JP2014118578A5 - - Google Patents
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- Publication number
- JP2014118578A5 JP2014118578A5 JP2012272168A JP2012272168A JP2014118578A5 JP 2014118578 A5 JP2014118578 A5 JP 2014118578A5 JP 2012272168 A JP2012272168 A JP 2012272168A JP 2012272168 A JP2012272168 A JP 2012272168A JP 2014118578 A5 JP2014118578 A5 JP 2014118578A5
- Authority
- JP
- Japan
- Prior art keywords
- alloy plating
- anode
- chamber
- anolyte
- anode chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims description 88
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 46
- 239000000243 solution Substances 0.000 claims description 39
- 150000002500 ions Chemical class 0.000 claims description 21
- 239000002253 acid Substances 0.000 claims description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 239000008151 electrolyte solution Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 13
- 239000003792 electrolyte Substances 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 9
- 239000003011 anion exchange membrane Substances 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 238000000502 dialysis Methods 0.000 claims description 4
- 229910000510 noble metal Inorganic materials 0.000 claims description 3
- 230000035699 permeability Effects 0.000 claims description 3
- 238000002834 transmittance Methods 0.000 claims description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 2
- 229910001873 dinitrogen Inorganic materials 0.000 claims 2
- 230000005587 bubbling Effects 0.000 claims 1
- 239000007789 gas Substances 0.000 claims 1
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 28
- 229940098779 methanesulfonic acid Drugs 0.000 description 14
- 238000005192 partition Methods 0.000 description 5
- 238000011084 recovery Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012272168A JP6022922B2 (ja) | 2012-12-13 | 2012-12-13 | Ｓｎ合金めっき装置及び方法 |
| KR1020130153140A KR101967933B1 (ko) | 2012-12-13 | 2013-12-10 | Ｓｎ 합금 도금 장치 및 방법 |
| US14/103,767 US20140166492A1 (en) | 2012-12-13 | 2013-12-11 | Sn ALLOY PLATING APPARATUS AND METHOD |
| TW102145935A TWI582271B (zh) | 2012-12-13 | 2013-12-12 | Ｓｎ合金鍍敷裝置及方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012272168A JP6022922B2 (ja) | 2012-12-13 | 2012-12-13 | Ｓｎ合金めっき装置及び方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014118578A JP2014118578A (ja) | 2014-06-30 |
| JP2014118578A5 true JP2014118578A5 (enExample) | 2015-06-11 |
| JP6022922B2 JP6022922B2 (ja) | 2016-11-09 |
Family
ID=50929683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012272168A Active JP6022922B2 (ja) | 2012-12-13 | 2012-12-13 | Ｓｎ合金めっき装置及び方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20140166492A1 (enExample) |
| JP (1) | JP6022922B2 (enExample) |
| KR (1) | KR101967933B1 (enExample) |
| TW (1) | TWI582271B (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9303329B2 (en) * | 2013-11-11 | 2016-04-05 | Tel Nexx, Inc. | Electrochemical deposition apparatus with remote catholyte fluid management |
| JP6335763B2 (ja) * | 2014-11-20 | 2018-05-30 | 株式会社荏原製作所 | めっき装置及びめっき方法 |
| US10011919B2 (en) * | 2015-05-29 | 2018-07-03 | Lam Research Corporation | Electrolyte delivery and generation equipment |
| KR101776149B1 (ko) | 2015-07-24 | 2017-09-08 | 덕산하이메탈(주) | 발열 및 비정질 특성을 가진 합금 도금용 도금장치 및 도금방법 |
| JP2017137519A (ja) * | 2016-02-01 | 2017-08-10 | 株式会社荏原製作所 | めっき装置 |
| JP6986921B2 (ja) * | 2017-10-12 | 2021-12-22 | 株式会社荏原製作所 | めっき装置及びめっき方法 |
| JP6942072B2 (ja) * | 2018-02-22 | 2021-09-29 | 株式会社荏原製作所 | めっき装置 |
| CN108827992B (zh) * | 2018-06-21 | 2021-03-23 | 西凡仪器(深圳)有限公司 | K金电铸镀层成分全自动控制装置和系统 |
| PT3916132T (pt) * | 2019-02-28 | 2025-04-17 | Mitsubishi Materials Corp | Solução aquosa de sulfonato de estanho de elevada concentração e método de produção da mesma |
| JP2021025092A (ja) * | 2019-08-06 | 2021-02-22 | 株式会社荏原製作所 | 基板処理装置 |
| JP7227875B2 (ja) * | 2019-08-22 | 2023-02-22 | 株式会社荏原製作所 | 基板ホルダおよびめっき装置 |
| EP3929332B1 (en) * | 2020-06-25 | 2023-08-30 | Semsysco GmbH | Shield body system for a process fluid for chemical and/or electrolytic surface treatment of a substrate |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03145793A (ja) * | 1989-10-31 | 1991-06-20 | Fujitsu Ltd | プリント配線板の電解めっき用気泡撹拌装置 |
| US5227046A (en) * | 1991-10-07 | 1993-07-13 | Unisys Corporation | Low temperature tin-bismuth electroplating system |
| JP2559935B2 (ja) * | 1991-12-20 | 1996-12-04 | 日本リーロナール株式会社 | 不溶性陽極を用いた錫又は錫ー鉛合金電気めっきの方法及び装置 |
| JPH06158397A (ja) * | 1992-11-18 | 1994-06-07 | Asahi Glass Co Ltd | 金属の電気メッキ方法 |
| US5312539A (en) * | 1993-06-15 | 1994-05-17 | Learonal Inc. | Electrolytic tin plating method |
| US6251255B1 (en) * | 1998-12-22 | 2001-06-26 | Precision Process Equipment, Inc. | Apparatus and method for electroplating tin with insoluble anodes |
| JP4664320B2 (ja) * | 2000-03-17 | 2011-04-06 | 株式会社荏原製作所 | めっき方法 |
| JP2001316893A (ja) * | 2000-05-01 | 2001-11-16 | Shimonoseki Mekki Kk | 不溶性陽極を使用する表面処理方法及びその装置 |
| JP3699410B2 (ja) * | 2002-03-19 | 2005-09-28 | 大日本スクリーン製造株式会社 | メッキ装置およびメッキ液組成調整方法 |
| JP4441725B2 (ja) * | 2003-11-04 | 2010-03-31 | 石原薬品株式会社 | 電気スズ合金メッキ方法 |
| US20060096867A1 (en) * | 2004-11-10 | 2006-05-11 | George Bokisa | Tin alloy electroplating system |
| EP2194165A1 (en) * | 2008-10-21 | 2010-06-09 | Rohm and Haas Electronic Materials LLC | Method for replenishing tin and its alloying metals in electrolyte solutions |
| JP5876767B2 (ja) * | 2012-05-15 | 2016-03-02 | 株式会社荏原製作所 | めっき装置及びめっき液管理方法 |
-
2012
- 2012-12-13 JP JP2012272168A patent/JP6022922B2/ja active Active
-
2013
- 2013-12-10 KR KR1020130153140A patent/KR101967933B1/ko active Active
- 2013-12-11 US US14/103,767 patent/US20140166492A1/en not_active Abandoned
- 2013-12-12 TW TW102145935A patent/TWI582271B/zh active
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