TWI582271B - Ｓｎ合金鍍敷裝置及方法 - Google Patents

Ｓｎ合金鍍敷裝置及方法 Download PDF

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Publication number
TWI582271B
TWI582271B TW102145935A TW102145935A TWI582271B TW I582271 B TWI582271 B TW I582271B TW 102145935 A TW102145935 A TW 102145935A TW 102145935 A TW102145935 A TW 102145935A TW I582271 B TWI582271 B TW I582271B
Authority
TW
Taiwan
Prior art keywords
anode
anolyte
anode chamber
chamber
alloy plating
Prior art date
Application number
TW102145935A
Other languages
English (en)
Chinese (zh)
Other versions
TW201435147A (zh
Inventor
下山正
藤方淳平
荒木裕二
田村昌道
宮川俊樹
Original Assignee
荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荏原製作所股份有限公司 filed Critical 荏原製作所股份有限公司
Publication of TW201435147A publication Critical patent/TW201435147A/zh
Application granted granted Critical
Publication of TWI582271B publication Critical patent/TWI582271B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/003—Electroplating using gases, e.g. pressure influence
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
TW102145935A 2012-12-13 2013-12-12 Ｓｎ合金鍍敷裝置及方法 TWI582271B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012272168A JP6022922B2 (ja) 2012-12-13 2012-12-13 Ｓｎ合金めっき装置及び方法

Publications (2)

Publication Number Publication Date
TW201435147A TW201435147A (zh) 2014-09-16
TWI582271B true TWI582271B (zh) 2017-05-11

Family

ID=50929683

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102145935A TWI582271B (zh) 2012-12-13 2013-12-12 Ｓｎ合金鍍敷裝置及方法

Country Status (4)

Country Link
US (1) US20140166492A1 (enExample)
JP (1) JP6022922B2 (enExample)
KR (1) KR101967933B1 (enExample)
TW (1) TWI582271B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9303329B2 (en) * 2013-11-11 2016-04-05 Tel Nexx, Inc. Electrochemical deposition apparatus with remote catholyte fluid management
JP6335763B2 (ja) * 2014-11-20 2018-05-30 株式会社荏原製作所 めっき装置及びめっき方法
US10011919B2 (en) * 2015-05-29 2018-07-03 Lam Research Corporation Electrolyte delivery and generation equipment
KR101776149B1 (ko) 2015-07-24 2017-09-08 덕산하이메탈(주) 발열 및 비정질 특성을 가진 합금 도금용 도금장치 및 도금방법
JP2017137519A (ja) * 2016-02-01 2017-08-10 株式会社荏原製作所 めっき装置
JP6986921B2 (ja) * 2017-10-12 2021-12-22 株式会社荏原製作所 めっき装置及びめっき方法
JP6942072B2 (ja) * 2018-02-22 2021-09-29 株式会社荏原製作所 めっき装置
CN108827992B (zh) * 2018-06-21 2021-03-23 西凡仪器(深圳)有限公司 K金电铸镀层成分全自动控制装置和系统
PT3916132T (pt) * 2019-02-28 2025-04-17 Mitsubishi Materials Corp Solução aquosa de sulfonato de estanho de elevada concentração e método de produção da mesma
JP2021025092A (ja) * 2019-08-06 2021-02-22 株式会社荏原製作所 基板処理装置
JP7227875B2 (ja) * 2019-08-22 2023-02-22 株式会社荏原製作所 基板ホルダおよびめっき装置
EP3929332B1 (en) * 2020-06-25 2023-08-30 Semsysco GmbH Shield body system for a process fluid for chemical and/or electrolytic surface treatment of a substrate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6251255B1 (en) * 1998-12-22 2001-06-26 Precision Process Equipment, Inc. Apparatus and method for electroplating tin with insoluble anodes
TW201026904A (en) * 2008-10-21 2010-07-16 Rohm & Haas Elect Mat Method for replenishing tin and its alloying metals in electrolyte solutions

Family Cites Families (11)

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Publication number Priority date Publication date Assignee Title
JPH03145793A (ja) * 1989-10-31 1991-06-20 Fujitsu Ltd プリント配線板の電解めっき用気泡撹拌装置
US5227046A (en) * 1991-10-07 1993-07-13 Unisys Corporation Low temperature tin-bismuth electroplating system
JP2559935B2 (ja) * 1991-12-20 1996-12-04 日本リーロナール株式会社 不溶性陽極を用いた錫又は錫ー鉛合金電気めっきの方法及び装置
JPH06158397A (ja) * 1992-11-18 1994-06-07 Asahi Glass Co Ltd 金属の電気メッキ方法
US5312539A (en) * 1993-06-15 1994-05-17 Learonal Inc. Electrolytic tin plating method
JP4664320B2 (ja) * 2000-03-17 2011-04-06 株式会社荏原製作所 めっき方法
JP2001316893A (ja) * 2000-05-01 2001-11-16 Shimonoseki Mekki Kk 不溶性陽極を使用する表面処理方法及びその装置
JP3699410B2 (ja) * 2002-03-19 2005-09-28 大日本スクリーン製造株式会社 メッキ装置およびメッキ液組成調整方法
JP4441725B2 (ja) * 2003-11-04 2010-03-31 石原薬品株式会社 電気スズ合金メッキ方法
US20060096867A1 (en) * 2004-11-10 2006-05-11 George Bokisa Tin alloy electroplating system
JP5876767B2 (ja) * 2012-05-15 2016-03-02 株式会社荏原製作所 めっき装置及びめっき液管理方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6251255B1 (en) * 1998-12-22 2001-06-26 Precision Process Equipment, Inc. Apparatus and method for electroplating tin with insoluble anodes
TW201026904A (en) * 2008-10-21 2010-07-16 Rohm & Haas Elect Mat Method for replenishing tin and its alloying metals in electrolyte solutions

Also Published As

Publication number Publication date
KR20140077112A (ko) 2014-06-23
TW201435147A (zh) 2014-09-16
US20140166492A1 (en) 2014-06-19
KR101967933B1 (ko) 2019-04-10
JP6022922B2 (ja) 2016-11-09
JP2014118578A (ja) 2014-06-30

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