JP2014168054A - 圧電材料、圧電素子、および電子機器 - Google Patents
圧電材料、圧電素子、および電子機器 Download PDFInfo
- Publication number
- JP2014168054A JP2014168054A JP2014013645A JP2014013645A JP2014168054A JP 2014168054 A JP2014168054 A JP 2014168054A JP 2014013645 A JP2014013645 A JP 2014013645A JP 2014013645 A JP2014013645 A JP 2014013645A JP 2014168054 A JP2014168054 A JP 2014168054A
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric element
- piezoelectric
- piezoelectric material
- electrode
- laminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims abstract description 150
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 26
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 26
- 239000007788 liquid Substances 0.000 claims description 74
- 239000000428 dust Substances 0.000 claims description 49
- 230000003287 optical effect Effects 0.000 claims description 39
- 238000003384 imaging method Methods 0.000 claims description 35
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 238000012546 transfer Methods 0.000 claims description 5
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 230000007774 longterm Effects 0.000 abstract description 9
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 abstract description 4
- 239000011591 potassium Substances 0.000 abstract description 4
- 229910052700 potassium Inorganic materials 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 32
- 239000000843 powder Substances 0.000 description 30
- 239000000203 mixture Substances 0.000 description 26
- 239000010949 copper Substances 0.000 description 24
- 239000002245 particle Substances 0.000 description 22
- 238000005245 sintering Methods 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 19
- 239000010955 niobium Substances 0.000 description 19
- 239000012071 phase Substances 0.000 description 19
- 239000011734 sodium Substances 0.000 description 19
- UYLYBEXRJGPQSH-UHFFFAOYSA-N sodium;oxido(dioxo)niobium Chemical compound [Na+].[O-][Nb](=O)=O UYLYBEXRJGPQSH-UHFFFAOYSA-N 0.000 description 19
- 239000002994 raw material Substances 0.000 description 15
- 239000013078 crystal Substances 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 13
- 230000010287 polarization Effects 0.000 description 12
- 239000002184 metal Substances 0.000 description 11
- DQBAOWPVHRWLJC-UHFFFAOYSA-N barium(2+);dioxido(oxo)zirconium Chemical compound [Ba+2].[O-][Zr]([O-])=O DQBAOWPVHRWLJC-UHFFFAOYSA-N 0.000 description 10
- 229910052788 barium Inorganic materials 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 9
- 238000010304 firing Methods 0.000 description 9
- 229910052758 niobium Inorganic materials 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 7
- 229910002113 barium titanate Inorganic materials 0.000 description 7
- 239000011230 binding agent Substances 0.000 description 7
- 238000004544 sputter deposition Methods 0.000 description 7
- 238000002441 X-ray diffraction Methods 0.000 description 6
- 230000005684 electric field Effects 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 229910052726 zirconium Inorganic materials 0.000 description 6
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical group [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 5
- 230000011514 reflex Effects 0.000 description 5
- 229910052708 sodium Inorganic materials 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 229910021523 barium zirconate Inorganic materials 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 238000009616 inductively coupled plasma Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000011812 mixed powder Substances 0.000 description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000000224 chemical solution deposition Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000007772 electrode material Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229910052712 strontium Inorganic materials 0.000 description 3
- 238000010897 surface acoustic wave method Methods 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000001513 hot isostatic pressing Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 230000015654 memory Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 238000007088 Archimedes method Methods 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000004430 X-ray Raman scattering Methods 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 238000003916 acid precipitation Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000037237 body shape Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000009694 cold isostatic pressing Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000002003 electron diffraction Methods 0.000 description 1
- 238000004993 emission spectroscopy Methods 0.000 description 1
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 238000001027 hydrothermal synthesis Methods 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 239000000543 intermediate Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000000462 isostatic pressing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 238000009768 microwave sintering Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000001694 spray drying Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 238000012916 structural analysis Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000003826 uniaxial pressing Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000012856 weighed raw material Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/495—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/62605—Treating the starting powders individually or as mixtures
- C04B35/62645—Thermal treatment of powders or mixtures thereof other than sintering
- C04B35/62675—Thermal treatment of powders or mixtures thereof other than sintering characterised by the treatment temperature
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/0006—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means to keep optical surfaces clean, e.g. by preventing or removing dirt, stains, contamination, condensation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
- G02B7/09—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/0005—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing non-specific motion; Details common to machines covered by H02N2/02 - H02N2/16
- H02N2/001—Driving devices, e.g. vibrators
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/10—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing rotary motion, e.g. rotary motors
- H02N2/106—Langevin motors
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/10—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing rotary motion, e.g. rotary motors
- H02N2/16—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing rotary motion, e.g. rotary motors using travelling waves, i.e. Rayleigh surface waves
- H02N2/163—Motors with ring stator
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/80—Camera processing pipelines; Components thereof
- H04N23/81—Camera processing pipelines; Components thereof for suppressing or minimising disturbance in the image signal generation
- H04N23/811—Camera processing pipelines; Components thereof for suppressing or minimising disturbance in the image signal generation by dust removal, e.g. from surfaces of the image sensor or processing of the image signal output by the electronic image sensor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/093—Forming inorganic materials
- H10N30/097—Forming inorganic materials by sintering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8542—Alkali metal based oxides, e.g. lithium, sodium or potassium niobates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/03—Specific materials used
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3201—Alkali metal oxides or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
- C04B2235/3215—Barium oxides or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3232—Titanium oxides or titanates, e.g. rutile or anatase
- C04B2235/3234—Titanates, not containing zirconia
- C04B2235/3236—Alkaline earth titanates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3244—Zirconium oxides, zirconates, hafnium oxides, hafnates, or oxide-forming salts thereof
- C04B2235/3248—Zirconates or hafnates, e.g. zircon
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3251—Niobium oxides, niobates, tantalum oxides, tantalates, or oxide-forming salts thereof
- C04B2235/3255—Niobates or tantalates, e.g. silver niobate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3281—Copper oxides, cuprates or oxide-forming salts thereof, e.g. CuO or Cu2O
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/74—Physical characteristics
- C04B2235/76—Crystal structural characteristics, e.g. symmetry
- C04B2235/768—Perovskite structure ABO3
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/74—Physical characteristics
- C04B2235/77—Density
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/74—Physical characteristics
- C04B2235/78—Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures
- C04B2235/785—Submicron sized grains, i.e. from 0,1 to 1 micron
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/74—Physical characteristics
- C04B2235/78—Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures
- C04B2235/786—Micrometer sized grains, i.e. from 1 to 100 micron
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/345—Refractory metal oxides
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
- C04B2237/704—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the ceramic layers or articles
Abstract
【解決手段】一般式(1):NaxBa1−yNbyZr1−yO3(式中、xは0.85≦x≦0.96、yは0.90≦y≦0.96を示す。)で表わされるペロブスカイト型金属酸化物を含有する圧電材料2およびそれを用いた圧電素子であり、圧電材料2は、ペロブスカイト型金属酸化物と、Cuを含有し、Cuの含有量がペロブスカイト型金属酸化物1molに対して2.00mol%以下であることが好ましい。
【選択図】図1
Description
NaxBa1−yNbyZr1−yO3 (1)
(式中、xは0.85≦x≦0.96、yは0.90≦y≦0.96を示す。)
で表わされるペロブスカイト型金属酸化物を含有することを特徴とする。
NaxBa1−yNbyZr1−yO3 (1)
(式中、xは0.85≦x≦0.96、yは0.90≦y≦0.96を示す。)
で表わされるペロブスカイト型金属酸化物を含有することを特徴とする。
以下に本発明の圧電材料を用いた圧電素子について説明する。
次に、本発明の圧電材料を用いた積層圧電素子について説明する。
本発明に係る液体吐出ヘッドは、前記圧電素子または前記積層圧電素子を配した振動部を備えた液室と、前記液室と連通する吐出口を少なくとも有することを特徴とする。本発明の液体吐出ヘッドによって吐出する液体は流動体であれば特に限定されず、水、インク、燃料などの水系液体や非水系液体を吐出することができる。
次に、本発明の液体吐出装置について説明する。本発明の液体吐出装置は、被転写体の載置部と前記液体吐出ヘッドを備えたものである。
本発明に係る超音波モータは、前記圧電素子または前記積層圧電素子を配した振動体と、前記振動体と接触する移動体とを少なくとも有することを特徴とする。
次に、本発明の光学機器について説明する。本発明の光学機器は、駆動部に前記超音波モータを備えたことを特徴とする。
粒子、粉体、液滴の搬送、除去等で利用される振動装置は、電子機器等で広く使用されている。
次に、本発明の撮像装置について説明する。
次に、本発明の電子機器について説明する。本発明の電子機器は、前記圧電素子または前記積層圧電素子を備えた圧電音響部品を配したことを特徴とする。圧電音響部品にはスピーカ、ブザー、マイク、表面弾性波(SAW)素子が含まれる。
ニオブ酸ナトリウム主成分とチタン酸バリウムの固溶体(NN−BT)よりなる比較用の金属酸化物材料を作製した。原料には、ニオブ酸ナトリウム(NaNbO3)、チタン酸バリウム(BaTiO3)の粉末を用いた。ニオブ酸ナトリウム粉末純度99%以上のニオブ酸ナトリウム(NaNbO3)、チタン酸バリウム粉末は純度99%以上のチタン酸バリウム(BaTiO3)を用いた。
目的組成NaxBa1−yNbyZr1−yO3(x‘=y=0.96(実施例1)、0.95(実施例2)、0.92(実施例3)、0.90(実施例4))になるようにニオブ酸ナトリウム(NaNbO3)、ジルコン酸バリウム(BaZrO3)の粉末を秤量して混合した。
目的組成NaxBa1−yNbyZr1−yO3(x‘=y=0.96(実施例5)、0.95(実施例6)、0.93(実施例7)、0.90(実施例8))になるようにニオブ酸ナトリウム(NaNbO3)、ジルコン酸バリウム(BaZrO3)の粉末と、目的組成NaxBa1−yNbyZr1−yO3のペロブスカイト型金属酸化物1molに対して0.4mol%のCu成分を秤量して混合した。なお、実施例5から8のCu含有量の0.4mol%は、一般式(1)のぺロブスカイト型金属酸化物1mol(168g)に対してCuOを0.318g(Cuとして0.254g)含むことを表す。
実施例5から8と同様の方法で比較用の金属酸化物材料を作製した。ただしx=y=1.00(比較例2)、0.97(比較例3)になるように原料の粉末を秤量して混合した。焼結体は、成形体を1200℃から1300℃、空気中で1から6時間焼成することにより得た。得られた焼結体の表面を光学顕微鏡で観察し粒径を評価した所、粒径は、0.5μmから500μmであった。得られた焼結体の分極−電界ヒステリシスループを測定すると、比較例2および3の焼結体は反強誘電体であることが分かった。比較例2および3の焼結体に対して分極処理を行っても圧電性を得ることができず、機械的品質係数の値も得られなかった。なお、分極−電界ヒステリシスループの測定条件は、交流電界(三角波)の周波数を10から100Hz、印加電界の最大強度は±50kV/cmとした。
実施例5から8と同様の方法で比較用の金属酸化物材料を作製した。ただしx=y=0.88になるように原料の粉末を秤量して混合した。焼結体は、成形体を1200℃から1300℃、空気中で1から6時間焼成することにより得た。得られた焼結体の表面を光学顕微鏡で観察し粒径を評価した所、粒径は、0.1μmから20μmであった。得られた焼結体のキュリー温度を測定すると60℃と低く実用に適していなかった。
実施例1から8の圧電材料の表面を研磨し、該表面の有機物成分を除去するために400から1000℃で空気中1時間熱処理をした。その表面および裏面にDCスパッタリング法で金電極を形成して本発明の圧電素子とした。この圧電素子を10mm×2.5mm×0.5mmの短冊状に加工して、各種特性の評価を行った。
実施例2と同様に原料の粉末を湿式混合して脱水乾燥し、900℃から1000℃で仮焼して仮焼物を得た。この原料に有機バインダーを加えて混合した後、ドクターブレード法によりシート形成して厚み50μmのグリーンシートを得た。
ニオブ酸ナトリウム、ジルコン酸バリウム粉末を、Na、Nb、Ba、Zrが表2の実施例2記載の組成になるよう秤量した。秤量した原料粉末をボールミルで12時間混合し、900℃から1000℃で仮焼して仮焼物を得た。この仮焼粉に対して、3重量部となるPVBバインダーを加えて混合した。この混合粉を用いて、ドクターブレード法によりシート形成して厚み50μmのグリーンシートを得た。
実施例2の圧電素子を用いて、図3に示される液体吐出ヘッドを作製した。入力した電気信号に追随したインクの吐出が確認された。
実施例11の液体吐出ヘッドを用いて、図4に示される液体吐出装置を作製した。入力した電気信号に追随したインクの吐出が記録媒体上に確認された。
実施例2の圧電素子を用いて、図6(a)に示される超音波モータを作製した。交流電圧の印加に応じたモータの回転が確認された。
実施例13の超音波モータを用いて、図7に示される光学機器を作製した。交流電圧の印加に応じたオートフォーカス動作が確認された。
実施例2の圧電素子を用いて、図9に示される塵埃除去装置を作製した。プラスチック製ビーズを散布し、交流電圧を印加したところ、良好な塵埃除去率が確認された。
実施例15の塵埃除去装置を用いて、図12に示される撮像装置を作製した。動作させたところ、撮像ユニットの表面の塵を良好に除去し、塵欠陥の無い画像が得られた。
実施例9の積層圧電素子を用いて、図3に示される液体吐出ヘッドを作製した。入力した電気信号に追随したインクの吐出が確認された。
実施例17の液体吐出ヘッドを用いて、図4に示される液体吐出装置を作製した。入力した電気信号に追随したインクの吐出が記録媒体上に確認された。
実施例9の積層圧電素子を用いて、図6(a)に示される超音波モータを作製した。交番電圧の印加に応じたモータの回転が確認された。
実施例19の超音波モータを用いて、図7に示される光学機器を作製した。交番電圧の印加に応じたオートフォーカス動作が確認された。
実施例9の積層圧電素子を用いて、図9に示される塵埃除去装置を作製した。プラスチック製ビーズを散布し、交番電圧を印加したところ、良好な塵埃除去率が確認された。
実施例21の塵埃除去装置を用いて、図12に示される撮像装置を作製した。動作させたところ、撮像ユニットの表面の塵を良好に除去し、塵欠陥の無い画像が得られた。
実施例9の積層圧電素子を用いて、図14に示される電子機器を作製した。交番電圧の印加に応じたスピーカ動作が確認された。
2 圧電材料
3 第二の電極
101 圧電素子
102 個別液室
103 振動板
104 液室隔壁
105 吐出口
106 連通孔
107 共通液室
108 バッファ層
1011 第一の電極
1012 圧電材料
1013 第二の電極
201 振動子
2012 圧電素子
2042 積層圧電素子
310 塵埃除去装置
330 圧電素子
320 振動板
332 第1の電極
333 第2の電極
336 第1の電極面
337 第2の電極面
51 第一の電極
53 第二の電極
54 圧電材料層
55 内部電極
56 積層体
501 第一の電極
503 第二の電極
504 圧電材料層
505a 内部電極
505b 内部電極
506a 外部電極
506b 外部電極
601 カメラ本体
701 前群レンズ
881 液体吐出装置
901 光学装置
Claims (16)
- 下記一般式(1)
NaxBa1−yNbyZr1−yO3 (1)
(式中、xは0.85≦x≦0.96、yは0.90≦y≦0.96を示す。)
で表わされるペロブスカイト型金属酸化物を含有することを特徴とする圧電材料。 - 前記圧電材料は、前記ペロブスカイト型金属酸化物と、Cuを含有し、前記Cuの含有量が前記ペロブスカイト型金属酸化物1molに対して2.00mol%以下であることを特徴とする請求項1に記載の圧電材料。
- 前記一般式(1)において、x<yであることを特徴とする請求項1または2に記載の圧電材料。
- 前記圧電材料のキュリー温度が140℃以上であることを特徴とする請求項1乃至3のいずれかの項に記載の圧電材料。
- 第一の電極、圧電材料部および第二の電極を少なくとも有する圧電素子であって、前記圧電材料部を構成する圧電材料が請求項1乃至4のいずれかに記載の圧電材料であることを特徴とする圧電素子。
- 複数の圧電材料層と、内部電極を含む複数の電極層とが交互に積層された積層圧電素子であって、前記圧電材料層が請求項1乃至4のいずれかに記載の圧電材料よりなることを特徴とする積層圧電素子。
- 前記内部電極がAgとPdを含み、前記Agの含有重量M1と前記Pdの含有重量M2との重量比M1/M2が1.5≦M1/M2≦9.0であることを特徴とする請求項6に記載の積層圧電素子。
- 前記内部電極がNiおよびCuの少なくともいずれか1種を含むことを特徴とする請求項6に記載の積層圧電素子。
- 請求項5に記載の圧電素子または請求項6乃至8のいずれかに記載の積層圧電素子を配した振動部を備えた液室と、前記液室と連通する吐出口を少なくとも有することを特徴とする液体吐出ヘッド。
- 被転写体の載置部と請求項9に記載の液体吐出ヘッドを備えたことを特徴とする液体吐出装置。
- 請求項5に記載の圧電素子または請求項6乃至8のいずれかに記載の積層圧電素子を配した振動体と、前記振動体と接触する移動体とを少なくとも有することを特徴とする超音波モータ。
- 駆動部に請求項11に記載の超音波モータを備えたことを特徴とする光学機器。
- 請求項5に記載の圧電素子または請求項6乃至8のいずれかに記載の積層圧電素子を振動板に配した振動体を有することを特徴とする振動装置。
- 請求項13に記載の振動装置を振動部に備えたことを特徴とする塵埃除去装置。
- 請求項14に記載の塵埃除去装置と撮像素子ユニットとを少なくとも有する撮像装置であって、前記塵埃除去装置の振動板を前記撮像素子ユニットの受光面側に設けたことを特徴とする撮像装置。
- 請求項5に記載の圧電素子または請求項6乃至8のいずれかに記載の積層圧電素子を備えた圧電音響部品を配したことを特徴とする電子機器。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014013645A JP6366283B2 (ja) | 2013-01-29 | 2014-01-28 | 圧電材料、圧電素子、および電子機器 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013014615 | 2013-01-29 | ||
JP2013014615 | 2013-01-29 | ||
JP2014013645A JP6366283B2 (ja) | 2013-01-29 | 2014-01-28 | 圧電材料、圧電素子、および電子機器 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014168054A true JP2014168054A (ja) | 2014-09-11 |
JP2014168054A5 JP2014168054A5 (ja) | 2017-03-02 |
JP6366283B2 JP6366283B2 (ja) | 2018-08-01 |
Family
ID=50150746
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014013645A Active JP6366283B2 (ja) | 2013-01-29 | 2014-01-28 | 圧電材料、圧電素子、および電子機器 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10308557B2 (ja) |
EP (1) | EP2946419B1 (ja) |
JP (1) | JP6366283B2 (ja) |
KR (1) | KR20150115845A (ja) |
TW (1) | TWI518050B (ja) |
WO (1) | WO2014119705A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015012344A1 (ja) * | 2013-07-25 | 2015-01-29 | 日立金属株式会社 | 結晶配向圧電セラミックス、圧電体素子および結晶配向圧電セラミックスの製造方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9660174B2 (en) * | 2012-08-27 | 2017-05-23 | Canon Kabushiki Kaisha | Piezoelectric material and piezoelectric element using the same, and electronic apparatus using the piezoelectronic element |
WO2014098244A1 (en) * | 2012-12-21 | 2014-06-26 | Canon Kabushiki Kaisha | Vibration wave driving device, image pickup device, optical apparatus, liquid discharge device, and electronic apparatus |
CN107530006A (zh) * | 2015-04-17 | 2018-01-02 | 太阳诱电株式会社 | 振动波形传感器和波形分析装置 |
US10527843B2 (en) * | 2017-05-12 | 2020-01-07 | International Business Machines Corporation | Ultra-sonic self-cleaning system |
US11818955B2 (en) * | 2021-08-26 | 2023-11-14 | City University Of Hong Kong | Method for forming piezoelectric films on surfaces of arbitrary morphologies |
WO2023141615A2 (en) * | 2022-01-21 | 2023-07-27 | MEMS Drive (Nanjing) Co., Ltd. | Mems deformable lens assembly and process flow |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002047064A (ja) * | 2000-07-31 | 2002-02-12 | Kyocera Corp | 圧電磁器および圧電素子 |
JP2009242166A (ja) * | 2008-03-31 | 2009-10-22 | Tdk Corp | 圧電磁器及びその製造方法、並びに当該圧電磁器を用いた圧電素子 |
JP2011199206A (ja) * | 2010-03-23 | 2011-10-06 | Canon Inc | 振動装置に用いられる圧電素子、振動装置、及び振動装置を有する塵埃除去装置 |
JP2011213580A (ja) * | 2010-03-18 | 2011-10-27 | Ngk Insulators Ltd | 圧電/電歪焼結体、及び圧電/電歪素子 |
JP2012195577A (ja) * | 2011-02-28 | 2012-10-11 | Canon Inc | 圧電材料、圧電素子、液体吐出ヘッド、超音波モータおよび塵埃除去装置 |
WO2012141105A1 (ja) * | 2011-04-15 | 2012-10-18 | 株式会社村田製作所 | 圧電体薄膜素子 |
WO2013005701A1 (en) * | 2011-07-05 | 2013-01-10 | Canon Kabushiki Kaisha | Piezoelectric element, multilayered piezoelectric element, liquid discharge head, liquid discharge apparatus, ultrasonic motor, optical apparatus, and electronic apparatus |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US95805A (en) * | 1869-10-12 | Improvement in shoes | ||
JP3678234B2 (ja) * | 2002-07-25 | 2005-08-03 | 株式会社村田製作所 | 積層型圧電部品の製造方法、及び積層型電子部品 |
JP4590868B2 (ja) * | 2003-02-12 | 2010-12-01 | 株式会社デンソー | 積層型圧電体素子及びその製造方法 |
WO2006117990A1 (ja) | 2005-04-28 | 2006-11-09 | Murata Manufacturing Co., Ltd. | 圧電体磁器組成物、及び該圧電体磁器組成物の製造方法、並びに圧電セラミック電子部品 |
JP4347288B2 (ja) * | 2005-11-07 | 2009-10-21 | キヤノン株式会社 | 撮像装置 |
JP2007258280A (ja) * | 2006-03-20 | 2007-10-04 | Tdk Corp | 積層型圧電素子 |
JP5399165B2 (ja) * | 2008-11-17 | 2014-01-29 | 富士フイルム株式会社 | 成膜方法、成膜装置、圧電体膜、圧電素子、液体吐出装置、及び圧電型超音波振動子 |
-
2014
- 2014-01-24 WO PCT/JP2014/052188 patent/WO2014119705A1/en active Application Filing
- 2014-01-24 EP EP14705588.3A patent/EP2946419B1/en active Active
- 2014-01-24 KR KR1020157023498A patent/KR20150115845A/ko not_active Application Discontinuation
- 2014-01-24 US US14/764,081 patent/US10308557B2/en active Active
- 2014-01-24 TW TW103102775A patent/TWI518050B/zh active
- 2014-01-28 JP JP2014013645A patent/JP6366283B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002047064A (ja) * | 2000-07-31 | 2002-02-12 | Kyocera Corp | 圧電磁器および圧電素子 |
JP2009242166A (ja) * | 2008-03-31 | 2009-10-22 | Tdk Corp | 圧電磁器及びその製造方法、並びに当該圧電磁器を用いた圧電素子 |
JP2011213580A (ja) * | 2010-03-18 | 2011-10-27 | Ngk Insulators Ltd | 圧電/電歪焼結体、及び圧電/電歪素子 |
JP2011199206A (ja) * | 2010-03-23 | 2011-10-06 | Canon Inc | 振動装置に用いられる圧電素子、振動装置、及び振動装置を有する塵埃除去装置 |
JP2012195577A (ja) * | 2011-02-28 | 2012-10-11 | Canon Inc | 圧電材料、圧電素子、液体吐出ヘッド、超音波モータおよび塵埃除去装置 |
WO2012141105A1 (ja) * | 2011-04-15 | 2012-10-18 | 株式会社村田製作所 | 圧電体薄膜素子 |
WO2013005701A1 (en) * | 2011-07-05 | 2013-01-10 | Canon Kabushiki Kaisha | Piezoelectric element, multilayered piezoelectric element, liquid discharge head, liquid discharge apparatus, ultrasonic motor, optical apparatus, and electronic apparatus |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015012344A1 (ja) * | 2013-07-25 | 2015-01-29 | 日立金属株式会社 | 結晶配向圧電セラミックス、圧電体素子および結晶配向圧電セラミックスの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP6366283B2 (ja) | 2018-08-01 |
EP2946419B1 (en) | 2017-11-08 |
US20150368161A1 (en) | 2015-12-24 |
EP2946419A1 (en) | 2015-11-25 |
TWI518050B (zh) | 2016-01-21 |
WO2014119705A1 (en) | 2014-08-07 |
TW201434792A (zh) | 2014-09-16 |
US10308557B2 (en) | 2019-06-04 |
KR20150115845A (ko) | 2015-10-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6537581B2 (ja) | 圧電材料、圧電素子、および電子機器 | |
JP6567115B2 (ja) | 圧電素子、積層圧電素子、液体吐出ヘッド、液体吐出装置、超音波モータ、光学機器および電子機器 | |
JP5960305B2 (ja) | 圧電セラミックス、その製造方法、圧電素子、積層圧電素子、液体吐出ヘッド、液体吐出装置、超音波モータ、光学機器、振動装置、塵埃除去装置、撮像装置および電子機器 | |
JP6344922B2 (ja) | 圧電材料、圧電素子および電子機器 | |
JP6366284B2 (ja) | 圧電材料、圧電素子、および電子機器 | |
JP6108934B2 (ja) | 圧電セラミックス、圧電素子、超音波モータおよび塵埃除去装置 | |
JP6341674B2 (ja) | 圧電材料、圧電素子、積層圧電素子、液体吐出ヘッド、液体吐出装置、超音波モータ、光学機器、振動装置、塵埃除去装置、撮像装置、および電子機器 | |
JP6080465B2 (ja) | 圧電材料、圧電素子、圧電音響部品、および電子機器 | |
JP6180234B2 (ja) | 圧電材料、圧電素子、および電子機器 | |
JP6362458B2 (ja) | 圧電材料、圧電素子、および電子機器 | |
JP6366283B2 (ja) | 圧電材料、圧電素子、および電子機器 | |
JP6249717B2 (ja) | 圧電材料、圧電素子、および電子機器 | |
JP6380888B2 (ja) | 圧電材料、圧電素子、積層圧電素子、液体吐出ヘッド、液体吐出装置、超音波モータ、光学機器、振動装置、塵埃除去装置、撮像装置、および電子機器 | |
JP5911618B2 (ja) | 圧電材料、圧電素子、および電子機器 | |
JP6755686B2 (ja) | 圧電材料、圧電素子および電子機器 | |
JP6362459B2 (ja) | 圧電材料、圧電素子、および電子機器 | |
JP6312424B2 (ja) | 圧電材料、圧電素子、および電子機器 | |
JP2016006859A (ja) | 圧電材料、圧電素子、および電子機器 | |
JP2016006858A (ja) | 圧電材料、圧電素子、圧電素子の製造方法、および電子機器 | |
JP6271949B2 (ja) | 圧電材料、圧電素子および電子機器 | |
JP6310212B2 (ja) | 圧電材料、圧電素子、および電子機器 | |
JP6324088B2 (ja) | 圧電材料、圧電素子、および電子機器 | |
JP6265656B2 (ja) | 圧電材料、圧電素子、および電子機器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170125 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170125 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20171024 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20171026 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20171214 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180424 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180507 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180605 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180703 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 6366283 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |