KR101455046B1 - 일시적 접착용 폴리머 조성물 - Google Patents

일시적 접착용 폴리머 조성물 Download PDF

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Publication number
KR101455046B1
KR101455046B1 KR1020137016286A KR20137016286A KR101455046B1 KR 101455046 B1 KR101455046 B1 KR 101455046B1 KR 1020137016286 A KR1020137016286 A KR 1020137016286A KR 20137016286 A KR20137016286 A KR 20137016286A KR 101455046 B1 KR101455046 B1 KR 101455046B1
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South Korea
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polymer
substrate
polymer layer
layer
wafer
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Expired - Fee Related
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KR1020137016286A
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English (en)
Korean (ko)
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KR20130119949A (ko
Inventor
래리 에프. 로데스
레아 제이. 랭스도르프
벤캐트 램 두끼패티
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스미토모 베이클라이트 가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1535—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/548—Silicon-containing compounds containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020137016286A 2010-12-29 2011-12-29 일시적 접착용 폴리머 조성물 Expired - Fee Related KR101455046B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201061427859P 2010-12-29 2010-12-29
US61/427,859 2010-12-29
PCT/US2011/067761 WO2012092447A1 (en) 2010-12-29 2011-12-29 Polymer compositions for temporary bonding

Publications (2)

Publication Number Publication Date
KR20130119949A KR20130119949A (ko) 2013-11-01
KR101455046B1 true KR101455046B1 (ko) 2014-10-28

Family

ID=46381311

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137016286A Expired - Fee Related KR101455046B1 (ko) 2010-12-29 2011-12-29 일시적 접착용 폴리머 조성물

Country Status (5)

Country Link
US (2) US8633259B2 (enExample)
JP (1) JP5937104B2 (enExample)
KR (1) KR101455046B1 (enExample)
TW (1) TWI558783B (enExample)
WO (1) WO2012092447A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101455046B1 (ko) 2010-12-29 2014-10-28 스미토모 베이클라이트 가부시키가이샤 일시적 접착용 폴리머 조성물
JP6031264B2 (ja) * 2012-06-13 2016-11-24 富士フイルム株式会社 半導体装置製造用仮接着剤、並びに、それを用いた接着性支持体、及び、半導体装置の製造方法
DE102013100563A1 (de) * 2013-01-21 2014-07-24 Ev Group E. Thallner Gmbh Aufnahmeeinrichtung zur Handhabung strukturierter Substrate
WO2014137801A1 (en) * 2013-03-03 2014-09-12 John Moore Temporary adhesive with tunable adhesion force sufficient for processing thin solid materials
TWI741978B (zh) * 2015-03-31 2021-10-11 日商住友化學股份有限公司 光學積層體及液晶顯示裝置
CN104804682B (zh) * 2015-04-16 2017-05-24 深圳市化讯半导体材料有限公司 晶圆减薄的临时键合胶、其制备方法、键合及解键合方法
US10591818B2 (en) * 2016-07-28 2020-03-17 Promerus, Llc Nadic anhydride polymers and photosensitive compositions derived therefrom
JP7066507B2 (ja) * 2018-05-02 2022-05-13 アイカ工業株式会社 光硬化性粘着樹脂組成物およびそれを用いた粘着テープ
WO2019232008A1 (en) * 2018-05-31 2019-12-05 Corning Incorporated Device surface renewal and rework by bundled laminate structures
US20200075384A1 (en) * 2018-08-31 2020-03-05 Micron Technology, Inc. Carrier Bond and Debond Using Self-Depolymerizing Polymer

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080173970A1 (en) 2006-10-06 2008-07-24 Pillalamarri Sunil K Thermally decomposable spin-on bonding compositions for temporary wafer bonding
US20080200011A1 (en) 2006-10-06 2008-08-21 Pillalamarri Sunil K High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach
US20090197067A1 (en) 2008-02-04 2009-08-06 Fujifilm Electronic Materials U.S.A., Inc. Novel Positive Photosensitive Resin Compositions

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004523598A (ja) * 2000-08-10 2004-08-05 ザ プロクター アンド ギャンブル カンパニー 湿気透過性構造のための改善された接着特性を有する熱可塑性親水性ポリマー組成物
US8030425B2 (en) * 2002-07-03 2011-10-04 Promerus Llc Photosensitive compositions based on polycyclic polymers for low stress, high temperature films
EP1567580A4 (en) * 2002-11-01 2008-04-30 Georgia Tech Res Inst OCCUPANCY COMPOSITIONS, METHOD FOR THEIR USE AND METHOD FOR THE DISASSEMBLY OF THE SAME
JP4474854B2 (ja) * 2003-07-02 2010-06-09 Ｊｓｒ株式会社 感放射線性接着剤組成物およびこれを用いたウェハーの加工方法
US7541264B2 (en) 2005-03-01 2009-06-02 Dow Corning Corporation Temporary wafer bonding method for semiconductor processing
US8120168B2 (en) * 2006-03-21 2012-02-21 Promerus Llc Methods and materials useful for chip stacking, chip and wafer bonding
EP1997138B1 (en) * 2006-03-21 2011-09-14 Promerus LLC Methods and materials useful for chip stacking, chip and wafer bonding
JP5788173B2 (ja) 2007-06-25 2015-09-30 ブルーワー サイエンス アイ エヌシー． 高温スピンオン仮接合用組成物
TWI479259B (zh) * 2009-06-15 2015-04-01 Sumitomo Bakelite Co A temporary fixing agent for a semiconductor wafer, and a method of manufacturing the semiconductor device using the same
KR101455046B1 (ko) 2010-12-29 2014-10-28 스미토모 베이클라이트 가부시키가이샤 일시적 접착용 폴리머 조성물

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080173970A1 (en) 2006-10-06 2008-07-24 Pillalamarri Sunil K Thermally decomposable spin-on bonding compositions for temporary wafer bonding
US20080200011A1 (en) 2006-10-06 2008-08-21 Pillalamarri Sunil K High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach
US20090197067A1 (en) 2008-02-04 2009-08-06 Fujifilm Electronic Materials U.S.A., Inc. Novel Positive Photosensitive Resin Compositions

Also Published As

Publication number Publication date
US8633259B2 (en) 2014-01-21
JP2014507515A (ja) 2014-03-27
US9051452B2 (en) 2015-06-09
US20120172479A1 (en) 2012-07-05
TW201231591A (en) 2012-08-01
JP5937104B2 (ja) 2016-06-22
WO2012092447A1 (en) 2012-07-05
US20140102631A1 (en) 2014-04-17
TWI558783B (zh) 2016-11-21
KR20130119949A (ko) 2013-11-01

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