JP2013211549A5 - - Google Patents
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- Publication number
- JP2013211549A5 JP2013211549A5 JP2013058847A JP2013058847A JP2013211549A5 JP 2013211549 A5 JP2013211549 A5 JP 2013211549A5 JP 2013058847 A JP2013058847 A JP 2013058847A JP 2013058847 A JP2013058847 A JP 2013058847A JP 2013211549 A5 JP2013211549 A5 JP 2013211549A5
- Authority
- JP
- Japan
- Prior art keywords
- mold cavity
- axis
- donut
- region
- nozzle opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/427,383 | 2012-03-22 | ||
| US13/427,383 US8709114B2 (en) | 2012-03-22 | 2012-03-22 | Method of manufacturing chemical mechanical polishing layers |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013211549A JP2013211549A (ja) | 2013-10-10 |
| JP2013211549A5 true JP2013211549A5 (https=) | 2016-04-28 |
| JP6026931B2 JP6026931B2 (ja) | 2016-11-16 |
Family
ID=49112322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013058847A Expired - Fee Related JP6026931B2 (ja) | 2012-03-22 | 2013-03-21 | ケミカルメカニカル研磨層の製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8709114B2 (https=) |
| JP (1) | JP6026931B2 (https=) |
| KR (1) | KR102028207B1 (https=) |
| CN (1) | CN103358238B (https=) |
| DE (1) | DE102013004947A1 (https=) |
| FR (1) | FR2988315B1 (https=) |
| TW (1) | TWI551395B (https=) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9034063B2 (en) * | 2012-09-27 | 2015-05-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of manufacturing grooved chemical mechanical polishing layers |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| SG11201703114QA (en) | 2014-10-17 | 2017-06-29 | Applied Materials Inc | Cmp pad construction with composite material properties using additive manufacturing processes |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| CN104354091B (zh) * | 2014-11-27 | 2017-02-22 | 奚经龙 | 一种用于水钻的抛光滚筒的制造方法 |
| CN104858787B (zh) * | 2015-06-18 | 2017-04-12 | 浙江工商大学 | 一种研磨盘表面自生长的研磨机构 |
| US10092998B2 (en) * | 2015-06-26 | 2018-10-09 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of making composite polishing layer for chemical mechanical polishing pad |
| US10005172B2 (en) * | 2015-06-26 | 2018-06-26 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Controlled-porosity method for forming polishing pad |
| KR20230169424A (ko) | 2015-10-30 | 2023-12-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법 |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| US20180304539A1 (en) | 2017-04-21 | 2018-10-25 | Applied Materials, Inc. | Energy delivery system with array of energy sources for an additive manufacturing apparatus |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
| KR20210042171A (ko) | 2018-09-04 | 2021-04-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 진보한 폴리싱 패드들을 위한 제형들 |
| US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
| US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1916330A1 (de) * | 1969-03-29 | 1970-10-08 | Richard Zippel & Co Kg Farbspr | Anlage zur Herstellung von grossen oder kompliziert geformten Formteilen aus fluessigen Mehrkomponenten-Kunststoffen |
| US4158535A (en) * | 1977-01-25 | 1979-06-19 | Olin Corporation | Generation of polyurethane foam |
| MY114512A (en) * | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
| EP1268134A1 (en) * | 1999-12-14 | 2003-01-02 | Rodel Holdings, Inc. | Method of manufacturing a polymer or polymer composite polishing pad |
| GB0008553D0 (en) | 2000-04-06 | 2000-05-24 | Unilever Plc | Process and apparatus for the production of a detergent bar |
| TWI220405B (en) * | 2002-11-19 | 2004-08-21 | Iv Technologies Co Ltd | Method of fabricating a polishing pad having a detection window thereon |
| TW592894B (en) * | 2002-11-19 | 2004-06-21 | Iv Technologies Co Ltd | Method of fabricating a polishing pad |
| JP2007081322A (ja) * | 2005-09-16 | 2007-03-29 | Jsr Corp | 化学機械研磨パッドの製造方法 |
| TWI385050B (zh) * | 2005-02-18 | 2013-02-11 | Nexplanar Corp | 用於ｃｍｐ之特製拋光墊及其製造方法及其用途 |
| US20110275288A1 (en) * | 2010-05-10 | 2011-11-10 | Chien-Min Sung | Cmp pad dressers with hybridized conditioning and related methods |
| US7226339B2 (en) * | 2005-08-22 | 2007-06-05 | Applied Materials, Inc. | Spectrum based endpointing for chemical mechanical polishing |
| KR20080090496A (ko) * | 2006-02-03 | 2008-10-08 | 제이에스알 가부시끼가이샤 | 화학 기계 연마 패드 |
| CN101134303A (zh) * | 2006-08-30 | 2008-03-05 | 力晶半导体股份有限公司 | 抛光垫及其制造方法 |
| JP2008184597A (ja) * | 2007-01-31 | 2008-08-14 | Kuraray Co Ltd | 研磨パッドの製造方法 |
| US7820005B2 (en) * | 2008-07-18 | 2010-10-26 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Multilayer chemical mechanical polishing pad manufacturing process |
| JP5166172B2 (ja) * | 2008-09-02 | 2013-03-21 | 富士紡ホールディングス株式会社 | 研磨パッドの製造方法 |
| US8552980B2 (en) | 2009-04-30 | 2013-10-08 | Gregory A. Shaver | Computer input devices and associated computing devices, software, and methods |
| US8257544B2 (en) * | 2009-06-10 | 2012-09-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having a low defect integral window |
| TWI404596B (zh) * | 2009-09-22 | 2013-08-11 | San Fang Chemical Industry Co | 製造研磨墊之方法及研磨墊 |
| CN102133734B (zh) * | 2010-01-21 | 2015-02-04 | 智胜科技股份有限公司 | 具有侦测窗的研磨垫及其制造方法 |
| US8444727B2 (en) * | 2011-08-16 | 2013-05-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of manufacturing chemical mechanical polishing layers |
-
2012
- 2012-03-22 US US13/427,383 patent/US8709114B2/en not_active Expired - Fee Related
-
2013
- 2013-03-21 DE DE102013004947A patent/DE102013004947A1/de not_active Withdrawn
- 2013-03-21 TW TW102109982A patent/TWI551395B/zh not_active IP Right Cessation
- 2013-03-21 JP JP2013058847A patent/JP6026931B2/ja not_active Expired - Fee Related
- 2013-03-22 CN CN201310262745.0A patent/CN103358238B/zh not_active Expired - Fee Related
- 2013-03-22 FR FR1352613A patent/FR2988315B1/fr not_active Expired - Fee Related
- 2013-03-22 KR KR1020130030670A patent/KR102028207B1/ko not_active Expired - Fee Related
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