JP2014197631A5 - - Google Patents

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Publication number
JP2014197631A5
JP2014197631A5 JP2013072981A JP2013072981A JP2014197631A5 JP 2014197631 A5 JP2014197631 A5 JP 2014197631A5 JP 2013072981 A JP2013072981 A JP 2013072981A JP 2013072981 A JP2013072981 A JP 2013072981A JP 2014197631 A5 JP2014197631 A5 JP 2014197631A5
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JP
Japan
Prior art keywords
substrate
preheat
output
operation output
flux
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Application number
JP2013072981A
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English (en)
Japanese (ja)
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JP6209842B2 (ja
JP2014197631A (ja
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Priority to JP2013072981A priority Critical patent/JP6209842B2/ja
Priority claimed from JP2013072981A external-priority patent/JP6209842B2/ja
Priority to CN201410123722.6A priority patent/CN104070254B/zh
Publication of JP2014197631A publication Critical patent/JP2014197631A/ja
Publication of JP2014197631A5 publication Critical patent/JP2014197631A5/ja
Application granted granted Critical
Publication of JP6209842B2 publication Critical patent/JP6209842B2/ja
Expired - Fee Related legal-status Critical Current
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JP2013072981A 2013-03-29 2013-03-29 基板加熱装置及びはんだ付装置 Expired - Fee Related JP6209842B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013072981A JP6209842B2 (ja) 2013-03-29 2013-03-29 基板加熱装置及びはんだ付装置
CN201410123722.6A CN104070254B (zh) 2013-03-29 2014-03-28 基板加热装置和软钎焊装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013072981A JP6209842B2 (ja) 2013-03-29 2013-03-29 基板加熱装置及びはんだ付装置

Publications (3)

Publication Number Publication Date
JP2014197631A JP2014197631A (ja) 2014-10-16
JP2014197631A5 true JP2014197631A5 (zh) 2016-03-24
JP6209842B2 JP6209842B2 (ja) 2017-10-11

Family

ID=51592083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013072981A Expired - Fee Related JP6209842B2 (ja) 2013-03-29 2013-03-29 基板加熱装置及びはんだ付装置

Country Status (2)

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JP (1) JP6209842B2 (zh)
CN (1) CN104070254B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10688578B2 (en) 2014-08-04 2020-06-23 OK International, Inc Variable temperature controlled soldering iron
US10716220B2 (en) 2014-08-04 2020-07-14 Ok International, Inc. Variable temperature controlled soldering iron
CN107283016A (zh) * 2016-04-11 2017-10-24 Ok国际公司 可变温度受控烙铁
CN111725100B (zh) * 2020-06-16 2023-02-10 北京北方华创微电子装备有限公司 预热装置及预热方法
JP7422884B2 (ja) 2020-08-17 2024-01-26 三菱電機株式会社 はんだ付けシステム、およびはんだ付け方法
US20240082941A1 (en) * 2021-07-20 2024-03-14 Shinkawa Ltd. Flux transfer apparatus

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS595494Y2 (ja) * 1979-10-04 1984-02-18 権士 近藤 プリント基板予備加熱装置
JPS5994572A (ja) * 1982-11-22 1984-05-31 Nec Corp 半田リフロ−装置
JP2501334B2 (ja) * 1987-06-19 1996-05-29 松下電工株式会社 リフロ−炉
JPH0296394A (ja) * 1988-09-30 1990-04-09 Matsushita Electric Ind Co Ltd はんだ付けリフロー方法
DE4016366C2 (de) * 1990-05-21 1994-04-28 Siemens Nixdorf Inf Syst Verfahren und Einrichtung zum Reflow-Löten von Elektronik-Bauteilen auf eine Leiterplatte
JP3095433B2 (ja) * 1991-03-12 2000-10-03 松下電器産業株式会社 リフロー半田付装置およびリフロー半田付方法
JP3002015B2 (ja) * 1991-06-18 2000-01-24 松下電器産業株式会社 リフロー装置の温度制御方法
JP3192221B2 (ja) * 1992-07-01 2001-07-23 松下電工株式会社 リフロー炉
CN102566625A (zh) * 2010-12-09 2012-07-11 西安中科麦特电子技术设备有限公司 一种回流焊机温度控制系统

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