JP2014072527A5 - - Google Patents
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- Publication number
- JP2014072527A5 JP2014072527A5 JP2013199324A JP2013199324A JP2014072527A5 JP 2014072527 A5 JP2014072527 A5 JP 2014072527A5 JP 2013199324 A JP2013199324 A JP 2013199324A JP 2013199324 A JP2013199324 A JP 2013199324A JP 2014072527 A5 JP2014072527 A5 JP 2014072527A5
- Authority
- JP
- Japan
- Prior art keywords
- axis
- region
- mold
- donut
- supplying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000005498 polishing Methods 0.000 claims 15
- 238000000034 method Methods 0.000 claims 14
- 235000012489 doughnuts Nutrition 0.000 claims 13
- 238000005520 cutting process Methods 0.000 claims 8
- 239000010985 leather Substances 0.000 claims 7
- 239000000463 material Substances 0.000 claims 5
- 239000013256 coordination polymer Substances 0.000 claims 4
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 230000007547 defect Effects 0.000 claims 2
- 238000003754 machining Methods 0.000 claims 2
- 230000007704 transition Effects 0.000 claims 2
- 239000003082 abrasive agent Substances 0.000 claims 1
- 230000001747 exhibiting effect Effects 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/628,364 | 2012-09-27 | ||
| US13/628,364 US9034063B2 (en) | 2012-09-27 | 2012-09-27 | Method of manufacturing grooved chemical mechanical polishing layers |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014072527A JP2014072527A (ja) | 2014-04-21 |
| JP2014072527A5 true JP2014072527A5 (https=) | 2016-10-27 |
| JP6238664B2 JP6238664B2 (ja) | 2017-11-29 |
Family
ID=50337486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013199324A Active JP6238664B2 (ja) | 2012-09-27 | 2013-09-26 | 溝付き化学機械研磨層の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9034063B2 (https=) |
| JP (1) | JP6238664B2 (https=) |
| KR (1) | KR102085640B1 (https=) |
| CN (1) | CN103692370B (https=) |
| TW (1) | TWI594840B (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10722999B2 (en) * | 2016-06-17 | 2020-07-28 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | High removal rate chemical mechanical polishing pads and methods of making |
| CN111318956A (zh) * | 2018-12-13 | 2020-06-23 | 夏泰鑫半导体(青岛)有限公司 | 聚氨酯研磨垫及其制造方法、及化学机械研磨装置 |
| CN116061102A (zh) * | 2023-02-06 | 2023-05-05 | 上海芯谦集成电路有限公司 | 一种具有沟槽的抛光垫及其制备方法 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2981322B2 (ja) * | 1991-10-28 | 1999-11-22 | 松下電工株式会社 | 天井収納装置 |
| MY114512A (en) * | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
| WO2000059680A1 (en) * | 1999-03-30 | 2000-10-12 | Nikon Corporation | Polishing body, polisher, polishing method, and method for producing semiconductor device |
| GB0008553D0 (en) | 2000-04-06 | 2000-05-24 | Unilever Plc | Process and apparatus for the production of a detergent bar |
| US6641471B1 (en) * | 2000-09-19 | 2003-11-04 | Rodel Holdings, Inc | Polishing pad having an advantageous micro-texture and methods relating thereto |
| KR100877386B1 (ko) | 2001-11-13 | 2009-01-07 | 도요 고무 고교 가부시키가이샤 | 연마 패드 및 그 제조 방법 |
| US7073244B2 (en) | 2002-09-20 | 2006-07-11 | Lear Corporation | Process for machining a flexible foam |
| TW592894B (en) * | 2002-11-19 | 2004-06-21 | Iv Technologies Co Ltd | Method of fabricating a polishing pad |
| US7704125B2 (en) * | 2003-03-24 | 2010-04-27 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
| EP1466699A1 (en) * | 2003-04-09 | 2004-10-13 | JSR Corporation | Abrasive pad, method and metal mold for manufacturing the same, and semiconductor wafer polishing method |
| JP2007081322A (ja) * | 2005-09-16 | 2007-03-29 | Jsr Corp | 化学機械研磨パッドの製造方法 |
| KR20060046093A (ko) * | 2004-05-20 | 2006-05-17 | 제이에스알 가부시끼가이샤 | 화학 기계 연마 패드 및 화학 기계 연마 방법 |
| US7037175B1 (en) * | 2004-10-19 | 2006-05-02 | Cabot Microelectronics Corporation | Method of sharpening cutting edges |
| US7275928B2 (en) * | 2004-11-23 | 2007-10-02 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Apparatus for forming a striation reduced chemical mechanical polishing pad |
| JP3769581B1 (ja) | 2005-05-18 | 2006-04-26 | 東洋ゴム工業株式会社 | 研磨パッドおよびその製造方法 |
| TWI385050B (zh) | 2005-02-18 | 2013-02-11 | Nexplanar Corp | 用於ｃｍｐ之特製拋光墊及其製造方法及其用途 |
| KR20070070094A (ko) * | 2005-12-28 | 2007-07-03 | 제이에스알 가부시끼가이샤 | 화학 기계 연마 패드 및 화학 기계 연마 방법 |
| CN101134303A (zh) * | 2006-08-30 | 2008-03-05 | 力晶半导体股份有限公司 | 抛光垫及其制造方法 |
| US7300340B1 (en) * | 2006-08-30 | 2007-11-27 | Rohm and Haas Electronics Materials CMP Holdings, Inc. | CMP pad having overlaid constant area spiral grooves |
| US7234224B1 (en) * | 2006-11-03 | 2007-06-26 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Curved grooving of polishing pads |
| JP5166172B2 (ja) * | 2008-09-02 | 2013-03-21 | 富士紡ホールディングス株式会社 | 研磨パッドの製造方法 |
| US8585790B2 (en) * | 2009-04-23 | 2013-11-19 | Applied Materials, Inc. | Treatment of polishing pad window |
| TWI426981B (zh) * | 2010-11-23 | 2014-02-21 | Univ Nat Pingtung Sci & Tech | 晶圓研磨盤構造及其製造方法 |
| US8444727B2 (en) * | 2011-08-16 | 2013-05-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of manufacturing chemical mechanical polishing layers |
| US8986585B2 (en) * | 2012-03-22 | 2015-03-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of manufacturing chemical mechanical polishing layers having a window |
| US8709114B2 (en) * | 2012-03-22 | 2014-04-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of manufacturing chemical mechanical polishing layers |
-
2012
- 2012-09-27 US US13/628,364 patent/US9034063B2/en active Active
-
2013
- 2013-09-16 TW TW102133452A patent/TWI594840B/zh active
- 2013-09-26 KR KR1020130114229A patent/KR102085640B1/ko active Active
- 2013-09-26 JP JP2013199324A patent/JP6238664B2/ja active Active
- 2013-09-27 CN CN201310451608.1A patent/CN103692370B/zh active Active
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