP4521058B2 (ja) * | 2008-03-24 | 2010-08-11 | 株式会社Adeka | 表面改質コロイダルシリカおよびこれを含有するｃｍｐ用研磨組成物 |
| US8540893B2 (en) | 2008-08-04 | 2013-09-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition and methods relating thereto |
-
2011
- 2011-03-03 US US13/039,705 patent/US8440097B2/en not_active Expired - Fee Related
-
2012
- 2012-03-01 DE DE102012004219A patent/DE102012004219A1/de not_active Withdrawn
- 2012-03-02 KR KR1020120021967A patent/KR101829639B1/ko not_active Expired - Fee Related
- 2012-03-02 TW TW101106930A patent/TWI602909B/zh not_active IP Right Cessation
- 2012-03-02 CN CN201210126827.8A patent/CN102690609B/zh not_active Expired - Fee Related
- 2012-03-02 JP JP2012046432A patent/JP6118501B2/ja active Active
- 2012-03-05 FR FR1251977A patent/FR2972195B1/fr not_active Expired - Fee Related
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