JP2014143643A - モジュール基板及びモジュール - Google Patents
モジュール基板及びモジュール Download PDFInfo
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- JP2014143643A JP2014143643A JP2013012164A JP2013012164A JP2014143643A JP 2014143643 A JP2014143643 A JP 2014143643A JP 2013012164 A JP2013012164 A JP 2013012164A JP 2013012164 A JP2013012164 A JP 2013012164A JP 2014143643 A JP2014143643 A JP 2014143643A
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- 239000000758 substrate Substances 0.000 title claims abstract description 12
- 230000009467 reduction Effects 0.000 abstract description 6
- 239000010410 layer Substances 0.000 description 28
- 238000010586 diagram Methods 0.000 description 8
- 239000012792 core layer Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000010897 surface acoustic wave method Methods 0.000 description 4
- 238000010295 mobile communication Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- UXUFTKZYJYGMGO-CMCWBKRRSA-N (2s,3s,4r,5r)-5-[6-amino-2-[2-[4-[3-(2-aminoethylamino)-3-oxopropyl]phenyl]ethylamino]purin-9-yl]-n-ethyl-3,4-dihydroxyoxolane-2-carboxamide Chemical compound O[C@@H]1[C@H](O)[C@@H](C(=O)NCC)O[C@H]1N1C2=NC(NCCC=3C=CC(CCC(=O)NCCN)=CC=3)=NC(N)=C2N=C1 UXUFTKZYJYGMGO-CMCWBKRRSA-N 0.000 description 1
- 235000019687 Lamb Nutrition 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/46—Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H7/463—Duplexers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/19—Manufacturing methods of high density interconnect preforms
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
- H04B1/0053—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band
- H04B1/0057—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band using diplexing or multiplexing filters for selecting the desired band
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H2250/00—Indexing scheme relating to dual- or multi-band filters
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Transceivers (AREA)
Abstract
【解決手段】 複数の配線層32a〜32iを含む多層配線基板30と、多層配線基板30に内蔵され、配線層32と電気的に接続された複数の内蔵デュプレクサ20と、を備え、複数の内蔵デュプレクサ20は、バンド1、バンド2、バンド5、バンド8のうち少なくとも2つのバンドに対応する2つのデュプレクサを含むことを特徴とするモジュール基板100、及び当該モジュール基板100を備えたモジュール。
【選択図】 図2
Description
12 スイッチ回路
14 高周波回路
20 デュプレクサ
20a 送信フィルタ
20b 受信フィルタ
22 パワーアンプ
24 ローノイズアンプ(LNA)
26 パワーアンプユニット
28 送信フィルタ
30 多層配線基板
32 絶縁層
34 配線層
36 ビア配線
40 電子部品(内蔵デュプレクサ)
50 電子部品
60 電子部品(外付デュプレクサ)
62 電子部品(パワーアンプ)
64 ボンディングワイヤ
Claims (9)
- 複数の配線層を含む多層配線基板と、
前記多層配線基板に内蔵され、前記配線層と電気的に接続された複数の内蔵デュプレクサと、を備え、
前記複数の内蔵デュプレクサは、バンド1、バンド2、バンド5、バンド8のうち少なくとも2つのバンドに対応するデュプレクサを含むことを特徴とするモジュール基板。 - 前記複数の配線層のうち、前記多層配線基板の表面に形成された配線層は、バンド3、バンド4、バンド7、バンド13、バンド17、バンド20のうち少なくとも1つの外付デュプレクサを実装可能な端子部を有することを特徴とする請求項1に記載のモジュール基板。
- 前記複数の内蔵デュプレクサは、バンド1及びバンド5、バンド1及びバンド8、バンド2及びバンド5、バンド2及びバンド8のうち、いずれかの組み合わせに対応するデュプレクサを含むことを特徴とする請求項2に記載のモジュール基板。
- 前記複数の内蔵デュプレクサは、バンド1、バンド2、バンド5、バンド8のうち少なくとも3つのバンドに対応するデュプレクサを含むことを特徴とする請求項1に記載のモジュール基板。
- 前記3つのバンドに対応するデュプレクサは、3つのバンドのうち周波数帯が最も近い2つのバンドに対応する2つのデュプレクサの間に、残りの1つのバンドに対応するデュプレクサが配置されていることを特徴とする請求項4に記載のモジュール基板。
- 前記複数の内蔵デュプレクサは、バンド1及びバンド2及びバンド5、バンド1及びバンド2及びバンド8、バンド1及びバンド5及びバンド8、バンド2及びバンド5及びバンド8のうち、いずれかの組み合わせに対応するデュプレクサを含むことを特徴とする請求項4に記載のモジュール基板。
- 前記複数の内蔵デュプレクサは、バンド1、バンド2、バンド5、バンド8の4つのバンドに対応するデュプレクサを含むことを特徴とする請求項1に記載のモジュール基板。
- 前記4つのバンドに対応するデュプレクサは、バンド1及びバンド2に対応するデュプレクサの間に、バンド5及びバンド8に対応するデュプレクサのうち1つが配置されると共に、バンド5及びバンド8に対応するデュプレクサの間に、バンド1及びバンド2に対応するデュプレクサのうち1つが配置されていることを特徴とする請求項7に記載のモジュール基板。
- 請求項1〜8のいずれか1項に記載のモジュール基板を備えたモジュール。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013012164A JP6250934B2 (ja) | 2013-01-25 | 2013-01-25 | モジュール基板及びモジュール |
TW102144477A TWI511475B (zh) | 2013-01-25 | 2013-12-04 | 模組基板及通信用模組 |
US14/102,305 US9252739B2 (en) | 2013-01-25 | 2013-12-10 | Module substrate and module |
EP13197548.4A EP2760132B1 (en) | 2013-01-25 | 2013-12-16 | Module substrate and duplexer module |
CN201410008629.0A CN103973332B (zh) | 2013-01-25 | 2014-01-08 | 模块基板及模块 |
KR1020140007728A KR101622452B1 (ko) | 2013-01-25 | 2014-01-22 | 모듈 기판 및 모듈 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013012164A JP6250934B2 (ja) | 2013-01-25 | 2013-01-25 | モジュール基板及びモジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014143643A true JP2014143643A (ja) | 2014-08-07 |
JP6250934B2 JP6250934B2 (ja) | 2017-12-20 |
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ID=50064334
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2013012164A Active JP6250934B2 (ja) | 2013-01-25 | 2013-01-25 | モジュール基板及びモジュール |
Country Status (6)
Country | Link |
---|---|
US (1) | US9252739B2 (ja) |
EP (1) | EP2760132B1 (ja) |
JP (1) | JP6250934B2 (ja) |
KR (1) | KR101622452B1 (ja) |
CN (1) | CN103973332B (ja) |
TW (1) | TWI511475B (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106134075B (zh) * | 2014-04-08 | 2019-04-23 | 株式会社村田制作所 | 高频模块 |
JP6615704B2 (ja) * | 2015-06-29 | 2019-12-04 | スカイワークス ソリューションズ,インコーポレイテッド | 共振器付きハイブリッド回路を有するマルチプレクサ |
DE102015116224B4 (de) * | 2015-09-25 | 2019-10-24 | Snaptrack, Inc. | SAW-Filter mit zusätzlichem Pol |
CN110710118B (zh) * | 2017-06-02 | 2021-08-20 | 株式会社村田制作所 | 高频模块以及通信装置 |
DE102017129611B4 (de) * | 2017-12-12 | 2021-04-22 | RF360 Europe GmbH | Elektrische Vorrichtung mit zwei oder mehr Chipkomponenten |
WO2019132941A1 (en) * | 2017-12-28 | 2019-07-04 | Intel Corporation | Hybrid filter having an acoustic wave resonator embedded in a cavity of a package substrate |
JP6777136B2 (ja) * | 2018-11-20 | 2020-10-28 | Tdk株式会社 | アンテナモジュール |
CN109802644B (zh) * | 2018-12-20 | 2021-11-30 | 天津大学 | 一种双工器 |
CN109639255B (zh) * | 2018-12-25 | 2022-07-12 | 天津大学 | 一种双工器 |
KR20210012306A (ko) | 2019-07-24 | 2021-02-03 | 삼성전자주식회사 | 능동 소자 어레이를 사용하는 송수신기 및 이를 포함하는 안테나 모듈 |
US11350519B2 (en) | 2020-01-22 | 2022-05-31 | Delta Electronics (Shanghai) Co., Ltd. | Power module |
EP3855488A1 (en) | 2020-01-22 | 2021-07-28 | Delta Electronics (Shanghai) Co., Ltd. | Power module |
US11621228B2 (en) | 2020-08-31 | 2023-04-04 | Nxp Usa, Inc. | Substrate with thermal vias and sinter-bonded thermal dissipation structure |
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WO2012093539A1 (ja) * | 2011-01-06 | 2012-07-12 | 株式会社村田製作所 | 高周波モジュール |
JP2013012699A (ja) * | 2011-05-27 | 2013-01-17 | Taiyo Yuden Co Ltd | 多層基板 |
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2013
- 2013-01-25 JP JP2013012164A patent/JP6250934B2/ja active Active
- 2013-12-04 TW TW102144477A patent/TWI511475B/zh not_active IP Right Cessation
- 2013-12-10 US US14/102,305 patent/US9252739B2/en active Active
- 2013-12-16 EP EP13197548.4A patent/EP2760132B1/en not_active Not-in-force
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2014
- 2014-01-08 CN CN201410008629.0A patent/CN103973332B/zh active Active
- 2014-01-22 KR KR1020140007728A patent/KR101622452B1/ko active IP Right Grant
Patent Citations (3)
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JP2008130612A (ja) * | 2006-11-16 | 2008-06-05 | Denso Corp | 電子部品内蔵型多層基板 |
WO2012093539A1 (ja) * | 2011-01-06 | 2012-07-12 | 株式会社村田製作所 | 高周波モジュール |
JP2013012699A (ja) * | 2011-05-27 | 2013-01-17 | Taiyo Yuden Co Ltd | 多層基板 |
Also Published As
Publication number | Publication date |
---|---|
EP2760132B1 (en) | 2019-09-11 |
US9252739B2 (en) | 2016-02-02 |
TW201433104A (zh) | 2014-08-16 |
CN103973332A (zh) | 2014-08-06 |
CN103973332B (zh) | 2016-08-31 |
EP2760132A1 (en) | 2014-07-30 |
JP6250934B2 (ja) | 2017-12-20 |
TWI511475B (zh) | 2015-12-01 |
US20140210569A1 (en) | 2014-07-31 |
KR101622452B1 (ko) | 2016-05-18 |
KR20140095984A (ko) | 2014-08-04 |
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