JP2014507515A5 - - Google Patents
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- Publication number
- JP2014507515A5 JP2014507515A5 JP2013547666A JP2013547666A JP2014507515A5 JP 2014507515 A5 JP2014507515 A5 JP 2014507515A5 JP 2013547666 A JP2013547666 A JP 2013547666A JP 2013547666 A JP2013547666 A JP 2013547666A JP 2014507515 A5 JP2014507515 A5 JP 2014507515A5
- Authority
- JP
- Japan
- Prior art keywords
- polymer layer
- substrate
- layer
- polymer
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920000642 polymer Polymers 0.000 claims 31
- 239000000758 substrate Substances 0.000 claims 13
- 238000000034 method Methods 0.000 claims 11
- 239000004065 semiconductor Substances 0.000 claims 5
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 239000011521 glass Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000003504 photosensitizing agent Substances 0.000 claims 1
- 229920000747 poly(lactic acid) Polymers 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- -1 tris (4- (4-acetylphenyl) phenyl) sulfonium tris (trifluoromethanesulfonyl) methide Chemical compound 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201061427859P | 2010-12-29 | 2010-12-29 | |
| US61/427,859 | 2010-12-29 | ||
| PCT/US2011/067761 WO2012092447A1 (en) | 2010-12-29 | 2011-12-29 | Polymer compositions for temporary bonding |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014507515A JP2014507515A (ja) | 2014-03-27 |
| JP2014507515A5 true JP2014507515A5 (enExample) | 2015-01-29 |
| JP5937104B2 JP5937104B2 (ja) | 2016-06-22 |
Family
ID=46381311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013547666A Expired - Fee Related JP5937104B2 (ja) | 2010-12-29 | 2011-12-29 | 仮接着のためのポリマー組成物 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US8633259B2 (enExample) |
| JP (1) | JP5937104B2 (enExample) |
| KR (1) | KR101455046B1 (enExample) |
| TW (1) | TWI558783B (enExample) |
| WO (1) | WO2012092447A1 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5937104B2 (ja) | 2010-12-29 | 2016-06-22 | プロメラス， エルエルシー | 仮接着のためのポリマー組成物 |
| JP6031264B2 (ja) * | 2012-06-13 | 2016-11-24 | 富士フイルム株式会社 | 半導体装置製造用仮接着剤、並びに、それを用いた接着性支持体、及び、半導体装置の製造方法 |
| DE102013100563A1 (de) * | 2013-01-21 | 2014-07-24 | Ev Group E. Thallner Gmbh | Aufnahmeeinrichtung zur Handhabung strukturierter Substrate |
| US10000675B2 (en) * | 2013-03-03 | 2018-06-19 | John Cleaon Moore | Temporary adhesive with tunable adhesion force sufficient for processing thin solid materials |
| CN106010383B (zh) * | 2015-03-31 | 2019-08-02 | 住友化学株式会社 | 光学层叠体及液晶显示装置 |
| CN104804682B (zh) * | 2015-04-16 | 2017-05-24 | 深圳市化讯半导体材料有限公司 | 晶圆减薄的临时键合胶、其制备方法、键合及解键合方法 |
| WO2018022952A1 (en) * | 2016-07-28 | 2018-02-01 | Promerus, Llc | Nadic anhydride polymers and photosensitive compositions derived therefrom |
| JP7066507B2 (ja) * | 2018-05-02 | 2022-05-13 | アイカ工業株式会社 | 光硬化性粘着樹脂組成物およびそれを用いた粘着テープ |
| WO2019232008A1 (en) * | 2018-05-31 | 2019-12-05 | Corning Incorporated | Device surface renewal and rework by bundled laminate structures |
| US20200075384A1 (en) * | 2018-08-31 | 2020-03-05 | Micron Technology, Inc. | Carrier Bond and Debond Using Self-Depolymerizing Polymer |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004523598A (ja) * | 2000-08-10 | 2004-08-05 | ザ プロクター アンド ギャンブル カンパニー | 湿気透過性構造のための改善された接着特性を有する熱可塑性親水性ポリマー組成物 |
| US8030425B2 (en) * | 2002-07-03 | 2011-10-04 | Promerus Llc | Photosensitive compositions based on polycyclic polymers for low stress, high temperature films |
| CN101831163B (zh) * | 2002-11-01 | 2013-07-10 | 佐治亚技术研究公司 | 牺牲组合物、其应用以及分解方法 |
| JP4474854B2 (ja) * | 2003-07-02 | 2010-06-09 | Ｊｓｒ株式会社 | 感放射線性接着剤組成物およびこれを用いたウェハーの加工方法 |
| JP5068674B2 (ja) | 2005-03-01 | 2012-11-07 | ダウ・コーニング・コーポレイション | 半導体加工のための一時的なウェハ結合法 |
| US8120168B2 (en) * | 2006-03-21 | 2012-02-21 | Promerus Llc | Methods and materials useful for chip stacking, chip and wafer bonding |
| US7932161B2 (en) * | 2006-03-21 | 2011-04-26 | Promerus Llc | Methods and materials useful for chip stacking, chip and wafer bonding |
| US20080200011A1 (en) | 2006-10-06 | 2008-08-21 | Pillalamarri Sunil K | High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach |
| US7713835B2 (en) | 2006-10-06 | 2010-05-11 | Brewer Science Inc. | Thermally decomposable spin-on bonding compositions for temporary wafer bonding |
| CN101779268B (zh) | 2007-06-25 | 2013-11-06 | 布鲁尔科技公司 | 高温旋涂暂时性粘合组合物 |
| WO2009099954A1 (en) | 2008-02-04 | 2009-08-13 | Fujifilm Electronic Materials U.S.A., Inc. | Novel positive photosensitive resin compositions |
| TWI479259B (zh) * | 2009-06-15 | 2015-04-01 | Sumitomo Bakelite Co | A temporary fixing agent for a semiconductor wafer, and a method of manufacturing the semiconductor device using the same |
| JP5937104B2 (ja) | 2010-12-29 | 2016-06-22 | プロメラス， エルエルシー | 仮接着のためのポリマー組成物 |
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2011
- 2011-12-29 JP JP2013547666A patent/JP5937104B2/ja not_active Expired - Fee Related
- 2011-12-29 WO PCT/US2011/067761 patent/WO2012092447A1/en not_active Ceased
- 2011-12-29 US US13/339,784 patent/US8633259B2/en not_active Expired - Fee Related
- 2011-12-29 TW TW100149543A patent/TWI558783B/zh not_active IP Right Cessation
- 2011-12-29 KR KR1020137016286A patent/KR101455046B1/ko not_active Expired - Fee Related
-
2013
- 2013-12-13 US US14/105,324 patent/US9051452B2/en not_active Expired - Fee Related