JP6022922B2 - Ｓｎ合金めっき装置及び方法 - Google Patents

Ｓｎ合金めっき装置及び方法 Download PDF

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Publication number
JP6022922B2
JP6022922B2 JP2012272168A JP2012272168A JP6022922B2 JP 6022922 B2 JP6022922 B2 JP 6022922B2 JP 2012272168 A JP2012272168 A JP 2012272168A JP 2012272168 A JP2012272168 A JP 2012272168A JP 6022922 B2 JP6022922 B2 JP 6022922B2
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Japan
Prior art keywords
anolyte
anode
chamber
alloy plating
anode chamber
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Active
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JP2012272168A
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English (en)
Japanese (ja)
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JP2014118578A5 (enExample
JP2014118578A (ja
Inventor
下山　正
正 下山
淳平 藤方
淳平 藤方
裕二 荒木
裕二 荒木
昌道 田村
昌道 田村
俊樹 宮川
俊樹 宮川
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Ebara Corp
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Ebara Corp
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Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2012272168A priority Critical patent/JP6022922B2/ja
Priority to KR1020130153140A priority patent/KR101967933B1/ko
Priority to US14/103,767 priority patent/US20140166492A1/en
Priority to TW102145935A priority patent/TWI582271B/zh
Publication of JP2014118578A publication Critical patent/JP2014118578A/ja
Publication of JP2014118578A5 publication Critical patent/JP2014118578A5/ja
Application granted granted Critical
Publication of JP6022922B2 publication Critical patent/JP6022922B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/003—Electroplating using gases, e.g. pressure influence
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
JP2012272168A 2012-12-13 2012-12-13 Ｓｎ合金めっき装置及び方法 Active JP6022922B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012272168A JP6022922B2 (ja) 2012-12-13 2012-12-13 Ｓｎ合金めっき装置及び方法
KR1020130153140A KR101967933B1 (ko) 2012-12-13 2013-12-10 Ｓｎ 합금 도금 장치 및 방법
US14/103,767 US20140166492A1 (en) 2012-12-13 2013-12-11 Sn ALLOY PLATING APPARATUS AND METHOD
TW102145935A TWI582271B (zh) 2012-12-13 2013-12-12 Ｓｎ合金鍍敷裝置及方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012272168A JP6022922B2 (ja) 2012-12-13 2012-12-13 Ｓｎ合金めっき装置及び方法

Publications (3)

Publication Number Publication Date
JP2014118578A JP2014118578A (ja) 2014-06-30
JP2014118578A5 JP2014118578A5 (enExample) 2015-06-11
JP6022922B2 true JP6022922B2 (ja) 2016-11-09

Family

ID=50929683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012272168A Active JP6022922B2 (ja) 2012-12-13 2012-12-13 Ｓｎ合金めっき装置及び方法

Country Status (4)

Country Link
US (1) US20140166492A1 (enExample)
JP (1) JP6022922B2 (enExample)
KR (1) KR101967933B1 (enExample)
TW (1) TWI582271B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9303329B2 (en) * 2013-11-11 2016-04-05 Tel Nexx, Inc. Electrochemical deposition apparatus with remote catholyte fluid management
JP6335763B2 (ja) * 2014-11-20 2018-05-30 株式会社荏原製作所 めっき装置及びめっき方法
US10011919B2 (en) * 2015-05-29 2018-07-03 Lam Research Corporation Electrolyte delivery and generation equipment
KR101776149B1 (ko) 2015-07-24 2017-09-08 덕산하이메탈(주) 발열 및 비정질 특성을 가진 합금 도금용 도금장치 및 도금방법
JP2017137519A (ja) * 2016-02-01 2017-08-10 株式会社荏原製作所 めっき装置
JP6986921B2 (ja) * 2017-10-12 2021-12-22 株式会社荏原製作所 めっき装置及びめっき方法
JP6942072B2 (ja) * 2018-02-22 2021-09-29 株式会社荏原製作所 めっき装置
CN108827992B (zh) * 2018-06-21 2021-03-23 西凡仪器(深圳)有限公司 K金电铸镀层成分全自动控制装置和系统
PT3916132T (pt) * 2019-02-28 2025-04-17 Mitsubishi Materials Corp Solução aquosa de sulfonato de estanho de elevada concentração e método de produção da mesma
JP2021025092A (ja) * 2019-08-06 2021-02-22 株式会社荏原製作所 基板処理装置
JP7227875B2 (ja) * 2019-08-22 2023-02-22 株式会社荏原製作所 基板ホルダおよびめっき装置
EP3929332B1 (en) * 2020-06-25 2023-08-30 Semsysco GmbH Shield body system for a process fluid for chemical and/or electrolytic surface treatment of a substrate

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03145793A (ja) * 1989-10-31 1991-06-20 Fujitsu Ltd プリント配線板の電解めっき用気泡撹拌装置
US5227046A (en) * 1991-10-07 1993-07-13 Unisys Corporation Low temperature tin-bismuth electroplating system
JP2559935B2 (ja) * 1991-12-20 1996-12-04 日本リーロナール株式会社 不溶性陽極を用いた錫又は錫ー鉛合金電気めっきの方法及び装置
JPH06158397A (ja) * 1992-11-18 1994-06-07 Asahi Glass Co Ltd 金属の電気メッキ方法
US5312539A (en) * 1993-06-15 1994-05-17 Learonal Inc. Electrolytic tin plating method
US6251255B1 (en) * 1998-12-22 2001-06-26 Precision Process Equipment, Inc. Apparatus and method for electroplating tin with insoluble anodes
JP4664320B2 (ja) * 2000-03-17 2011-04-06 株式会社荏原製作所 めっき方法
JP2001316893A (ja) * 2000-05-01 2001-11-16 Shimonoseki Mekki Kk 不溶性陽極を使用する表面処理方法及びその装置
JP3699410B2 (ja) * 2002-03-19 2005-09-28 大日本スクリーン製造株式会社 メッキ装置およびメッキ液組成調整方法
JP4441725B2 (ja) * 2003-11-04 2010-03-31 石原薬品株式会社 電気スズ合金メッキ方法
US20060096867A1 (en) * 2004-11-10 2006-05-11 George Bokisa Tin alloy electroplating system
EP2194165A1 (en) * 2008-10-21 2010-06-09 Rohm and Haas Electronic Materials LLC Method for replenishing tin and its alloying metals in electrolyte solutions
JP5876767B2 (ja) * 2012-05-15 2016-03-02 株式会社荏原製作所 めっき装置及びめっき液管理方法

Also Published As

Publication number Publication date
KR20140077112A (ko) 2014-06-23
TW201435147A (zh) 2014-09-16
TWI582271B (zh) 2017-05-11
US20140166492A1 (en) 2014-06-19
KR101967933B1 (ko) 2019-04-10
JP2014118578A (ja) 2014-06-30

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