JP2014099609A - 基板支持モジュール - Google Patents
基板支持モジュール Download PDFInfo
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- JP2014099609A JP2014099609A JP2013233136A JP2013233136A JP2014099609A JP 2014099609 A JP2014099609 A JP 2014099609A JP 2013233136 A JP2013233136 A JP 2013233136A JP 2013233136 A JP2013233136 A JP 2013233136A JP 2014099609 A JP2014099609 A JP 2014099609A
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- substrate
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- 239000000758 substrate Substances 0.000 title claims abstract description 126
- 230000007246 mechanism Effects 0.000 claims abstract description 115
- 238000007667 floating Methods 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 8
- 239000002861 polymer material Substances 0.000 claims description 5
- 230000000116 mitigating effect Effects 0.000 abstract 1
- 230000035939 shock Effects 0.000 abstract 1
- 230000005540 biological transmission Effects 0.000 description 7
- 238000000137 annealing Methods 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000003028 elevating effect Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000002952 polymeric resin Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005224 laser annealing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Recrystallisation Techniques (AREA)
Abstract
【解決手段】基板が載置されるステージと、少なくとも一部が前記ステージを上下方向に貫通するように配設されて、昇降することにより、前記基板を前記ステージの上に搬入したり、前記ステージの上に載置された基板をステージから搬出したりする支持台と、前記ステージの内部に支持台を挟んで相対向するように配設されて、前記支持台を支持しながら回転する第1及び第2の下回転部材を有する下回転機構と、前記ステージの内部且つ前記下回転機構の上側に支持台を挟んで相対向するように配設されて、前記支持台を支持しながら回転する第1及び第2の上回転部材を有する第1の上回転機構と、を備える。
【選択図】図1
Description
430 第2の上回転機構
440 下回転機構
480 第1の遊動機構
453 第2の遊動機構
Claims (12)
- 基板が載置されるステージと、
少なくとも一部が前記ステージを上下方向に貫通するように配設されて、昇降することにより、前記基板を前記ステージの上に搬入したり、前記ステージの上に載置された基板をステージから搬出したりする支持台と、
前記ステージの内部に支持台を挟んで相対向するように配設されて、前記支持台を支持しながら回転する第1及び第2の下回転部材を有する下回転機構と、
前記ステージの内部且つ前記下回転機構の上側に支持台を挟んで相対向するように配設されて、前記支持台を支持しながら回転する第1及び第2の上回転部材を有する第1の上回転機構と、
を備える基板支持モジュール。 - 前記支持台は、金属製の下胴体及び前記下胴体の上部に取り付けられて前記基板を支持する上胴体を備え、
前記上胴体は、高分子材料から製造される請求項1に記載の基板支持モジュール。 - 前記ステージの内部且つ前記下回転機構と第1の上回転機構との間に前記支持台を挟んで相対向するように配設されて、前記支持台を支持しながら回転する第3及び第4の上回転部材を有する第2の上回転機構をさらに備える請求項1または2に記載の基板支持モジュール。
- 前記第1の上回転機構の第1及び第2の上回転部材と第2の上回転機構の第3及び第4の回転部材のそれぞれは、前記下回転機構の第1及び第2の下回転部材に比べて小さな請求項3に記載の基板支持モジュール。
- 前記下回転機構の第1及び第2の下回転部材と、第1の上回転機構の第1及び第2の上回転部材と、第2の上回転機構の第3及び第4の回転部材のそれぞれは、ベアリングである請求項4に記載の基板支持モジュール。
- 一方の端が前記第1及び第2の下回転部材のうちのいずれかと連結されて、前記第1及び第2の下回転部材のうちのいずれかに隙間を生じて、遊動可能にする第1の遊動機構をさらに備える請求項1に記載の基板支持モジュール。
- 前記第1の遊動機構は、一方の端が前記第1及び第2の下回転部材のうちのいずれかと連結されたばねを備える請求項6に記載の基板支持モジュール。
- 前記下回転機構の第1の下回転部材と、第1の上回転機構の第1の上回転部材と、第2の上回転機構の第3の上回転部材とは、支持台の一方の面と接触した状態で回転し、前記下回転機構の第2の下回転部材と、第1の上回転機構の第2の上回転部材と、第2の上回転機構の第4の上回転部材とは、支持台の他方の面と接触した状態で回転する請求項3に記載の基板支持モジュール。
- 前記支持台の下部と連結されて前記支持台を支持し、前記支持台に隙間を生じて遊動可能にする第2の遊動機構をさらに備える請求項1に記載の基板支持モジュール。
- 前記第2の遊動機構は、
前記支持台の下部が嵌入する固定ブロック及び前記固定ブロックの下部に連結されて、前記固定ブロックを遊動する遊動部材を備える請求項9に記載の基板支持モジュール。 - 前記固定ブロックは、前記支持台の下部の一方の面と接触されるように配設された第1のブロック及び前記第1のブロックと相対向し、前記支持台の他方の面と接触されるように配設された第2のブロックを備え、
前記遊動部材は、前記第1のブロック及び第2のブロックのうちのいずれかの下部に連結される請求項10に記載の基板支持モジュール。 - 前記第2の遊動機構の遊動部材は、前記固定ブロックの下部に挿入され、少なくとも一部が前記固定ブロックの下側に突き出るように配設されたボールを備える請求項10または11に記載の基板支持モジュール。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2012-0128138 | 2012-11-13 | ||
KR1020120128138A KR101432152B1 (ko) | 2012-11-13 | 2012-11-13 | 기판 지지 모듈 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014099609A true JP2014099609A (ja) | 2014-05-29 |
JP5756507B2 JP5756507B2 (ja) | 2015-07-29 |
Family
ID=50703450
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013233136A Active JP5756507B2 (ja) | 2012-11-13 | 2013-11-11 | 基板支持モジュール |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5756507B2 (ja) |
KR (1) | KR101432152B1 (ja) |
CN (1) | CN103806085B (ja) |
TW (1) | TWI519373B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016041731A1 (en) * | 2014-09-15 | 2016-03-24 | Asml Netherlands B.V. | Object table, lithographic apparatus and device manufacturing method |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101958694B1 (ko) | 2016-03-03 | 2019-03-19 | 에이피시스템 주식회사 | Ela 장치용 기판 지지모듈 |
US10535549B2 (en) * | 2017-10-27 | 2020-01-14 | Applied Materials, Inc. | Lift pin holder |
KR102435298B1 (ko) * | 2020-07-07 | 2022-08-24 | 디앤에이 주식회사 | 기판 지지장치 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08313855A (ja) * | 1995-05-12 | 1996-11-29 | Tokyo Electron Ltd | 熱処理装置 |
JPH10308348A (ja) * | 1997-05-07 | 1998-11-17 | Tokyo Electron Ltd | 基板処理装置 |
JPH11204430A (ja) * | 1998-01-16 | 1999-07-30 | Tokyo Electron Ltd | 基板処理装置 |
JP2007036070A (ja) * | 2005-07-29 | 2007-02-08 | Tokyo Electron Ltd | 基板昇降装置および基板処理装置 |
JP2008500709A (ja) * | 2004-05-28 | 2008-01-10 | オー・ツェー・エリコン・バルザース・アクチェンゲゼルシャフト | 摩擦を減らすための、ローラグライドを備えたリフトピン |
Family Cites Families (4)
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KR20070091332A (ko) * | 2005-01-18 | 2007-09-10 | 에이에스엠 아메리카, 인코포레이티드 | 웨이퍼 지지핀 어셈블리 |
KR20090115308A (ko) * | 2008-05-01 | 2009-11-05 | 엘지디스플레이 주식회사 | 액정표시장치의 배향막 예비 건조 장치 |
KR101011932B1 (ko) * | 2009-06-25 | 2011-02-08 | 에이피시스템 주식회사 | 대형 기판 안착장치 |
WO2011009007A2 (en) * | 2009-07-15 | 2011-01-20 | Applied Materials, Inc. | Improved lift pin guides |
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2012
- 2012-11-13 KR KR1020120128138A patent/KR101432152B1/ko active IP Right Grant
-
2013
- 2013-11-11 JP JP2013233136A patent/JP5756507B2/ja active Active
- 2013-11-12 CN CN201310560032.2A patent/CN103806085B/zh active Active
- 2013-11-12 TW TW102141069A patent/TWI519373B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08313855A (ja) * | 1995-05-12 | 1996-11-29 | Tokyo Electron Ltd | 熱処理装置 |
JPH10308348A (ja) * | 1997-05-07 | 1998-11-17 | Tokyo Electron Ltd | 基板処理装置 |
JPH11204430A (ja) * | 1998-01-16 | 1999-07-30 | Tokyo Electron Ltd | 基板処理装置 |
JP2008500709A (ja) * | 2004-05-28 | 2008-01-10 | オー・ツェー・エリコン・バルザース・アクチェンゲゼルシャフト | 摩擦を減らすための、ローラグライドを備えたリフトピン |
JP2007036070A (ja) * | 2005-07-29 | 2007-02-08 | Tokyo Electron Ltd | 基板昇降装置および基板処理装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016041731A1 (en) * | 2014-09-15 | 2016-03-24 | Asml Netherlands B.V. | Object table, lithographic apparatus and device manufacturing method |
TWI576673B (zh) * | 2014-09-15 | 2017-04-01 | Asml荷蘭公司 | 物件台、微影裝置及元件製造方法 |
US9852937B2 (en) | 2014-09-15 | 2017-12-26 | Asml Netherlands B.V. | Object table, lithographic apparatus and device manufacturing method |
Also Published As
Publication number | Publication date |
---|---|
CN103806085A (zh) | 2014-05-21 |
JP5756507B2 (ja) | 2015-07-29 |
KR101432152B1 (ko) | 2014-08-22 |
TWI519373B (zh) | 2016-02-01 |
CN103806085B (zh) | 2016-08-17 |
TW201417922A (zh) | 2014-05-16 |
KR20140062593A (ko) | 2014-05-26 |
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