JP2014077790A - 粒子を埋め込まれた構造物の非破壊検査 - Google Patents
粒子を埋め込まれた構造物の非破壊検査 Download PDFInfo
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- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
- G01N23/083—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption the radiation being X-rays
- G01N23/087—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption the radiation being X-rays using polyenergetic X-rays
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/607—Specific applications or type of materials strain
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/615—Specific applications or type of materials composite materials, multilayer laminates
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- G—PHYSICS
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
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Abstract
【解決手段】構造物110の中の或る平面114に粒子が埋め込まれている構造物110と、平面における粒子の画像を取り込むX線撮像装置とを備えているシステムであって、平面における種々の場所のひずみを特定し、ひずみから内部構造不整合を識別することを含む非破壊検査システム。
【選択図】図1
Description
112 部材、層
114 平面
210 粒子
220 ピクセルブロック
310 ブロック
320 ブロック
330 ブロック
340 ブロック
410 システム
420 撮像装置
422 X線放射源
424 X線検出器
430 コンピュータ
510 ブロック
320 ブロック
530 ブロック
540 ブロック
550 ブロック
610 積層体
612 層
614 層
616 層
618 層
710 ブロック
720 ブロック
730 ブロック
740 ブロック
750 ブロック
760 ブロック
Claims (16)
- 構造物(110)であって、前記構造物(110)内の或る平面(114)に粒子(210)を埋め込まれている構造物(110)と、
前記平面(114)における前記粒子(210)の画像を取り込むX線撮像装置(420)と
を備えるシステム。 - 前記画像を解析し、前記平面における種々の場所のひずみを特定する(340)ようにプログラミングされるコンピュータを更に含む、請求項1に記載のシステム。
- 前記ひずみから内部構造不整合を識別すること(550)を更に含み、
前記ひずみを特定することは、前記粒子(210)を含むピクセルブロック(220)を形成することと、前記ピクセルブロック(220)の形状の変化を特定すること(530)とを含み、
前記コンピュータ(430)は、前記画像内で前記粒子(210)のデジタル画像相関を実行するようにプログラミングされる、請求項2に記載のシステム。 - 前記撮像装置は、前記構造物(110)の一方の側にある第1及び第2のX線放射源(320)と、前記構造物(110)の他方の側にある少なくとも1つのX線検出器とを含む、請求項1に記載のシステム。
- 前記粒子(210)は不均一で、不規則なパターンに配置され、
前記粒子(210)は金属粒子である、請求項1に記載のシステム。 - 前記構造物(110)は接着層によって接合される第1及び第2の部材(112)を含み、前記接着層は前記粒子(210)のパターンを含む、請求項1に記載のシステム。
- 前記構造物(110)は積層体(112)を含み、前記粒子(210)は前記積層体(112)の層(612、614、616)のうちの少なくとも1つに埋め込まれる、請求項1に記載のシステム。
- 前記構造物(110)はマトリックス内に埋め込まれる強化用繊維の層(612、614、616)を含み、異なるタイプの前記粒子(210)が、前記構造物(110)内の異なる層(612、614、616)内に埋め込まれる、請求項1に記載のシステム。
- 粒子(210)を埋め込まれている構造物(110)上で非破壊検査を実行する方法であって、前記粒子は前記構造物(110)内の或る平面(114)に埋め込まれ、該方法は、
前記構造物(110)にX線を照射すること(310)と、
前記照射された構造物(110)の画像を形成すること(320)であって、前記画像は前記粒子を示す(740)、形成することと、
前記画像内の前記粒子の変位(750)を特定すること(330)と
を含む方法。 - 前記粒子(210)は照射され、蛍光発光するか、前記X線を散乱させるか、又は前記X線を吸収する(740)、請求項9に記載の方法。
- 前記変位を特定すること(330)は、前記画像内のピクセルブロック(220)の形状変化を特定すること(530)と、前記変位からひずみを特定すること(340)とを含む、請求項9に記載の方法。
- コンピュータ(430)を用いて、デジタル画像相関(DIC)を実行し、前記粒子(210)の前記変位を特定する(330)、請求項9に記載の方法。
- 前記画像を形成すること(320)は、前記粒子(210)に対して、前記画像内に奥行きを生み出すような角度で第1及び第2の検出器(424)を使用することを含む、請求項9に記載の方法。
- 前記粒子(210)は複数の層(612、614、616)内に埋め込まれ、前記層(612、614、616)内に埋め込まれた前記粒子(210)は公称寸法及び/又は組成に関して異なり、
前記粒子(210)を埋め込まれている前記層(612、614、616)は異なるX線エネルギーレベルで照射され(740)、
前記画像内の前記粒子(210)の前記変位は、前記粒子(210)を埋め込まれている層(612、614、616)ごとに特定される(750)、請求項9に記載の方法。 - 前記粒子(210)は異なる層(612、614、616)内に埋め込まれ、前記異なる層(612、614、616)内に埋め込まれた前記粒子(210)は、公称寸法及び/又は組成に関して異なり、前記粒子(210)を埋め込まれている前記異なる層(612、614、616)は照射され(740)、蛍光発光し、前記画像を形成すること(320)は、エネルギー分散検出を用いて前記蛍光発光する粒子(210)を撮像することを含む、請求項9に記載の方法。
- マトリックス内に強化用繊維の複数の層(612、614、616、618)を含む積層体(110、610)であって、前記マトリックスは異なる層(612、614、616)内に埋め込まれた金属粒子(210)のパターンを含み、前記異なる層(612、614、616)内に埋め込まれた前記粒子(210)は公称寸法及び組成のうちの少なくとも1つに関して異なる積層体。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/647,423 US9042516B2 (en) | 2012-10-09 | 2012-10-09 | Nondestructive examination of structures having embedded particles |
US13/647,423 | 2012-10-09 |
Publications (2)
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JP2014077790A true JP2014077790A (ja) | 2014-05-01 |
JP6280339B2 JP6280339B2 (ja) | 2018-02-14 |
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JP2013211209A Active JP6280339B2 (ja) | 2012-10-09 | 2013-10-08 | 粒子を埋め込まれた構造物の非破壊検査 |
Country Status (7)
Country | Link |
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US (1) | US9042516B2 (ja) |
EP (1) | EP2720031B1 (ja) |
JP (1) | JP6280339B2 (ja) |
CN (1) | CN103712998B (ja) |
BR (1) | BR102013026020B1 (ja) |
CA (1) | CA2823296C (ja) |
RU (1) | RU2632579C2 (ja) |
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BR102013026020B1 (pt) | 2020-12-22 |
CA2823296C (en) | 2015-12-22 |
BR102013026020A2 (pt) | 2014-10-29 |
EP2720031A2 (en) | 2014-04-16 |
RU2013144945A (ru) | 2015-04-20 |
EP2720031B1 (en) | 2016-12-07 |
US20140098936A1 (en) | 2014-04-10 |
EP2720031A3 (en) | 2014-06-25 |
US9042516B2 (en) | 2015-05-26 |
CN103712998A (zh) | 2014-04-09 |
CN103712998B (zh) | 2017-11-17 |
CA2823296A1 (en) | 2014-04-09 |
RU2632579C2 (ru) | 2017-10-06 |
JP6280339B2 (ja) | 2018-02-14 |
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