JP2014225587A - 基板へのテープ貼り付け装置及び方法 - Google Patents

基板へのテープ貼り付け装置及び方法 Download PDF

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JP2014225587A
JP2014225587A JP2013104624A JP2013104624A JP2014225587A JP 2014225587 A JP2014225587 A JP 2014225587A JP 2013104624 A JP2013104624 A JP 2013104624A JP 2013104624 A JP2013104624 A JP 2013104624A JP 2014225587 A JP2014225587 A JP 2014225587A
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JP2014225587A5 (enExample
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洋司 大北
Yoji Okita
洋司 大北
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Takatori Corp
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Takatori Corp
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JP2013104624A 2013-05-17 2013-05-17 基板へのテープ貼り付け装置及び方法 Pending JP2014225587A (ja)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020096201A (ja) * 2020-03-17 2020-06-18 リンテック株式会社 シート貼付装置および貼付方法
CN112086386A (zh) * 2020-10-21 2020-12-15 开异智能技术(上海)有限公司 晶圆全自动贴膜机
JP2025002597A (ja) * 2023-06-23 2025-01-09 プライムプラネットエナジー＆ソリューションズ株式会社 蓄電デバイスの製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0251248A (ja) * 1988-08-15 1990-02-21 Nitto Denko Corp 半導体ウエハの自動貼付け装置
JPH03127849A (ja) * 1989-10-13 1991-05-30 Nitto Denko Corp ウエハの移送装置
JP2010034568A (ja) * 2009-09-16 2010-02-12 Lintec Corp 移載装置及び移載方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0251248A (ja) * 1988-08-15 1990-02-21 Nitto Denko Corp 半導体ウエハの自動貼付け装置
JPH03127849A (ja) * 1989-10-13 1991-05-30 Nitto Denko Corp ウエハの移送装置
JP2010034568A (ja) * 2009-09-16 2010-02-12 Lintec Corp 移載装置及び移載方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020096201A (ja) * 2020-03-17 2020-06-18 リンテック株式会社 シート貼付装置および貼付方法
CN112086386A (zh) * 2020-10-21 2020-12-15 开异智能技术(上海)有限公司 晶圆全自动贴膜机
JP2025002597A (ja) * 2023-06-23 2025-01-09 プライムプラネットエナジー＆ソリューションズ株式会社 蓄電デバイスの製造方法

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