JP2014128859A5 - - Google Patents

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Publication number
JP2014128859A5
JP2014128859A5 JP2012288521A JP2012288521A JP2014128859A5 JP 2014128859 A5 JP2014128859 A5 JP 2014128859A5 JP 2012288521 A JP2012288521 A JP 2012288521A JP 2012288521 A JP2012288521 A JP 2012288521A JP 2014128859 A5 JP2014128859 A5 JP 2014128859A5
Authority
JP
Japan
Prior art keywords
polyurethane resin
resin foam
flexible polyurethane
asker
hardness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012288521A
Other languages
English (en)
Japanese (ja)
Other versions
JP5629749B2 (ja
JP2014128859A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2012288521A external-priority patent/JP5629749B2/ja
Priority to JP2012288521A priority Critical patent/JP5629749B2/ja
Priority to KR1020157008680A priority patent/KR20150052268A/ko
Priority to US14/654,831 priority patent/US20150343604A1/en
Priority to CN201380054933.2A priority patent/CN104755228A/zh
Priority to PCT/JP2013/078289 priority patent/WO2014103483A1/ja
Priority to TW102138912A priority patent/TWI486234B/zh
Publication of JP2014128859A publication Critical patent/JP2014128859A/ja
Publication of JP2014128859A5 publication Critical patent/JP2014128859A5/ja
Publication of JP5629749B2 publication Critical patent/JP5629749B2/ja
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012288521A 2012-12-28 2012-12-28 研磨パッドの製造方法 Expired - Fee Related JP5629749B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2012288521A JP5629749B2 (ja) 2012-12-28 2012-12-28 研磨パッドの製造方法
PCT/JP2013/078289 WO2014103483A1 (ja) 2012-12-28 2013-10-18 研磨パッドの製造方法
US14/654,831 US20150343604A1 (en) 2012-12-28 2013-10-18 Polishing pad production method
CN201380054933.2A CN104755228A (zh) 2012-12-28 2013-10-18 抛光垫的制造方法
KR1020157008680A KR20150052268A (ko) 2012-12-28 2013-10-18 연마 패드의 제조 방법
TW102138912A TWI486234B (zh) 2012-12-28 2013-10-28 Grinding pad manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012288521A JP5629749B2 (ja) 2012-12-28 2012-12-28 研磨パッドの製造方法

Publications (3)

Publication Number Publication Date
JP2014128859A JP2014128859A (ja) 2014-07-10
JP2014128859A5 true JP2014128859A5 (enExample) 2014-10-23
JP5629749B2 JP5629749B2 (ja) 2014-11-26

Family

ID=51020583

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012288521A Expired - Fee Related JP5629749B2 (ja) 2012-12-28 2012-12-28 研磨パッドの製造方法

Country Status (6)

Country Link
US (1) US20150343604A1 (enExample)
JP (1) JP5629749B2 (enExample)
KR (1) KR20150052268A (enExample)
CN (1) CN104755228A (enExample)
TW (1) TWI486234B (enExample)
WO (1) WO2014103483A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140342641A1 (en) * 2011-12-16 2014-11-20 Toyo Tire & Rubber Co., Ltd. Polishing pad
TWI623385B (zh) * 2014-08-27 2018-05-11 桂林創源金剛石有限公司 防失形高效切削砂輪
US9543417B2 (en) * 2014-11-07 2017-01-10 Taiwan Semiconductor Manufacturing Company, Ltd. High mobility devices and methods of forming same
KR102317416B1 (ko) 2015-04-20 2021-10-25 충남대학교산학협력단 높은 에너지 밀도를 가지는 음극 활물질 및 이를 포함하는 리튬이온2차전지
JP2019507806A (ja) * 2015-12-22 2019-03-22 コベストロ、ドイチュラント、アクチエンゲゼルシャフトＣｏｖｅｓｔｒｏ Ｄｅｕｔｓｃｈｌａｎｄ Ａｇ 布地用の低溶媒被覆システム
CN108747870B (zh) * 2018-05-28 2019-09-27 湖北鼎汇微电子材料有限公司 抛光垫的制备方法
CN115008356B (zh) * 2022-07-20 2023-05-05 华侨大学 一种软硬复合结构减薄砂轮的制备方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6648733B2 (en) * 1997-04-04 2003-11-18 Rodel Holdings, Inc. Polishing pads and methods relating thereto
US6749485B1 (en) * 2000-05-27 2004-06-15 Rodel Holdings, Inc. Hydrolytically stable grooved polishing pads for chemical mechanical planarization
US6454634B1 (en) * 2000-05-27 2002-09-24 Rodel Holdings Inc. Polishing pads for chemical mechanical planarization
JP2002224950A (ja) * 2001-01-29 2002-08-13 Kogi Corp 研磨用定盤
JP3983610B2 (ja) * 2002-07-02 2007-09-26 株式会社クラレ 熱可塑性ポリウレタン発泡体およびそれからなる研磨パッド
CN1318469C (zh) * 2002-11-18 2007-05-30 东省A&T株式会社 具有微孔的聚氨酯泡沫的制备方法和由此获得的抛光垫
JP3769581B1 (ja) * 2005-05-18 2006-04-26 東洋ゴム工業株式会社 研磨パッドおよびその製造方法
WO2008026451A1 (fr) * 2006-08-28 2008-03-06 Toyo Tire & Rubber Co., Ltd. Tampon de polissage
JP5008927B2 (ja) * 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
US7234224B1 (en) * 2006-11-03 2007-06-26 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Curved grooving of polishing pads
JP4926746B2 (ja) * 2007-02-16 2012-05-09 東洋ゴム工業株式会社 研磨パッド溝加工機及び研磨パッド溝加工方法
JP5078000B2 (ja) * 2007-03-28 2012-11-21 東洋ゴム工業株式会社 研磨パッド
JP2009101447A (ja) * 2007-10-22 2009-05-14 Toyo Tire & Rubber Co Ltd 電解研磨パッドの製造方法
JP5394216B2 (ja) * 2009-12-08 2014-01-22 アピックヤマダ株式会社 搬送治具及び切削装置
US9211628B2 (en) * 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern

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