JP2013197597A5 - - Google Patents

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Publication number
JP2013197597A5
JP2013197597A5 JP2013058848A JP2013058848A JP2013197597A5 JP 2013197597 A5 JP2013197597 A5 JP 2013197597A5 JP 2013058848 A JP2013058848 A JP 2013058848A JP 2013058848 A JP2013058848 A JP 2013058848A JP 2013197597 A5 JP2013197597 A5 JP 2013197597A5
Authority
JP
Japan
Prior art keywords
mold cavity
axis
donut
region
nozzle opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013058848A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013197597A (ja
JP6091276B2 (ja
Filing date
Publication date
Priority claimed from US13/427,408 external-priority patent/US8986585B2/en
Application filed filed Critical
Publication of JP2013197597A publication Critical patent/JP2013197597A/ja
Publication of JP2013197597A5 publication Critical patent/JP2013197597A5/ja
Application granted granted Critical
Publication of JP6091276B2 publication Critical patent/JP6091276B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013058848A 2012-03-22 2013-03-21 窓を有するケミカルメカニカル研磨層の製造方法 Expired - Fee Related JP6091276B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/427,408 US8986585B2 (en) 2012-03-22 2012-03-22 Method of manufacturing chemical mechanical polishing layers having a window
US13/427,408 2012-03-22

Publications (3)

Publication Number Publication Date
JP2013197597A JP2013197597A (ja) 2013-09-30
JP2013197597A5 true JP2013197597A5 (https=) 2016-04-28
JP6091276B2 JP6091276B2 (ja) 2017-03-08

Family

ID=49112321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013058848A Expired - Fee Related JP6091276B2 (ja) 2012-03-22 2013-03-21 窓を有するケミカルメカニカル研磨層の製造方法

Country Status (7)

Country Link
US (1) US8986585B2 (https=)
JP (1) JP6091276B2 (https=)
KR (1) KR102028208B1 (https=)
CN (1) CN103358226B (https=)
DE (1) DE102013004942A1 (https=)
FR (1) FR2988316B1 (https=)
TW (1) TWI551397B (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9034063B2 (en) * 2012-09-27 2015-05-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing grooved chemical mechanical polishing layers
US9216489B2 (en) * 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
SG11201703114QA (en) 2014-10-17 2017-06-29 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US20180304539A1 (en) 2017-04-21 2018-10-25 Applied Materials, Inc. Energy delivery system with array of energy sources for an additive manufacturing apparatus
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) * 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

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DE1916330A1 (de) 1969-03-29 1970-10-08 Richard Zippel & Co Kg Farbspr Anlage zur Herstellung von grossen oder kompliziert geformten Formteilen aus fluessigen Mehrkomponenten-Kunststoffen
US4158535A (en) 1977-01-25 1979-06-19 Olin Corporation Generation of polyurethane foam
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5762544A (en) * 1995-10-27 1998-06-09 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
US6012971A (en) * 1997-03-14 2000-01-11 Edgecraft Corporation Sharpening apparatus
US6095905A (en) * 1998-07-01 2000-08-01 Molecular Optoelectronics Corporation Polishing fixture and method
GB0008553D0 (en) 2000-04-06 2000-05-24 Unilever Plc Process and apparatus for the production of a detergent bar
JP2002100593A (ja) * 2000-09-21 2002-04-05 Nikon Corp 研磨装置、これを用いた半導体デバイスの製造方法及びこの製造方法により製造された半導体デバイス
TW592894B (en) * 2002-11-19 2004-06-21 Iv Technologies Co Ltd Method of fabricating a polishing pad
TWI220405B (en) * 2002-11-19 2004-08-21 Iv Technologies Co Ltd Method of fabricating a polishing pad having a detection window thereon
TWI385050B (zh) 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
KR20080090496A (ko) * 2006-02-03 2008-10-08 제이에스알 가부시끼가이샤 화학 기계 연마 패드
CN101134303A (zh) * 2006-08-30 2008-03-05 力晶半导体股份有限公司 抛光垫及其制造方法
JP2008238349A (ja) * 2007-03-28 2008-10-09 Toray Ind Inc 研磨パッド用材料のスライス方法
US8585790B2 (en) * 2009-04-23 2013-11-19 Applied Materials, Inc. Treatment of polishing pad window
US8552980B2 (en) 2009-04-30 2013-10-08 Gregory A. Shaver Computer input devices and associated computing devices, software, and methods
TWI396602B (zh) * 2009-12-31 2013-05-21 Iv Technologies Co Ltd 具有偵測窗之研磨墊的製造方法及具有偵測窗之研磨墊
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CN102133734B (zh) * 2010-01-21 2015-02-04 智胜科技股份有限公司 具有侦测窗的研磨垫及其制造方法

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