JP2014082458A5 - - Google Patents

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Publication number
JP2014082458A5
JP2014082458A5 JP2013161374A JP2013161374A JP2014082458A5 JP 2014082458 A5 JP2014082458 A5 JP 2014082458A5 JP 2013161374 A JP2013161374 A JP 2013161374A JP 2013161374 A JP2013161374 A JP 2013161374A JP 2014082458 A5 JP2014082458 A5 JP 2014082458A5
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JP
Japan
Prior art keywords
module
conductive
external connector
power module
frame member
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2013161374A
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English (en)
Japanese (ja)
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JP5887312B2 (ja
JP2014082458A (ja
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Priority claimed from US13/652,037 external-priority patent/US8847384B2/en
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Publication of JP2014082458A publication Critical patent/JP2014082458A/ja
Publication of JP2014082458A5 publication Critical patent/JP2014082458A5/ja
Application granted granted Critical
Publication of JP5887312B2 publication Critical patent/JP5887312B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013161374A 2012-10-15 2013-08-02 モジュール式設計態様を有するパワーモジュール及びパワーモジュール・アレイ Expired - Fee Related JP5887312B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/652,037 2012-10-15
US13/652,037 US8847384B2 (en) 2012-10-15 2012-10-15 Power modules and power module arrays having a modular design

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016026006A Division JP6105770B2 (ja) 2012-10-15 2016-02-15 モジュール式設計態様を有するパワーモジュール及びパワーモジュール・アレイ

Publications (3)

Publication Number Publication Date
JP2014082458A JP2014082458A (ja) 2014-05-08
JP2014082458A5 true JP2014082458A5 (cg-RX-API-DMAC10.html) 2015-03-12
JP5887312B2 JP5887312B2 (ja) 2016-03-16

Family

ID=50475131

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2013161374A Expired - Fee Related JP5887312B2 (ja) 2012-10-15 2013-08-02 モジュール式設計態様を有するパワーモジュール及びパワーモジュール・アレイ
JP2016026006A Expired - Fee Related JP6105770B2 (ja) 2012-10-15 2016-02-15 モジュール式設計態様を有するパワーモジュール及びパワーモジュール・アレイ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2016026006A Expired - Fee Related JP6105770B2 (ja) 2012-10-15 2016-02-15 モジュール式設計態様を有するパワーモジュール及びパワーモジュール・アレイ

Country Status (2)

Country Link
US (2) US8847384B2 (cg-RX-API-DMAC10.html)
JP (2) JP5887312B2 (cg-RX-API-DMAC10.html)

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WO2020090411A1 (ja) * 2018-10-30 2020-05-07 住友電気工業株式会社 半導体装置
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