FR2988315B1 - Procede de fabrication de couches de polissage chimico-mecanique - Google Patents
Procede de fabrication de couches de polissage chimico-mecaniqueInfo
- Publication number
- FR2988315B1 FR2988315B1 FR1352613A FR1352613A FR2988315B1 FR 2988315 B1 FR2988315 B1 FR 2988315B1 FR 1352613 A FR1352613 A FR 1352613A FR 1352613 A FR1352613 A FR 1352613A FR 2988315 B1 FR2988315 B1 FR 2988315B1
- Authority
- FR
- France
- Prior art keywords
- polishing layers
- mechanical polishing
- chemical mechanical
- producing chemical
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/12—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
- B24D11/003—Manufacture of flexible abrasive materials without embedded abrasive particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
La présente invention concerne un procédé de fabrication de couches de polissage pour une utilisation dans des tampons de polissage chimico-mécanique, une pluralité de couches de polissage étant dérivée d'une galette, la formation de défauts de densité dans la galette et la rugosité de surface des couches de polissage formées étant minimisées.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/427,383 US8709114B2 (en) | 2012-03-22 | 2012-03-22 | Method of manufacturing chemical mechanical polishing layers |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2988315A1 FR2988315A1 (fr) | 2013-09-27 |
FR2988315B1 true FR2988315B1 (fr) | 2016-06-10 |
Family
ID=49112322
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1352613A Expired - Fee Related FR2988315B1 (fr) | 2012-03-22 | 2013-03-22 | Procede de fabrication de couches de polissage chimico-mecanique |
Country Status (7)
Country | Link |
---|---|
US (1) | US8709114B2 (fr) |
JP (1) | JP6026931B2 (fr) |
KR (1) | KR102028207B1 (fr) |
CN (1) | CN103358238B (fr) |
DE (1) | DE102013004947A1 (fr) |
FR (1) | FR2988315B1 (fr) |
TW (1) | TWI551395B (fr) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9034063B2 (en) * | 2012-09-27 | 2015-05-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of manufacturing grooved chemical mechanical polishing layers |
US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
JP6545261B2 (ja) | 2014-10-17 | 2019-07-17 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 付加製造プロセスを使用する、複合材料特性を有するcmpパッド構造 |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
CN104354091B (zh) * | 2014-11-27 | 2017-02-22 | 奚经龙 | 一种用于水钻的抛光滚筒的制造方法 |
CN104858787B (zh) * | 2015-06-18 | 2017-04-12 | 浙江工商大学 | 一种研磨盘表面自生长的研磨机构 |
US10092998B2 (en) * | 2015-06-26 | 2018-10-09 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of making composite polishing layer for chemical mechanical polishing pad |
US10005172B2 (en) * | 2015-06-26 | 2018-06-26 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Controlled-porosity method for forming polishing pad |
CN108290267B (zh) | 2015-10-30 | 2021-04-20 | 应用材料公司 | 形成具有期望ζ电位的抛光制品的设备与方法 |
US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
US10596763B2 (en) | 2017-04-21 | 2020-03-24 | Applied Materials, Inc. | Additive manufacturing with array of energy sources |
US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
WO2019032286A1 (fr) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | Tampons à polir à distribution abrasive et leurs procédés de fabrication |
CN112654655A (zh) | 2018-09-04 | 2021-04-13 | 应用材料公司 | 先进抛光垫配方 |
US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1916330A1 (de) * | 1969-03-29 | 1970-10-08 | Richard Zippel & Co Kg Farbspr | Anlage zur Herstellung von grossen oder kompliziert geformten Formteilen aus fluessigen Mehrkomponenten-Kunststoffen |
US4158535A (en) * | 1977-01-25 | 1979-06-19 | Olin Corporation | Generation of polyurethane foam |
MY114512A (en) * | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
KR20020072548A (ko) * | 1999-12-14 | 2002-09-16 | 로델 홀딩스 인코포레이티드 | 중합체 연마 패드 또는 중합체 복합재 연마 패드의 제조방법 |
GB0008553D0 (en) | 2000-04-06 | 2000-05-24 | Unilever Plc | Process and apparatus for the production of a detergent bar |
TW592894B (en) * | 2002-11-19 | 2004-06-21 | Iv Technologies Co Ltd | Method of fabricating a polishing pad |
TWI220405B (en) * | 2002-11-19 | 2004-08-21 | Iv Technologies Co Ltd | Method of fabricating a polishing pad having a detection window thereon |
JP2007081322A (ja) * | 2005-09-16 | 2007-03-29 | Jsr Corp | 化学機械研磨パッドの製造方法 |
TWI385050B (zh) * | 2005-02-18 | 2013-02-11 | Nexplanar Corp | 用於cmp之特製拋光墊及其製造方法及其用途 |
US20110275288A1 (en) * | 2010-05-10 | 2011-11-10 | Chien-Min Sung | Cmp pad dressers with hybridized conditioning and related methods |
US7764377B2 (en) * | 2005-08-22 | 2010-07-27 | Applied Materials, Inc. | Spectrum based endpointing for chemical mechanical polishing |
EP1981070A4 (fr) * | 2006-02-03 | 2011-08-17 | Jsr Corp | Bloc de polissage chimico-mecanique |
CN101134303A (zh) * | 2006-08-30 | 2008-03-05 | 力晶半导体股份有限公司 | 抛光垫及其制造方法 |
JP2008184597A (ja) * | 2007-01-31 | 2008-08-14 | Kuraray Co Ltd | 研磨パッドの製造方法 |
US7820005B2 (en) * | 2008-07-18 | 2010-10-26 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Multilayer chemical mechanical polishing pad manufacturing process |
JP5166172B2 (ja) * | 2008-09-02 | 2013-03-21 | 富士紡ホールディングス株式会社 | 研磨パッドの製造方法 |
US8552980B2 (en) | 2009-04-30 | 2013-10-08 | Gregory A. Shaver | Computer input devices and associated computing devices, software, and methods |
US8257544B2 (en) * | 2009-06-10 | 2012-09-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having a low defect integral window |
TWI404596B (zh) * | 2009-09-22 | 2013-08-11 | San Fang Chemical Industry Co | 製造研磨墊之方法及研磨墊 |
CN102133734B (zh) * | 2010-01-21 | 2015-02-04 | 智胜科技股份有限公司 | 具有侦测窗的研磨垫及其制造方法 |
US8444727B2 (en) * | 2011-08-16 | 2013-05-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of manufacturing chemical mechanical polishing layers |
-
2012
- 2012-03-22 US US13/427,383 patent/US8709114B2/en not_active Expired - Fee Related
-
2013
- 2013-03-21 TW TW102109982A patent/TWI551395B/zh not_active IP Right Cessation
- 2013-03-21 JP JP2013058847A patent/JP6026931B2/ja not_active Expired - Fee Related
- 2013-03-21 DE DE102013004947A patent/DE102013004947A1/de not_active Withdrawn
- 2013-03-22 CN CN201310262745.0A patent/CN103358238B/zh not_active Expired - Fee Related
- 2013-03-22 FR FR1352613A patent/FR2988315B1/fr not_active Expired - Fee Related
- 2013-03-22 KR KR1020130030670A patent/KR102028207B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN103358238B (zh) | 2016-02-24 |
DE102013004947A1 (de) | 2013-09-26 |
TWI551395B (zh) | 2016-10-01 |
US20130247476A1 (en) | 2013-09-26 |
KR20130108168A (ko) | 2013-10-02 |
FR2988315A1 (fr) | 2013-09-27 |
KR102028207B1 (ko) | 2019-10-02 |
JP6026931B2 (ja) | 2016-11-16 |
CN103358238A (zh) | 2013-10-23 |
JP2013211549A (ja) | 2013-10-10 |
TW201347908A (zh) | 2013-12-01 |
US8709114B2 (en) | 2014-04-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 3 |
|
PLSC | Publication of the preliminary search report |
Effective date: 20151120 |
|
PLFP | Fee payment |
Year of fee payment: 4 |
|
PLFP | Fee payment |
Year of fee payment: 5 |
|
PLFP | Fee payment |
Year of fee payment: 6 |
|
PLFP | Fee payment |
Year of fee payment: 8 |
|
ST | Notification of lapse |
Effective date: 20211105 |